loadpatents
name:-0.081809043884277
name:-0.078896999359131
name:-0.0054309368133545
Chong; Chin Hui Patent Filings

Chong; Chin Hui

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chong; Chin Hui.The latest application filed is for "systems and methods for reducing the size of a semiconductor assembly".

Company Profile
5.82.74
  • Chong; Chin Hui - Singapore SG
  • Chong; Chin-Hui - Braddell Hill SG
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Systems And Methods For Reducing The Size Of A Semiconductor Assembly
App 20220208744 - Ng; Hong Wan ;   et al.
2022-06-30
Build-up package for integrated circuit devices, and methods of making same
Grant 11,367,667 - Ng , et al. June 21, 2
2022-06-21
Integrated Circuit Wire Bonded To A Multi-layer Substrate Having An Open Area That Exposes Wire Bond Pads At A Surface Of The Inner Layer
App 20220181307 - Boo; Kelvin Tam Aik ;   et al.
2022-06-09
Integrated circuit wire bonded to a multi-layer substrate having an open area that exposes wire bond pads at a surface of the inner layer
Grant 11,282,811 - Boo , et al. March 22, 2
2022-03-22
Surface Mount Device Bonded To An Inner Layer Of A Multi-layer Substrate
App 20220078915 - Boo; Kelvin Tan Aik ;   et al.
2022-03-10
Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices
Grant 11,239,128 - Ye , et al. February 1, 2
2022-02-01
Pre-encapsulated lead frames for microelectronic device packages, and associated methods
Grant 11,189,548 - Wang , et al. November 30, 2
2021-11-30
Integrated Circuit Wire Bonded To A Multi-layer Substrate Having An Open Area That Exposes Wire Bond Pads At A Surface Of The Inner Layer
App 20210358888 - Boo; Kelvin Tan Aik ;   et al.
2021-11-18
Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices
Grant 10,861,824 - Ye , et al. December 8, 2
2020-12-08
Novel Build-up Package For Integrated Circuit Devices, And Methods Of Making Same
App 20200286801 - Ng; Hong Wan ;   et al.
2020-09-10
Build-up package for integrated circuit devices, and methods of making same
Grant 10,593,607 - Ng , et al.
2020-03-17
Microelectronic Devices, Stacked Microelectronic Devices, And Methods For Manufacturing Microelectronic Devices
App 20190371693 - Ye; Seng Kim Dalson ;   et al.
2019-12-05
Electronic device assemblies including conductive vias having two or more conductive elements
Grant 10,448,509 - Corisis , et al. Oc
2019-10-15
Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices
Grant 10,431,513 - Ye , et al. O
2019-10-01
Microelectronic Device Packages, Stacked Microelectronic Device Packages, And Methods For Manufacturing Microelectronic Devices
App 20190096857 - Ye; Seng Kim Dalson ;   et al.
2019-03-28
Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices
Grant 10,211,114 - Corisis , et al. Feb
2019-02-19
Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices
Grant 10,153,254 - Ye , et al. Dec
2018-12-11
Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
Grant 10,008,468 - Lee , et al. June 26, 2
2018-06-26
Microelectronic Devices, Stacked Microelectronic Devices, And Methods For Manufacturing Such Devices
App 20180005909 - Corisis; David J. ;   et al.
2018-01-04
Microelectronic Devices, Stacked Microelectronic Devices, And Methods For Manufacturing Microelectronic Devices
App 20170301598 - Ye; Seng Kim Dalson ;   et al.
2017-10-19
Pre-encapsulated Lead Frames For Microelectronic Device Packages, And Associated Methods
App 20170288177 - Wang; Ai Chie ;   et al.
2017-10-05
Carrierless Chip Package For Integrated Circuit Devices, And Methods Of Making Same
App 20170271228 - Corisis; David J. ;   et al.
2017-09-21
Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices
Grant 9,768,121 - Corisis , et al. September 19, 2
2017-09-19
Pre-encapsulated lead frames for microelectronic device packages, and associated methods
Grant 9,721,874 - Wang , et al. August 1, 2
2017-08-01
Microelectronic Device Packages, Stacked Microelectronic Device Packages, And Methods For Manufacturing Microelectronic Devices
App 20170141085 - Ye; Seng Kim Dalson ;   et al.
2017-05-18
Packaged Microelectronic Devices And Methods For Manufacturing Packaged Microelectronic Devices
App 20170103961 - Lee; Choon Kuan ;   et al.
