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Patent applications and USPTO patent grants for Chong; Desmond Yok Rue.The latest application filed is for "chip scale package and method of assembling the same".
Patent | Date |
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Chip Scale Package and Method of Assembling the Same App 20080290509 - Tan; Hien Boon ;   et al. | 2008-11-27 |
Molded high density electronic packaging structure for high performance applications Grant 7,361,995 - Goh , et al. April 22, 2 | 2008-04-22 |
Molded high density electronic packaging structure for high performance applications App 20060087033 - Goh; Kim Yong ;   et al. | 2006-04-27 |
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