Chou; Che-Ya
Patent Applications and Registrations
Patent applications and USPTO patent grants for Chou; Che-Ya.The latest application filed is for "semiconductor package using flip-chip technology".
Company Profile
12.25.40
- Chou; Che-Ya - Hsinchu TW
- Chou; Che-Ya - Hsin-Chu TW
- Chou; Che-Ya - Kaohsiung City TW
- Chou; Che-Ya - Kaohsiung TW
Patent Activity
| Patent | Date |
|---|---|
| Semiconductor package with layer structures, antenna layer and electronic component Grant 11,373,957 - Hsu , et al. June 28, 2 | 2022-06-28 |
| Semiconductor package Grant 11,244,913 - Chen , et al. February 8, 2 | 2022-02-08 |
| Semiconductor Package Using Flip-chip Technology App 20210202425 - Chou; Che-Ya ; et al. | 2021-07-01 |
| Semiconductor Device App 20210193540 - Chen; Nan-Cheng ; et al. | 2021-06-24 |
| Semiconductor package using flip-chip technology Grant 10,991,669 - Chou , et al. April 27, 2 | 2021-04-27 |
| Semiconductor Package Having Discrete Antenna Device App 20210036405 - Han; Fu-Yi ; et al. | 2021-02-04 |
| Semiconductor Package App 20200402931 - CHEN; Ying-Chih ; et al. | 2020-12-24 |
| Semiconductor Package App 20200381365 - HSU; Wen-Sung ; et al. | 2020-12-03 |
| Semiconductor package having discrete antenna device Grant 10,847,869 - Han , et al. November 24, 2 | 2020-11-24 |
| Semiconductor package Grant 10,784,206 - Hsu , et al. Sept | 2020-09-22 |
| Semiconductor Package Assembly Having A Conductive Electromagnetic Shield Layer App 20200168572 - Lin; Tzu-Hung ; et al. | 2020-05-28 |
| Semiconductor package structure and method for forming the same Grant 10,636,773 - Kuo , et al. | 2020-04-28 |
| Fan-out package structure having stacked carrier substrates and method for forming the same Grant 10,515,887 - Syu , et al. Dec | 2019-12-24 |
| Semiconductor package assembly with passive device Grant 10,497,678 - Kuo , et al. De | 2019-12-03 |
| Electronic Package For High-data Rate Communication Applications App 20190355697 - Lin; Min-Chen ; et al. | 2019-11-21 |
| Semiconductor package assembly Grant 10,468,341 - Liu , et al. No | 2019-11-05 |
| Semiconductor Package Assembly App 20190131233 - LIU; Nai-Wei ; et al. | 2019-05-02 |
| Semiconductor device and wafer level package including such semiconductor device Grant 10,224,287 - Syu , et al. | 2019-03-05 |
| Semiconductor Package App 20190051609 - HSU; Wen-Sung ; et al. | 2019-02-14 |
| Semiconductor package assembly Grant 10,199,318 - Liu , et al. Fe | 2019-02-05 |
| Semiconductor Package Having Discrete Antenna Device App 20180358685 - Han; Fu-Yi ; et al. | 2018-12-13 |
| Semiconductor package assembly Grant 10,147,674 - Hsieh , et al. De | 2018-12-04 |
| Fan-out package structure Grant 10,128,192 - Lin , et al. November 13, 2 | 2018-11-13 |
| Semiconductor package incorporating redistribution layer interposer Grant 10,103,128 - Chou , et al. October 16, 2 | 2018-10-16 |
| System-in-package and fabrication method thereof Grant 10,074,628 - Liu , et al. September 11, 2 | 2018-09-11 |
| Semiconductor Device App 20180102298 - Chen; Nan-Cheng ; et al. | 2018-04-12 |
| Fan-out Package Structure Having Stacked Carrier Substrates And Method For Forming The Same App 20180082936 - SYU; Shih-Yi ; et al. | 2018-03-22 |
| Pre-bumped Redistribution Layer Structure And Semiconductor Package Incorporating Such Pre-bumped Redistribution Layer Structure App 20180053665 - Kuo; Che-Hung ; et al. | 2018-02-22 |
| Semiconductor Package Assembly With Passive Device App 20180033774 - KUO; Che-Hung ; et al. | 2018-02-01 |
| Fan-out Package Structure App 20180025985 - LIN; Min-Chen ; et al. | 2018-01-25 |
| Semiconductor Package Assembly App 20170338175 - LIU; Nai-Wei ; et al. | 2017-11-23 |
