Chong; Myung-Gun

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chong; Myung-Gun.The latest application filed is for "manufacturing method for printed circuit board".

Company Profile

2.12.14

Chong; Myung-Gun - Suwon-si KR
CHONG; Myung Gun - Gyunggi-do KR
Chong; Myung Gun - Gyeongsangnam-do N/A KR
Chong; Myung Gun - Changwon-si KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Manufacturing method for printed circuit board Grant 10,893,613 - Kim , et al. January 12, 2	2021-01-12
Manufacturing Method For Printed Circuit Board App 20180153043 - KIM; Jong-Guk ; et al.	2018-05-31
Printed Circuit Board Including Electromagnetic Bandgap Structure App 20140191907 - CHO; Won Woo ; et al.	2014-07-10
Printed circuit board including electromagnetic bandgap structure Grant 8,711,055 - Cho , et al. April 29, 2	2014-04-29
Metallic laminate and manufacturing method of light emitting diode package using the same Grant 8,568,861 - Chong , et al. October 29, 2	2013-10-29
Metalic Laminate And Manufacturing Method Of Light Emitting Diode Package Using The Same App 20130183479 - CHONG; Myung Gun ; et al.	2013-07-18
Metallic laminate and manufacturing method of light emitting diode package using the same Grant 8,481,171 - Chong , et al. July 9, 2	2013-07-09
Printed Circuit Board and Method Of Manufacturing The Same App 20130139383 - Choi; Kye Won ; et al.	2013-06-06
Method of manufacturing an embedded printed circuit board Grant 8,418,356 - Park , et al. April 16, 2	2013-04-16
Electromagnetic bandgap structure and printed circuit board having the same Grant 8,399,777 - Cho , et al. March 19, 2	2013-03-19
Electromagnetic bandgap structure and printed circuit board having the same Grant 8,330,048 - Cho , et al. December 11, 2	2012-12-11
Printed Circuit Board Adn Method Of Manufacturing The Same App 20110266038 - CHOI; Kye Won ; et al.	2011-11-03
Light emitting device package and method for manufacturing the same App 20110101406 - Heo; Cheol Ho ; et al.	2011-05-05
Printed Circuit Board Including Electromagnetic Bandgap Structure App 20100328178 - Cho; Won Woo ; et al.	2010-12-30
Printed Circuit Board App 20100319980 - KIM; Hyung Ho ; et al.	2010-12-23
Metallic Laminate And Manufacturing Method Of Light Emitting Diode Package Using The Same App 20100304162 - CHONG; Myung Gun ; et al.	2010-12-02
Electromagnetic Bandgap Structure And Printed Circuit Board Having The Same App 20100252320 - CHO; Won Woo ; et al.	2010-10-07
Electromagnetic Bandgap Structure And Printed Circuit Board Having The Same App 20100252319 - CHO; Won Woo ; et al.	2010-10-07
Printed circuit board and manufacturing method thereof Grant 7,665,206 - Park , et al. February 23, 2	2010-02-23
Embedded printed circuit board and manufacturing method thereof App 20090242251 - Park; Kwang Soo ; et al.	2009-10-01
Printed circuit board and manufacturing method thereof App 20080264687 - Park; Kwang-Soo ; et al.	2008-10-30

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