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Integrated Circuit Wire Bonded To A Multi-layer Substrate Having An Open Area That Exposes Wire Bond Pads At A Surface Of The Inner Layer App 20210358888 - Boo; Kelvin Tan Aik ;   et al. | 2021-11-18 |
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Novel Build-up Package For Integrated Circuit Devices, And Methods Of Making Same App 20200286801 - Ng; Hong Wan ;   et al. | 2020-09-10 |
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Microelectronic Devices, Stacked Microelectronic Devices, And Methods For Manufacturing Microelectronic Devices App 20190371693 - Ye; Seng Kim Dalson ;   et al. | 2019-12-05 |
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Microelectronic Device Packages, Stacked Microelectronic Device Packages, And Methods For Manufacturing Microelectronic Devices App 20190096857 - Ye; Seng Kim Dalson ;   et al. | 2019-03-28 |
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Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices Grant 10,153,254 - Ye , et al. Dec | 2018-12-11 |
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Microelectronic Devices, Stacked Microelectronic Devices, And Methods For Manufacturing Such Devices App 20180005909 - Corisis; David J. ;   et al. | 2018-01-04 |
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Pre-encapsulated Lead Frames For Microelectronic Device Packages, And Associated Methods App 20170288177 - Wang; Ai Chie ;   et al. | 2017-10-05 |
Carrierless Chip Package For Integrated Circuit Devices, And Methods Of Making Same App 20170271228 - Corisis; David J. ;   et al. | 2017-09-21 |
Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices Grant 9,768,121 - Corisis , et al. September 19, 2 | 2017-09-19 |
Pre-encapsulated lead frames for microelectronic device packages, and associated methods Grant 9,721,874 - Wang , et al. August 1, 2 | 2017-08-01 |
Microelectronic Device Packages, Stacked Microelectronic Device Packages, And Methods For Manufacturing Microelectronic Devices App 20170141085 - Ye; Seng Kim Dalson ;   et al. | 2017-05-18 |
Packaged Microelectronic Devices And Methods For Manufacturing Packaged Microelectronic Devices App 20170103961 - Lee; Choon Kuan ;   et al. | 2017-04-13 |
Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices Grant 9,583,476 - Ye , et al. February 28, 2 | 2017-02-28 |
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Microelectronic Devices, Stacked Microelectronic Devices, And Methods For Manufacturing Such Devices App 20160358831 - Corisis; David J. ;   et al. | 2016-12-08 |
Novel Build-up Package For Integrated Circuit Devices, And Methods Of Making Same App 20160247737 - Ng; Hong Wan ;   et al. | 2016-08-25 |
Microelectronic Device Packages, Stacked Microelectronic Device Packages, And Methods For Manufacturing Microelectronic Devices App 20160172349 - Ye; Seng Kim Dalson ;   et al. | 2016-06-16 |
Stacked packaged integrated circuit devices, and methods of making same Grant 9,362,260 - Corisis , et al. June 7, 2 | 2016-06-07 |
Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices Grant 9,362,141 - Corisis , et al. June 7, 2 | 2016-06-07 |
Land grid array semiconductor device packages Grant 9,355,992 - Kuan , et al. May 31, 2 | 2016-05-31 |
Build-up package for integrated circuit devices, and methods of making same Grant 9,355,994 - Ng , et al. May 31, 2 | 2016-05-31 |
Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices Grant 9,299,684 - Ye , et al. March 29, 2 | 2016-03-29 |
Semiconductor assemblies with multi-level substrates and associated methods of manufacturing Grant 9,271,403 - Chong , et al. February 23, 2 | 2016-02-23 |
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Methods of making an interposer structure with embedded capacitor structure Grant 9,142,427 - Chong , et al. September 22, 2 | 2015-09-22 |