2017-04-13
Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices
Grant 9,583,476 - Ye , et al. February 28, 2
2017-02-28
Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
Grant 9,530,748 - Lee , et al. December 27, 2
2016-12-27
Microelectronic Devices, Stacked Microelectronic Devices, And Methods For Manufacturing Such Devices
App 20160358831 - Corisis; David J. ;   et al.
2016-12-08
Novel Build-up Package For Integrated Circuit Devices, And Methods Of Making Same
App 20160247737 - Ng; Hong Wan ;   et al.
2016-08-25
Microelectronic Device Packages, Stacked Microelectronic Device Packages, And Methods For Manufacturing Microelectronic Devices
App 20160172349 - Ye; Seng Kim Dalson ;   et al.
2016-06-16
Stacked packaged integrated circuit devices, and methods of making same
Grant 9,362,260 - Corisis , et al. June 7, 2
2016-06-07
Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices
Grant 9,362,141 - Corisis , et al. June 7, 2
2016-06-07
Land grid array semiconductor device packages
Grant 9,355,992 - Kuan , et al. May 31, 2
2016-05-31
Build-up package for integrated circuit devices, and methods of making same
Grant 9,355,994 - Ng , et al. May 31, 2
2016-05-31
Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices
Grant 9,299,684 - Ye , et al. March 29, 2
2016-03-29
Semiconductor assemblies with multi-level substrates and associated methods of manufacturing
Grant 9,271,403 - Chong , et al. February 23, 2
2016-02-23
Electronic Device Assemblies Including Conductive Vias Having Two Or More Conductive Elements
App 20150319860 - Corisis; David J. ;   et al.
2015-11-05
Methods of making an interposer structure with embedded capacitor structure
Grant 9,142,427 - Chong , et al. September 22, 2
2015-09-22
Electronic device assemblies including conductive vias having two or more conductive elements
Grant 9,084,360 - Corisis , et al. July 14, 2
2015-07-14
Stacked Packaged Integrated Circuit Devices, And Methods Of Making Same
App 20150171061 - Corisis; David J. ;   et al.
2015-06-18
Microelectronic Devices, Stacked Microelectronic Devices, And Methods For Manufacturing Microelectronic Devices
App 20150137364 - Ye; Seng Kim Dalson ;   et al.
2015-05-21
Packaged Microelectronic Devices And Methods For Manufacturing Packaged Microelectronic Devices
App 20150130081 - Lee; Choon Kuan ;   et al.
2015-05-14
Packaged microelectronic devices recessed in support member cavities, and associated methods
Grant 8,975,745 - Corisis , et al. March 10, 2
2015-03-10
Stacked packaged integrated circuit devices, and methods of making same
Grant 8,963,302 - Corisis , et al. February 24, 2
2015-02-24
Microelectronic Packages With Leadframes, Including Leadframes Configured For Stacked Die Packages, And Associated Systems And Methods
App 20150041204 - Chong; Chin Hui ;   et al.
2015-02-12
Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
Grant 8,940,581 - Lee , et al. January 27, 2
2015-01-27
Land Grid Array Semiconductor Device Packages
App 20140342476 - Kuan; Lee Choon ;   et al.
2014-11-20
Methods for making microelectronic die systems
Grant 8,869,387 - Chong , et al. October 28, 2
2014-10-28
Novel Build-up Package For Integrated Circuit Devices, And Methods Of Making Same
App 20140295622 - Ng; Hong Wan ;   et al.
2014-10-02
Stacked microelectronic devices
Grant 8,823,159 - Ye , et al. September 2, 2
2014-09-02
Land grid array semiconductor device packages
Grant 8,796,836 - Lee , et al. August 5, 2
2014-08-05
Methods for packaging microelectronic devices and microelectronic devices formed using such methods
Grant 8,772,947 - Lee , et al. July 8, 2
2014-07-08
Build-up package for integrated circuit devices, and methods of making same
Grant 8,754,537 - Ng , et al. June 17, 2
2014-06-17
Methods Of Making An Interposer Structure With Embedded Capacitor Structure
App 20140162412 - Chong; Chin Hui ;   et al.
2014-06-12
Semiconductor Assemblies With Multi-level Substrates And Associated Methods Of Manufacturing
App 20140141572 - Chong; Chin Hui ;   et al.
