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Choong; Lien Wah Patent Filings

Choong; Lien Wah

Patent Applications and Registrations

Patent applications and USPTO patent grants for Choong; Lien Wah.The latest application filed is for "semiconductor mold compound transfer system and associated methods".

Company Profile
2.3.3
  • Choong; Lien Wah - Singapore SG
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Semiconductor mold compound transfer system and associated methods
Grant 10,658,256 - Koh , et al.
2020-05-19
Semiconductor Mold Compound Transfer System And Associated Methods
App 20190157172 - Koh; Kean Tat ;   et al.
2019-05-23
Semiconductor Mold Compound Transfer System And Associated Methods
App 20190043773 - Koh; Kean Tat ;   et al.
2019-02-07
Semiconductor mold compound transfer system and associated methods
Grant 10,199,299 - Koh , et al. Fe
2019-02-05
Method and apparatus for distributing mold material in a mold for packaging microelectronic devices
Grant 6,656,769 - Lee , et al. December 2, 2
2003-12-02
Method and apparatus for distributing mold material in a mold for packaging microelectronic devices
App 20020072153 - Lee, Kian Chai ;   et al.
2002-06-13

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