Chong; Fu Chiung

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chong; Fu Chiung.The latest application filed is for "method and apparatus for producing controlled stresses and stress gradients in sputtered films".

Company Profile

0.25.30

Chong; Fu Chiung - Saratoga CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Structures and processes for fabrication of probe card assemblies with multi-layer interconnect Grant 8,575,954 - Chong , et al. November 5, 2	2013-11-05
Method and Apparatus for Producing Controlled Stresses and Stress Gradients in Sputtered Films App 20130186746 - Giauque; Pierre H. ; et al.	2013-07-25
Construction Structures and Manufacturing Processes for Integrated Circuit Wafer Probe Card Assemblies App 20120212248 - Chong; Fu Chiung ; et al.	2012-08-23
Construction Structures And Manufacturing Processes For Integrated Circuit Wafer Probe Card Assemblies App 20120023730 - CHONG; Fu Chiung ; et al.	2012-02-02
Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies Grant 7,952,373 - Mok , et al. May 31, 2	2011-05-31
High density interconnect system having rapid fabrication cycle Grant 7,884,634 - Chong , et al. February 8, 2	2011-02-08
High density interconnect system having rapid fabrication cycle Grant 7,872,482 - Chong , et al. January 18, 2	2011-01-18
High density interconnect system for IC packages and interconnect assemblies Grant 7,812,626 - Bottoms , et al. October 12, 2	2010-10-12
Structures and Processes for Fabrication of Probe Card Assemblies with Multi-Layer Interconnect App 20100244867 - Chong; Fu Chiung ; et al.	2010-09-30
Massively parallel interface for electronic circuit Grant 7,772,860 - Chong , et al. August 10, 2	2010-08-10
High Density Interconnect System For Ic Packages And Interconnect Assemblies App 20100066393 - Bottoms; W. R. ; et al.	2010-03-18
Construction Structures and Manufacturing Processes for Integrated Circuit Wafer Probe Card Assemblies App 20100026331 - Chong; Fu Chiung ; et al.	2010-02-04
Systems for testing and packaging integrated circuits Grant 7,621,761 - Mok , et al. November 24, 2	2009-11-24
High density interconnect system for IC packages and interconnect assemblies Grant 7,579,848 - Bottoms , et al. August 25, 2	2009-08-25
High Density Interconnect System Having Rapid Fabrication Cycle App 20090153165 - Chong; Fu Chiung ; et al.	2009-06-18
Method and Apparatus for Producing Controlled Stresses and Stress Gradients in Sputtered Films App 20090090617 - Giauque; Pierre H. ; et al.	2009-04-09
Massively Parallel Interface For Electronic Circuit App 20080297186 - Chong; Fu Chiung ; et al.	2008-12-04
High Density Interconnect System Having Rapid Fabrication Cycle App 20080246500 - CHONG; Fu Chiung ; et al.	2008-10-09
Massively parallel interface for electronic circuit Grant 7,403,029 - Chong , et al. July 22, 2	2008-07-22
High density interconnect system having rapid fabrication cycle Grant 7,382,142 - Chong , et al. June 3, 2	2008-06-03
Systems For Testing And Packaging Integrated Circuits App 20080090429 - Mok; Sammy ; et al.	2008-04-17
Enhanced compliant probe card systems having improved planarity Grant 7,349,223 - Haemer , et al. March 25, 2	2008-03-25
Fine Pitch Microfabricated Spring Contact Structure & Method App 20070245553 - CHONG; Fu Chiung ; et al.	2007-10-25
Enhanced stress metal spring contactor Grant 7,247,035 - Mok , et al. July 24, 2	2007-07-24
Miniaturized Contact Spring App 20070144841 - Chong; Fu Chiung ; et al.	2007-06-28
Massively Parallel Interface For Electronic Circuit App 20070057684 - CHONG; Fu Chiung ; et al.	2007-03-15
Construction Structures and Manufacturing Processes for Integrated Circuit Wafer Probe Card Assemblies App 20070046304 - Mok; Sammy ; et al.	2007-03-01
Miniaturized contact spring Grant 7,137,830 - Lahiri , et al. November 21, 2	2006-11-21
Massively parallel interface for electronic circuit Grant 7,138,818 - Chong , et al. November 21, 2	2006-11-21
Systems for testing and packaging integrated circuits App 20060240690 - Mok; Sammy ; et al.	2006-10-26
Miniaturized contact spring Grant 7,126,220 - Lahiri , et al. October 24, 2	2006-10-24
Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies Grant 7,126,358 - Mok , et al. October 24, 2	2006-10-24
High density interconnect system for IC packages and interconnect assemblies App 20060186906 - Bottoms; W. R. ; et al.	2006-08-24
Massively parallel interface for electronic circuit Grant 7,009,412 - Chong , et al. March 7, 2	2006-03-07
High density interconnect system having rapid fabrication cycle App 20050275418 - Chong, Fu Chiung ; et al.	2005-12-15
Construction structures and manufacturing processes for probe card assemblies and packages having wafer level springs Grant 6,917,525 - Mok , et al. July 12, 2	2005-07-12
Standardized layout patterns and routing structures for integrated circuit wafer probe card assemblies App 20050068054 - Mok, Sammy ; et al.	2005-03-31
Massively parallel interface for electronic circuit App 20050051353 - Chong, Fu Chiung ; et al.	2005-03-10
Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies App 20050042932 - Mok, Sammy ; et al.	2005-02-24
Systems for testing and packaging integrated circuits App 20050026476 - Mok, Sammy ; et al.	2005-02-03
Enhanced compliant probe card systems having improved planarity App 20040223309 - Haemer, Joseph Michael ; et al.	2004-11-11
Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies Grant 6,815,961 - Mok , et al. November 9, 2	2004-11-09
Massively parallel interface for electronic circuits Grant 6,812,718 - Chong , et al. November 2, 2	2004-11-02
Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies Grant 6,799,976 - Mok , et al. October 5, 2	2004-10-05
Systems for testing and packaging integrated circuits Grant 6,791,171 - Mok , et al. September 14, 2	2004-09-14
Mosaic decal probe App 20040075455 - Mok, Sammy ; et al.	2004-04-22
Mosaic decal probe Grant 6,710,609 - Mok , et al. March 23, 2	2004-03-23
Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies App 20040022042 - Mok, Sammy ; et al.	2004-02-05
Mosaic Decal Probe App 20040008045 - Mok, Sammy ; et al.	2004-01-15
Miniaturized contact spring App 20030218244 - Lahiri, Syamal Kumar ; et al.	2003-11-27
Miniaturized contact spring App 20030214045 - Lahiri, Syamal Kumar ; et al.	2003-11-20
Construction structures and manufacturing processes for probe card assemblies and packages having wafer level springs App 20030099097 - Mok, Sammy ; et al.	2003-05-29
Systems for testing and packaging integrated circuits App 20020171133 - Mok, Sammy ; et al.	2002-11-21
Programmable high-density electronic device testing Grant 5,973,504 - Chong October 26, 1	1999-10-26

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