2014-05-22
Semiconductor assemblies with multi-level substrates and associated methods of manufacturing
Grant 8,637,987 - Chong , et al. January 28, 2
2014-01-28
Microelectronic Device Packages, Stacked Microelectronic Device Packages, And Methods For Manufacturing Microelectronic Devices
App 20130341805 - Ye; Seng Kim Dalson ;   et al.
2013-12-26
Microelectronic Devices, Stacked Microelectronic Devices, And Methods For Manufacturing Microelectronic Devices
App 20130292853 - Ye; Seng Kim Dalson ;   et al.
2013-11-07
Stacked Packaged Integrated Circuit Devices, And Methods Of Making Same
App 20130256853 - Corisis; David J. ;   et al.
2013-10-03
Microelectronic Devices, Stacked Microelectronic Devices, And Methods For Manufacturing Such Devices
App 20130252354 - Corisis; David J. ;   et al.
2013-09-26
Packaged Microelectronic Devices Recessed In Support Member Cavities, And Associated Methods
App 20130249092 - Corisis; David J. ;   et al.
2013-09-26
Electronic Device Assemblies Including Conductive Vias Having Two Or More Conductive Elements
App 20130235517 - Corisis; David J. ;   et al.
2013-09-12
Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices
Grant 8,519,523 - Ye , et al. August 27, 2
2013-08-27
Method for manufacturing microelectronic devices
Grant 8,507,318 - Ye , et al. August 13, 2
2013-08-13
Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices
Grant 8,450,839 - Corisis , et al. May 28, 2
2013-05-28
Pre-encapsulated Lead Frames For Microelectronic Device Packages, And Associated Methods
App 20130127027 - Wang; Ai Chie ;   et al.
2013-05-23
Stacked packaged integrated circuit devices
Grant 8,445,997 - Corisis , et al. May 21, 2
2013-05-21
Packaged microelectronic devices recessed in support member cavities, and associated methods
Grant 8,441,132 - Corisis , et al. May 14, 2
2013-05-14
Electronic device assemblies including conductive vias having two or more conductive elements
Grant 8,426,743 - Corisis , et al. April 23, 2
2013-04-23
Semiconductor Assemblies With Multi-level Substrates And Associated Methods Of Manufacturing
App 20130037949 - Chong; Chin Hui ;   et al.
2013-02-14
Pre-encapsulated lead frames for microelectronic device packages, and associated methods
Grant 8,357,566 - Wang , et al. January 22, 2
2013-01-22
Method of manufacturing an interposer
Grant 8,322,031 - Chong , et al. December 4, 2
2012-12-04
Methods For Packaging Microelectronic Devices And Microelectronic Devices Formed Using Such Methods
App 20120248626 - Lee; Choon Kuan ;   et al.
2012-10-04
Packaged Microelectronic Devices And Methods For Manufacturing Packaged Microelectronic Devices
App 20120187567 - Lee; Choon Kuan ;   et al.
2012-07-26
Packaged IC device comprising an embedded flex circuit on leadframe, and methods of making same
Grant 8,217,505 - Lee , et al. July 10, 2
2012-07-10
Methods for packaging microelectronic devices and microelectronic devices formed using such methods
Grant 8,203,213 - Lee , et al. June 19, 2
2012-06-19
Packaged microelectronic devices recessed in support member cavities, and associated methods
Grant 8,202,754 - Corisis , et al. June 19, 2
2012-06-19
Packaged Microelectronic Devices Recessed In Support Member Cavities, And Associated Methods
App 20120146239 - Corisis; David J. ;   et al.
2012-06-14
Stacked Packaged Integrated Circuit Devices, And Methods Of Making Same
App 20120127685 - Corisis; David J. ;   et al.
2012-05-24
Packaged microelectronic devices and associated systems
Grant 8,148,807 - Lee , et al. April 3, 2
2012-04-03
Apparatus for packaging semiconductor devices, packaged semiconductor components, methods of manufacturing apparatus for packaging semiconductor devices, and methods of manufacturing semiconductor components
Grant 8,138,021 - Corisis , et al. March 20, 2
2012-03-20
Interposer substrates and semiconductor device assemblies and electronic systems including such interposer substrates
Grant 8,115,112 - Corisis , et al. February 14, 2
2012-02-14
Methods of forming stacked semiconductor devices with a leadframe and associated assemblies
Grant 8,106,491 - Corisis , et al. January 31, 2
2012-01-31
Microelectronic Device Packages, Stacked Microelectronic Device Packages, And Methods For Manufacturing Microelectronic Devices
App 20120018887 - Ye; Seng Kim Dalson ;   et al.