Electronic device assemblies including conductive vias having two or more conductive elements Grant 9,084,360 - Corisis , et al. July 14, 2 | 2015-07-14 |
Stacked Packaged Integrated Circuit Devices, And Methods Of Making Same App 20150171061 - Corisis; David J. ;   et al. | 2015-06-18 |
Microelectronic Devices, Stacked Microelectronic Devices, And Methods For Manufacturing Microelectronic Devices App 20150137364 - Ye; Seng Kim Dalson ;   et al. | 2015-05-21 |
Packaged Microelectronic Devices And Methods For Manufacturing Packaged Microelectronic Devices App 20150130081 - Lee; Choon Kuan ;   et al. | 2015-05-14 |
Packaged microelectronic devices recessed in support member cavities, and associated methods Grant 8,975,745 - Corisis , et al. March 10, 2 | 2015-03-10 |
Stacked packaged integrated circuit devices, and methods of making same Grant 8,963,302 - Corisis , et al. February 24, 2 | 2015-02-24 |
Microelectronic Packages With Leadframes, Including Leadframes Configured For Stacked Die Packages, And Associated Systems And Methods App 20150041204 - Chong; Chin Hui ;   et al. | 2015-02-12 |
Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices Grant 8,940,581 - Lee , et al. January 27, 2 | 2015-01-27 |
Land Grid Array Semiconductor Device Packages App 20140342476 - Kuan; Lee Choon ;   et al. | 2014-11-20 |
Methods for making microelectronic die systems Grant 8,869,387 - Chong , et al. October 28, 2 | 2014-10-28 |
Novel Build-up Package For Integrated Circuit Devices, And Methods Of Making Same App 20140295622 - Ng; Hong Wan ;   et al. | 2014-10-02 |
Stacked microelectronic devices Grant 8,823,159 - Ye , et al. September 2, 2 | 2014-09-02 |
Land grid array semiconductor device packages Grant 8,796,836 - Lee , et al. August 5, 2 | 2014-08-05 |
Methods for packaging microelectronic devices and microelectronic devices formed using such methods Grant 8,772,947 - Lee , et al. July 8, 2 | 2014-07-08 |
Build-up package for integrated circuit devices, and methods of making same Grant 8,754,537 - Ng , et al. June 17, 2 | 2014-06-17 |
Methods Of Making An Interposer Structure With Embedded Capacitor Structure App 20140162412 - Chong; Chin Hui ;   et al. | 2014-06-12 |
Semiconductor Assemblies With Multi-level Substrates And Associated Methods Of Manufacturing App 20140141572 - Chong; Chin Hui ;   et al. | 2014-05-22 |
Semiconductor assemblies with multi-level substrates and associated methods of manufacturing Grant 8,637,987 - Chong , et al. January 28, 2 | 2014-01-28 |
Microelectronic Device Packages, Stacked Microelectronic Device Packages, And Methods For Manufacturing Microelectronic Devices App 20130341805 - Ye; Seng Kim Dalson ;   et al. | 2013-12-26 |
Microelectronic Devices, Stacked Microelectronic Devices, And Methods For Manufacturing Microelectronic Devices App 20130292853 - Ye; Seng Kim Dalson ;   et al. | 2013-11-07 |
Stacked Packaged Integrated Circuit Devices, And Methods Of Making Same App 20130256853 - Corisis; David J. ;   et al. | 2013-10-03 |
Microelectronic Devices, Stacked Microelectronic Devices, And Methods For Manufacturing Such Devices App 20130252354 - Corisis; David J. ;   et al. | 2013-09-26 |
Packaged Microelectronic Devices Recessed In Support Member Cavities, And Associated Methods App 20130249092 - Corisis; David J. ;   et al. | 2013-09-26 |
Electronic Device Assemblies Including Conductive Vias Having Two Or More Conductive Elements App 20130235517 - Corisis; David J. ;   et al. | 2013-09-12 |
Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices Grant 8,519,523 - Ye , et al. August 27, 2 | 2013-08-27 |
Method for manufacturing microelectronic devices Grant 8,507,318 - Ye , et al. August 13, 2 | 2013-08-13 |
Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices Grant 8,450,839 - Corisis , et al. May 28, 2 | 2013-05-28 |
Pre-encapsulated Lead Frames For Microelectronic Device Packages, And Associated Methods App 20130127027 - Wang; Ai Chie ;   et al. | 2013-05-23 |
Stacked packaged integrated circuit devices Grant 8,445,997 - Corisis , et al. May 21, 2 | 2013-05-21 |
