| Patent | Date |
|---|
Power semiconductor package and method for fabricating a power semiconductor package
Grant 11,211,356 - Lim , et al. December 28, 2 | 2021-12-28 |
Semiconductor Device Having A Contact Clip With A Contact Region Having A Convex Shape And Method For Fabricating Thereof
App 20210358877 - Bemmerl; Thomas ; et al. | 2021-11-18 |
Semiconductor device and method for fabricating a semiconductor device
Grant 11,088,105 - Bemmerl , et al. August 10, 2 | 2021-08-10 |
Power Semiconductor Package and Method for Fabricating a Power Semiconductor Package
App 20210057375 - Lim; Wee Aun Jason ; et al. | 2021-02-25 |
SMD package with flat contacts to prevent bottleneck
Grant 10,699,987 - Otremba , et al. | 2020-06-30 |
Semiconductor Device and Method for Fabricating a Semiconductor Device
App 20200168575 - Bemmerl; Thomas ; et al. | 2020-05-28 |
Method of Manufacturing a Multi-Chip Semiconductor Power Device
App 20200083207 - Otremba; Ralf ; et al. | 2020-03-12 |
Semiconductor chip package having a repeating footprint pattern
Grant 10,204,845 - Otremba , et al. Feb | 2019-02-12 |
Semiconductor package for multiphase circuitry device
Grant 10,147,703 - Macheiner , et al. De | 2018-12-04 |
SMD Package
App 20180301398 - Otremba; Ralf ; et al. | 2018-10-18 |
Semiconductor Package For Multiphase Circuitry Device
App 20180277513 - Macheiner; Stefan ; et al. | 2018-09-27 |
Semiconductor chip package having contact pins at short side edges
Grant 10,037,934 - Otremba , et al. July 31, 2 | 2018-07-31 |
Leadframe and method of manufacturing the same
App 20180158758 - OTREMBA; Ralf ; et al. | 2018-06-07 |
Semiconductor Chip Package Having a Repeating Footprint Pattern
App 20180061745 - Otremba; Ralf ; et al. | 2018-03-01 |
Transistor arrangement with semiconductor chips between two substrates
Grant 9,806,029 - Otremba , et al. October 31, 2 | 2017-10-31 |
Method of Manufacturing a Multi-Chip Semiconductor Power Device
App 20170047315 - Otremba; Ralf ; et al. | 2017-02-16 |
Multi-chip semiconductor power device
Grant 9,515,060 - Otremba , et al. December 6, 2 | 2016-12-06 |
Semiconductor Chip Package Having Contact Pins at Short Side Edges
App 20160233149 - Otremba; Ralf ; et al. | 2016-08-11 |
Electronic component
Grant 9,368,435 - Otremba , et al. June 14, 2 | 2016-06-14 |
Electronic Component
App 20160086876 - Otremba; Ralf ; et al. | 2016-03-24 |
Leadframe and method of manufacturing the same
App 20160056092 - OTREMBA; Ralf ; et al. | 2016-02-25 |
Multi-level semiconductor package
Grant 9,041,170 - Otremba , et al. May 26, 2 | 2015-05-26 |
Transistor arrangement with semiconductor chips between two substrates
App 20150092375 - Otremba; Ralf ; et al. | 2015-04-02 |
Semiconductor device using diffusion soldering
Grant 8,975,117 - Otremba , et al. March 10, 2 | 2015-03-10 |
Chip arrangements, a chip package and a method for manufacturing a chip arrangement
Grant 8,853,835 - Otremba , et al. October 7, 2 | 2014-10-07 |
Multi-Level Semiconductor Package
App 20140291849 - Otremba; Ralf ; et al. | 2014-10-02 |
Multi-Chip Semiconductor Power Device
App 20140284777 - Otremba; Ralf ; et al. | 2014-09-25 |
Multi-chip semiconductor packages and assembly thereof
Grant 8,836,101 - Chong , et al. September 16, 2 | 2014-09-16 |
Chip Arrangements, A Chip Package And A Method For Manufacturing A Chip Arrangement
App 20140097528 - Otremba; Ralf ; et al. | 2014-04-10 |
Semiconductor Device Using Diffusion Soldering
App 20130200532 - Otremba; Ralf ; et al. | 2013-08-08 |
Multi-chip Semiconductor Packages and Assembly Thereof
App 20120074546 - Chong; Chooi Mei ; et al. | 2012-03-29 |
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