2012-01-26
Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices
Grant 8,030,748 - Ye , et al. October 4, 2
2011-10-04
Board-on-chip type substrates with conductive traces in multiple planes and semiconductor device packages including such substrates
Grant 8,030,751 - Lee , et al. October 4, 2
2011-10-04
Interconnecting substrates for microelectronic dies, methods for forming vias in such substrates, and methods for packaging microelectronic devices
Grant 7,915,726 - Chong , et al. March 29, 2
2011-03-29
Methods of making metal core foldover package structures
Grant 7,915,077 - Corisis , et al. March 29, 2
2011-03-29
Semiconductor device assemblies and systems including at least one conductive pathway extending around a side of at least one semiconductor device
Grant 7,888,185 - Corisis , et al. February 15, 2
2011-02-15
Electronic Device Assemblies Including Conductive Vias Having Two Or More Conductive Elements
App 20100284140 - Corisis; David J. ;   et al.
2010-11-11
Methods For Packaging Microelectronic Devices And Microelectronic Devices Formed Using Such Methods
App 20100276814 - Lee; Choon Kuan ;   et al.
2010-11-04
Apparatus For Packaging Semiconductor Devices, Packaged Semiconductor Components, Methods Of Manufacturing Apparatus For Packaging Semiconductor Devices, And Methods Of Manufacturing Semiconductor Components
App 20100279466 - Corisis; David J. ;   et al.
2010-11-04
Packaged Microelectronic Devices And Methods For Manufacturing Packaged Microelectronic Devices
App 20100244272 - Lee; Choon Kuan ;   et al.
2010-09-30
Electronic devices including conductive vias having two or more conductive elements for providing electrical communication between traces in different planes in a substrate, and accompanying methods
Grant 7,767,913 - Corisis , et al. August 3, 2
2010-08-03
Novel Build-up Package For Integrated Circuit Devices, And Methods Of Making Same
App 20100187668 - Ng; Hong Wan ;   et al.
2010-07-29
Methods for packaging microelectronic devices and microelectronic devices formed using such methods
Grant 7,759,221 - Lee , et al. July 20, 2
2010-07-20
Apparatus for packaging semiconductor devices, packaged semiconductor components, methods of manufacturing apparatus for packaging semiconductor devices, and methods of manufacturing semiconductor components
Grant 7,759,785 - Corisis , et al. July 20, 2
2010-07-20
Microelectronic Packages With Leadframes, Including Leadframes Configured For Stacked Die Packages, And Associated Systems And Methods
App 20100173454 - Chong; Chin Hui ;   et al.
2010-07-08
Stacked microelectronic devices and methods for manufacturing microelectronic devices
Grant 7,749,808 - Corisis , et al. July 6, 2
2010-07-06
Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
Grant 7,745,920 - Lee , et al. June 29, 2
2010-06-29
Microelectronic Devices, Stacked Microelectronic Devices, And Methods For Manufacturing Such Devices
App 20100117212 - Corisis; David J. ;   et al.
2010-05-13
Microelectronic packages with leadframes, including leadframes configured for stacked die packages, and associated systems and methods
Grant 7,692,931 - Chong , et al. April 6, 2
2010-04-06
Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices
Grant 7,671,459 - Corisis , et al. March 2, 2
2010-03-02
Packaged Microelectronic Devices And Methods For Manufacturing Packaged Microelectronic Devices
App 20090302484 - Lee; Choon Kuan ;   et al.
2009-12-10
Microelectronic Devices, Stacked Microelectronic Devices, And Methods For Manufacturing Microelectronic Devices
App 20090239337 - Ye; Seng Kim Dalson ;   et al.
2009-09-24
Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices
Grant 7,557,443 - Ye , et al. July 7, 2
2009-07-07
Microelectronic Device Packages, Stacked Microelectronic Device Packages, And Methods For Manufacturing Microelectronic Devices
App 20090127689 - Ye; Seng Kim Dalson ;   et al.
2009-05-21
Stackable Integrated Circuit Package
App 20090091009 - Corisis; David J. ;   et al.
2009-04-09
Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices
Grant 7,504,284 - Ye , et al. March 17, 2
2009-03-17
Stacked microelectronic devices and methods for manufacturing microelectronic devices
Grant 7,485,969 - Corisis , et al. February 3, 2
2009-02-03
Slanted Vias For Electrical Circuits On Circuit Boards And Other Substrates
App 20090008144 - Chong; Chin Hui ;   et al.