Packaged microelectronic devices recessed in support member cavities, and associated methods Grant 8,441,132 - Corisis , et al. May 14, 2 | 2013-05-14 |
Electronic device assemblies including conductive vias having two or more conductive elements Grant 8,426,743 - Corisis , et al. April 23, 2 | 2013-04-23 |
Semiconductor Assemblies With Multi-level Substrates And Associated Methods Of Manufacturing App 20130037949 - Chong; Chin Hui ;   et al. | 2013-02-14 |
Pre-encapsulated lead frames for microelectronic device packages, and associated methods Grant 8,357,566 - Wang , et al. January 22, 2 | 2013-01-22 |
Method of manufacturing an interposer Grant 8,322,031 - Chong , et al. December 4, 2 | 2012-12-04 |
Methods For Packaging Microelectronic Devices And Microelectronic Devices Formed Using Such Methods App 20120248626 - Lee; Choon Kuan ;   et al. | 2012-10-04 |
Packaged Microelectronic Devices And Methods For Manufacturing Packaged Microelectronic Devices App 20120187567 - Lee; Choon Kuan ;   et al. | 2012-07-26 |
Packaged IC device comprising an embedded flex circuit on leadframe, and methods of making same Grant 8,217,505 - Lee , et al. July 10, 2 | 2012-07-10 |
Methods for packaging microelectronic devices and microelectronic devices formed using such methods Grant 8,203,213 - Lee , et al. June 19, 2 | 2012-06-19 |
Packaged microelectronic devices recessed in support member cavities, and associated methods Grant 8,202,754 - Corisis , et al. June 19, 2 | 2012-06-19 |
Packaged Microelectronic Devices Recessed In Support Member Cavities, And Associated Methods App 20120146239 - Corisis; David J. ;   et al. | 2012-06-14 |
Stacked Packaged Integrated Circuit Devices, And Methods Of Making Same App 20120127685 - Corisis; David J. ;   et al. | 2012-05-24 |
Packaged microelectronic devices and associated systems Grant 8,148,807 - Lee , et al. April 3, 2 | 2012-04-03 |
Apparatus for packaging semiconductor devices, packaged semiconductor components, methods of manufacturing apparatus for packaging semiconductor devices, and methods of manufacturing semiconductor components Grant 8,138,021 - Corisis , et al. March 20, 2 | 2012-03-20 |
Interposer substrates and semiconductor device assemblies and electronic systems including such interposer substrates Grant 8,115,112 - Corisis , et al. February 14, 2 | 2012-02-14 |
Methods of forming stacked semiconductor devices with a leadframe and associated assemblies Grant 8,106,491 - Corisis , et al. January 31, 2 | 2012-01-31 |
Microelectronic Device Packages, Stacked Microelectronic Device Packages, And Methods For Manufacturing Microelectronic Devices App 20120018887 - Ye; Seng Kim Dalson ;   et al. | 2012-01-26 |
Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices Grant 8,030,748 - Ye , et al. October 4, 2 | 2011-10-04 |
Board-on-chip type substrates with conductive traces in multiple planes and semiconductor device packages including such substrates Grant 8,030,751 - Lee , et al. October 4, 2 | 2011-10-04 |
Interconnecting substrates for microelectronic dies, methods for forming vias in such substrates, and methods for packaging microelectronic devices Grant 7,915,726 - Chong , et al. March 29, 2 | 2011-03-29 |
Methods of making metal core foldover package structures Grant 7,915,077 - Corisis , et al. March 29, 2 | 2011-03-29 |
Semiconductor device assemblies and systems including at least one conductive pathway extending around a side of at least one semiconductor device Grant 7,888,185 - Corisis , et al. February 15, 2 | 2011-02-15 |
Electronic Device Assemblies Including Conductive Vias Having Two Or More Conductive Elements App 20100284140 - Corisis; David J. ;   et al. | 2010-11-11 |
Methods For Packaging Microelectronic Devices And Microelectronic Devices Formed Using Such Methods App 20100276814 - Lee; Choon Kuan ;   et al. | 2010-11-04 |
