Chopin; Sheila F.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Chopin; Sheila F..The latest application filed is for "conduit inserts for encapsulant compound formulation kneading and encapsulation back-end assembly processes".
- Chopin; Sheila F. - Austin TX
- Chopin; Sheila F. - Round Rock TX US
| Patent | Date |
|---|---|
| Conduit Inserts For Encapsulant Compound Formulation Kneading And Encapsulation Back-end Assembly Processes App 20220250301 - Chopin; Sheila F. ; et al. | 2022-08-11 |
| Semiconductor device attached to an exposed pad Grant 10,217,713 - Chopin , et al. Feb | 2019-02-26 |
| Semiconductor structure with sacrificial anode and method for forming Grant 10,199,339 - Chopin , et al. Fe | 2019-02-05 |
| Semiconductor Device Attached To An Exposed Pad App 20170098618 - CHOPIN; Sheila F. ; et al. | 2017-04-06 |
| Semiconductor Structure With Sacrificial Anode and Method for Forming App 20160329288 - CHOPIN; SHEILA F. ; et al. | 2016-11-10 |
| System and method for lead frame package degating Grant 9,426,884 - Chopin , et al. August 23, 2 | 2016-08-23 |
| Semiconductor Device Attached To An Exposed Pad App 20160071787 - CHOPIN; SHEILA F. ; et al. | 2016-03-10 |
| Semiconductor device Grant 9,111,952 - Higgins, III , et al. August 18, 2 | 2015-08-18 |
| Encapsulant for a semiconductor device Grant 9,093,383 - Chopin , et al. July 28, 2 | 2015-07-28 |
| Mold compound compatibility test system and methods thereof Grant 8,955,388 - Mathew , et al. February 17, 2 | 2015-02-17 |
| System And Method For Lead Frame Package Degating App 20150027767 - Chopin; Sheila F. ; et al. | 2015-01-29 |
| Semiconductor Structure With Sacrificial Anode And Method For Forming App 20140346663 - Chopin; Sheila F. ; et al. | 2014-11-27 |
| Encapsulant for a semiconductor device Grant 8,853,867 - Chopin , et al. October 7, 2 | 2014-10-07 |
| Semiconductor Device App 20140273352 - Higgins, III; Leo M. ; et al. | 2014-09-18 |
| Heat spreader for use within a packaged semiconductor device Grant 8,836,110 - Chopin , et al. September 16, 2 | 2014-09-16 |
| Encapsulant For A Semiconductor Device App 20140145339 - CHOPIN; Sheila F. ; et al. | 2014-05-29 |
| Heat Spreader For Use Within A Packaged Semiconductor Device App 20140061894 - Chopin; Sheila F. ; et al. | 2014-03-06 |
| Mold Compound Compatibility Test System And Methods Thereof App 20130319129 - Mathew; Varughese ; et al. | 2013-12-05 |
| Mram Device And Method Of Assembling Same App 20120193737 - Pang; Xingshou ; et al. | 2012-08-02 |
| Warpage control using a package carrier assembly Grant 7,803,662 - Yuan , et al. September 28, 2 | 2010-09-28 |
| Warpage Control Using A Package Carrier Assembly App 20090081831 - Yuan; Yuan ; et al. | 2009-03-26 |
| Solderable metal finish for integrated circuit package leads and method for forming Grant 7,215,014 - Su , et al. May 8, 2 | 2007-05-08 |
| Packaged integrated circuit having a heat spreader and method therefor App 20070031996 - Chopin; Sheila F. ; et al. | 2007-02-08 |
| Warpage control of array packaging Grant 7,172,927 - Yuan , et al. February 6, 2 | 2007-02-06 |
| Packaged integrated circuit having wire bonds and method therefor Grant 7,015,585 - Downey , et al. March 21, 2 | 2006-03-21 |
| Inductive device including bond wires Grant 6,998,952 - Zhou , et al. February 14, 2 | 2006-02-14 |
| Solderable metal finish for integrated circuit package leads and method for forming App 20060022313 - Su; Peng ; et al. | 2006-02-02 |
| Warpage control of array packaging App 20050136567 - Yuan, Yuan ; et al. | 2005-06-23 |
| Packaged integrated circuit having wire bonds and method therefor App 20040119168 - Downey, Susan H. ; et al. | 2004-06-24 |
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