2009-01-08
Metal Core Foldover Package Structures
App 20080316728 - Corisis; David J. ;   et al.
2008-12-25
Methods of fabrication of lead frame-based semiconductor device packages incorporating at least one land grid array package
Grant 7,465,607 - Corisis , et al. December 16, 2
2008-12-16
Metal Core Foldover Package Structures
App 20080299709 - Corisis; David J. ;   et al.
2008-12-04
Stacked Packaged Integrated Circuit Devices, And Methods Of Making Same
App 20080283977 - Corisis; David J. ;   et al.
2008-11-20
Slanted vias for electrical circuits on circuit boards and other substrates
Grant 7,435,913 - Chong , et al. October 14, 2
2008-10-14
Apparatus For Packaging Semiconductor Devices, Packaged Semiconductor Components, Methods Of Manufacturing Apparatus For Packaging Semiconductor Devices, And Methods Of Manufacturing Semiconductor Components
App 20080224298 - Corisis; David J. ;   et al.
2008-09-18
Metal core foldover package structures
Grant 7,425,758 - Corisis , et al. September 16, 2
2008-09-16
Semiconductor device assemblies and systems including at least one conductive pathway extending around a side of at least one semiconductor device and methods for forming the same
App 20080122113 - Corisis; David J. ;   et al.
2008-05-29
Interconnecting Substrates For Microelectronic Dies, Methods For Forming Vias In Such Substrates, And Methods For Packaging Microelectronic Devices
App 20080099931 - Chong; Chin Hui ;   et al.
2008-05-01
Metal core foldover package structures, systems including same and methods of fabrication
App 20080048309 - Corisis; David J. ;   et al.
2008-02-28
Pre-encapsulated lead frames for microelectronic device packages, and associated methods
App 20080048301 - Wang; Ai-Chie ;   et al.
2008-02-28
Interconnecting substrates for microelectronic dies, methods for forming vias in such substrates, and methods for packaging microelectronic devices
Grant 7,326,591 - Chong , et al. February 5, 2
2008-02-05
Microelectronic packages with leadframes, including leadframes configured for stacked die packages, and associated systems and methods
App 20080012110 - Chong; Chin Hui ;   et al.
2008-01-17
Lead frame-based semiconductor device packages incorporating at least one land grid array package
Grant 7,291,900 - Corisis , et al. November 6, 2
2007-11-06
Packaged microelectronic devices recessed in support member cavities, and associated methods
App 20070228577 - Corisis; David J. ;   et al.
2007-10-04
Microelectronic device assemblies including assemblies with recurved leadframes, and associated methods
App 20070210441 - Corisis; David J. ;   et al.
2007-09-13
Conductive vias having two or more conductive elements for providing electrical communication between traces in different planes in a substrate, semiconductor device assemblies including such vias, and accompanying methods
App 20070194431 - Corisis; David J. ;   et al.
2007-08-23
Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices
App 20070181989 - Corisis; David J. ;   et al.
2007-08-09
Methods of fabrication of lead frame-based semiconductor device packages incorporating at least one land grid array package
App 20070166880 - Corisis; David J. ;   et al.
2007-07-19
Methods for packaging microelectronic devices and microelectronic devices formed using such methods
App 20070155048 - Lee; Choon Kuan ;   et al.
2007-07-05
Interconnecting substrates for microelectronic dies, methods for forming vias in such substrates, and methods for packaging microelectronic devices
App 20070045834 - Chong; Chin Hui ;   et al.
2007-03-01
Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices
App 20070045803 - Ye; Seng Kim Dalson ;   et al.
2007-03-01
Lead frame-based semiconductor device packages incorporating at least one land grid array package and methods of fabrication
App 20070045784 - Corisis; David J. ;   et al.
2007-03-01
Land grid array semiconductor device packages, assemblies including same, and methods of fabrication
App 20070045818 - Kuan; Lee Choon ;   et al.
2007-03-01
Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices
App 20070045796 - Ye; Seng Kim Dalson ;   et al.
2007-03-01
Slanted vias for electrical circuits on circuit boards and other substrates
App 20060240687 - Chong; Chin Hui ;   et al.
2006-10-26
Slanted vias for electrical circuits on circuit boards and other substrates
Grant 7,083,425 - Chong , et al. August 1, 2
2006-08-01
Slanted vias for electrical circuits on circuit boards and other substrates
App 20060046537 - Chong; Chin Hui ;   et al.
2006-03-02

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