Apparatus For Packaging Semiconductor Devices, Packaged Semiconductor Components, Methods Of Manufacturing Apparatus For Packaging Semiconductor Devices, And Methods Of Manufacturing Semiconductor Components App 20100279466 - Corisis; David J. ;   et al. | 2010-11-04 |
Packaged Microelectronic Devices And Methods For Manufacturing Packaged Microelectronic Devices App 20100244272 - Lee; Choon Kuan ;   et al. | 2010-09-30 |
Electronic devices including conductive vias having two or more conductive elements for providing electrical communication between traces in different planes in a substrate, and accompanying methods Grant 7,767,913 - Corisis , et al. August 3, 2 | 2010-08-03 |
Novel Build-up Package For Integrated Circuit Devices, And Methods Of Making Same App 20100187668 - Ng; Hong Wan ;   et al. | 2010-07-29 |
Methods for packaging microelectronic devices and microelectronic devices formed using such methods Grant 7,759,221 - Lee , et al. July 20, 2 | 2010-07-20 |
Apparatus for packaging semiconductor devices, packaged semiconductor components, methods of manufacturing apparatus for packaging semiconductor devices, and methods of manufacturing semiconductor components Grant 7,759,785 - Corisis , et al. July 20, 2 | 2010-07-20 |
Microelectronic Packages With Leadframes, Including Leadframes Configured For Stacked Die Packages, And Associated Systems And Methods App 20100173454 - Chong; Chin Hui ;   et al. | 2010-07-08 |
Stacked microelectronic devices and methods for manufacturing microelectronic devices Grant 7,749,808 - Corisis , et al. July 6, 2 | 2010-07-06 |
Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices Grant 7,745,920 - Lee , et al. June 29, 2 | 2010-06-29 |
Microelectronic Devices, Stacked Microelectronic Devices, And Methods For Manufacturing Such Devices App 20100117212 - Corisis; David J. ;   et al. | 2010-05-13 |
Microelectronic packages with leadframes, including leadframes configured for stacked die packages, and associated systems and methods Grant 7,692,931 - Chong , et al. April 6, 2 | 2010-04-06 |
Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices Grant 7,671,459 - Corisis , et al. March 2, 2 | 2010-03-02 |
Packaged Microelectronic Devices And Methods For Manufacturing Packaged Microelectronic Devices App 20090302484 - Lee; Choon Kuan ;   et al. | 2009-12-10 |
Microelectronic Devices, Stacked Microelectronic Devices, And Methods For Manufacturing Microelectronic Devices App 20090239337 - Ye; Seng Kim Dalson ;   et al. | 2009-09-24 |
Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices Grant 7,557,443 - Ye , et al. July 7, 2 | 2009-07-07 |
Microelectronic Device Packages, Stacked Microelectronic Device Packages, And Methods For Manufacturing Microelectronic Devices App 20090127689 - Ye; Seng Kim Dalson ;   et al. | 2009-05-21 |
Stackable Integrated Circuit Package App 20090091009 - Corisis; David J. ;   et al. | 2009-04-09 |
Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices Grant 7,504,284 - Ye , et al. March 17, 2 | 2009-03-17 |
Stacked microelectronic devices and methods for manufacturing microelectronic devices Grant 7,485,969 - Corisis , et al. February 3, 2 | 2009-02-03 |
Slanted Vias For Electrical Circuits On Circuit Boards And Other Substrates App 20090008144 - Chong; Chin Hui ;   et al. | 2009-01-08 |
Metal Core Foldover Package Structures App 20080316728 - Corisis; David J. ;   et al. | 2008-12-25 |
Methods of fabrication of lead frame-based semiconductor device packages incorporating at least one land grid array package Grant 7,465,607 - Corisis , et al. December 16, 2 | 2008-12-16 |
Metal Core Foldover Package Structures App 20080299709 - Corisis; David J. ;   et al. | 2008-12-04 |
Stacked Packaged Integrated Circuit Devices, And Methods Of Making Same App 20080283977 - Corisis; David J. ;   et al. | 2008-11-20 |
Slanted vias for electrical circuits on circuit boards and other substrates Grant 7,435,913 - Chong , et al. October 14, 2 | 2008-10-14 |
