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Patent applications and USPTO patent grants for Choong; Lien Wah.The latest application filed is for "semiconductor mold compound transfer system and associated methods".
Patent | Date |
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Semiconductor mold compound transfer system and associated methods Grant 10,658,256 - Koh , et al. | 2020-05-19 |
Semiconductor Mold Compound Transfer System And Associated Methods App 20190157172 - Koh; Kean Tat ;   et al. | 2019-05-23 |
Semiconductor Mold Compound Transfer System And Associated Methods App 20190043773 - Koh; Kean Tat ;   et al. | 2019-02-07 |
Semiconductor mold compound transfer system and associated methods Grant 10,199,299 - Koh , et al. Fe | 2019-02-05 |
Method and apparatus for distributing mold material in a mold for packaging microelectronic devices Grant 6,656,769 - Lee , et al. December 2, 2 | 2003-12-02 |
Method and apparatus for distributing mold material in a mold for packaging microelectronic devices App 20020072153 - Lee, Kian Chai ;   et al. | 2002-06-13 |
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