| Semiconductor package assembly with passive device Grant 9,818,727 - Kuo , et al. November 14, 2 | 2017-11-14 |
| Semiconductor Device And Wafer Level Package Including Such Semiconductor Device App 20170271265 - Syu; Shih-Yi ; et al. | 2017-09-21 |
| Semiconductor Package Assembly App 20170271250 - HSIEH; Tung-Hsien ; et al. | 2017-09-21 |
| Semiconductor Package Incorporating Redistribution Layer Interposer App 20170243858 - Chou; Che-Ya ; et al. | 2017-08-24 |
| Semiconductor package assembly Grant 9,704,792 - Hsieh , et al. July 11, 2 | 2017-07-11 |
| Semiconductor device and wafer level package including such semiconductor device Grant 9,704,808 - Syu , et al. July 11, 2 | 2017-07-11 |
| Semiconductor Package Structure And Method For Forming The Same App 20170084589 - KUO; Che-Hung ; et al. | 2017-03-23 |
| Fan-out Package Structure Including Antenna App 20170040266 - LIN; Tzu-Hung ; et al. | 2017-02-09 |
| Semiconductor Package Using Flip-chip Technology App 20160358877 - CHOU; Che-Ya ; et al. | 2016-12-08 |
| Bonding Pad Arrangment Design For Semiconductor Package App 20160307873 - CHEN; Ying-Chih ; et al. | 2016-10-20 |
| System-in-package And Fabrication Method Thereof App 20160293575 - Liu; Hsing-Chih ; et al. | 2016-10-06 |
| Semiconductor Device And Wafer Level Package Including Such Semiconductor Device App 20160276277 - Syu; Shih-Yi ; et al. | 2016-09-22 |
| Semiconductor Package Assembly With Passive Device App 20160268233 - KUO; Che-Hung ; et al. | 2016-09-15 |
| Semiconductor Package Assembly App 20160260659 - HSIEH; Tung-Hsien ; et al. | 2016-09-08 |
| Enhanced flip chip structure using copper column interconnect Grant 9,437,534 - Gregorich , et al. September 6, 2 | 2016-09-06 |
| System-in-package App 20160005726 - Chen; Nan-Cheng ; et al. | 2016-01-07 |
| Fan-out semiconductor package with copper pillar bumps Grant 9,165,877 - Chen , et al. October 20, 2 | 2015-10-20 |
| Enhanced Flip Chip Structure Using Copper Column Interconnect App 20150249060 - Gregorich; Thomas Matthew ; et al. | 2015-09-03 |
| Enhanced flip chip structure using copper column interconnect Grant 9,064,757 - Gregorich , et al. June 23, 2 | 2015-06-23 |
| Fan-out Semiconductor Package With Copper Pillar Bumps App 20150097277 - Chen; Nan-Cheng ; et al. | 2015-04-09 |
| Flip-chip Package App 20140042615 - HUANG; Ching-Liou ; et al. | 2014-02-13 |
| Enhanced Flip Chip Structure Using Copper Column Interconnect App 20130221536 - Gregorich; Thomas Matthew ; et al. | 2013-08-29 |
| Structure of package on package and method for fabricating the same Grant 7,550,836 - Chou , et al. June 23, 2 | 2009-06-23 |
| Packaging substrate and manufacturing method thereof Grant 7,445,944 - Tong , et al. November 4, 2 | 2008-11-04 |
| Packaging substrate and manufacturing method thereof App 20080124836 - Tong; Ho-Ming ; et al. | 2008-05-29 |
| Stacked Chip Package Structure And Fabricating Method Thereof App 20080122059 - Chou; Che-Ya ; et al. | 2008-05-29 |
| Package structure having through hole in spacer thereof App 20080116556 - Chou; Che-Ya ; et al. | 2008-05-22 |
| Structure of package on package and method for fabricating the same App 20080099904 - Chou; Che-Ya ; et al. | 2008-05-01 |
| Packaging substrate and method of manufacturing the same App 20080044931 - Tong; Ho-Ming ; et al. | 2008-02-21 |
| Contact sensor package Grant 7,193,282 - Weng , et al. March 20, 2 | 2007-03-20 |
| Contact sensor package App 20050168906 - Weng, Gwo-Liang ; et al. | 2005-08-04 |
| Chip assembly package App 20050139997 - Chou, Che-Ya | 2005-06-30 |
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