Apparatus For Packaging Semiconductor Devices, Packaged Semiconductor Components, Methods Of Manufacturing Apparatus For Packaging Semiconductor Devices, And Methods Of Manufacturing Semiconductor Components App 20080224298 - Corisis; David J. ;   et al. | 2008-09-18 |
Metal core foldover package structures Grant 7,425,758 - Corisis , et al. September 16, 2 | 2008-09-16 |
Semiconductor device assemblies and systems including at least one conductive pathway extending around a side of at least one semiconductor device and methods for forming the same App 20080122113 - Corisis; David J. ;   et al. | 2008-05-29 |
Interconnecting Substrates For Microelectronic Dies, Methods For Forming Vias In Such Substrates, And Methods For Packaging Microelectronic Devices App 20080099931 - Chong; Chin Hui ;   et al. | 2008-05-01 |
Metal core foldover package structures, systems including same and methods of fabrication App 20080048309 - Corisis; David J. ;   et al. | 2008-02-28 |
Pre-encapsulated lead frames for microelectronic device packages, and associated methods App 20080048301 - Wang; Ai-Chie ;   et al. | 2008-02-28 |
Interconnecting substrates for microelectronic dies, methods for forming vias in such substrates, and methods for packaging microelectronic devices Grant 7,326,591 - Chong , et al. February 5, 2 | 2008-02-05 |
Microelectronic packages with leadframes, including leadframes configured for stacked die packages, and associated systems and methods App 20080012110 - Chong; Chin Hui ;   et al. | 2008-01-17 |
Lead frame-based semiconductor device packages incorporating at least one land grid array package Grant 7,291,900 - Corisis , et al. November 6, 2 | 2007-11-06 |
Packaged microelectronic devices recessed in support member cavities, and associated methods App 20070228577 - Corisis; David J. ;   et al. | 2007-10-04 |
Microelectronic device assemblies including assemblies with recurved leadframes, and associated methods App 20070210441 - Corisis; David J. ;   et al. | 2007-09-13 |
Conductive vias having two or more conductive elements for providing electrical communication between traces in different planes in a substrate, semiconductor device assemblies including such vias, and accompanying methods App 20070194431 - Corisis; David J. ;   et al. | 2007-08-23 |
Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices App 20070181989 - Corisis; David J. ;   et al. | 2007-08-09 |
Methods of fabrication of lead frame-based semiconductor device packages incorporating at least one land grid array package App 20070166880 - Corisis; David J. ;   et al. | 2007-07-19 |
Methods for packaging microelectronic devices and microelectronic devices formed using such methods App 20070155048 - Lee; Choon Kuan ;   et al. | 2007-07-05 |
Interconnecting substrates for microelectronic dies, methods for forming vias in such substrates, and methods for packaging microelectronic devices App 20070045834 - Chong; Chin Hui ;   et al. | 2007-03-01 |
Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices App 20070045803 - Ye; Seng Kim Dalson ;   et al. | 2007-03-01 |
Lead frame-based semiconductor device packages incorporating at least one land grid array package and methods of fabrication App 20070045784 - Corisis; David J. ;   et al. | 2007-03-01 |
Land grid array semiconductor device packages, assemblies including same, and methods of fabrication App 20070045818 - Kuan; Lee Choon ;   et al. | 2007-03-01 |
Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices App 20070045796 - Ye; Seng Kim Dalson ;   et al. | 2007-03-01 |
Slanted vias for electrical circuits on circuit boards and other substrates App 20060240687 - Chong; Chin Hui ;   et al. | 2006-10-26 |
Slanted vias for electrical circuits on circuit boards and other substrates Grant 7,083,425 - Chong , et al. August 1, 2 | 2006-08-01 |
Slanted vias for electrical circuits on circuit boards and other substrates App 20060046537 - Chong; Chin Hui ;   et al. | 2006-03-02 |