Chong; Chi Ming
Patent Applications and Registrations
Patent applications and USPTO patent grants for Chong; Chi Ming.The latest application filed is for "die bonder and a method of cleaning a bond collet".
- Chong; Chi Ming - Kwai Chung HK
- Chong; Chi Ming - Hong Kong N/A CN
- Chong; Chi Ming - Carado Garden HK
- Chong, Chi Ming - New Territories HK
| Patent | Date |
|---|---|
| Die bonder and a method of cleaning a bond collet Grant 9,318,362 - Leung , et al. April 19, 2 | 2016-04-19 |
| Die Bonder And A Method Of Cleaning A Bond Collet App 20150187617 - LEUNG; Mei Po ; et al. | 2015-07-02 |
| Apparatus and method for determining an alignment of a bondhead of a die bonder relative to a workchuck Grant 8,875,979 - Yung , et al. November 4, 2 | 2014-11-04 |
| Apparatus And Method For Determining An Alignment Of A Bondhead Of A Die Bonder Relative To A Workchuck App 20130292454 - YUNG; Chung Sheung ; et al. | 2013-11-07 |
| Universal die detachment apparatus Grant 8,470,130 - Chong , et al. June 25, 2 | 2013-06-25 |
| Apparatus for aligning a bonding tool of a die bonder Grant 8,387,851 - Yung , et al. March 5, 2 | 2013-03-05 |
| Device for thin die detachment and pick-up Grant 8,141,612 - Chan , et al. March 27, 2 | 2012-03-27 |
| Control and monitoring system for thin die detachment and pick-up Grant 8,092,645 - Yip , et al. January 10, 2 | 2012-01-10 |
| Apparatus and method for thin die detachment Grant 8,026,126 - Cheung , et al. September 27, 2 | 2011-09-27 |
| Control And Monitoring System For Thin Die Detachment And Pick-up App 20110192547 - YIP; Siu Ping ; et al. | 2011-08-11 |
| Universal Die Detachment Apparatus App 20110088845 - CHONG; Chi Ming ; et al. | 2011-04-21 |
| Device For Thin Die Detachment And Pick-up App 20100252205 - CHAN; Man Wai ; et al. | 2010-10-07 |
| Apparatus for semiconductor chip detachment Grant 7,240,422 - Cheung , et al. July 10, 2 | 2007-07-10 |
| Pick and place assembly for transporting a film of material Grant 7,182,118 - Cheung , et al. February 27, 2 | 2007-02-27 |
| Peeling device for chip detachment App 20050274457 - Cheung, Yiu Ming ; et al. | 2005-12-15 |
| Apparatus and method for semicondutor chip detachment App 20050255673 - Cheung, Yiu Ming ; et al. | 2005-11-17 |
| Apparatus and method for indexing and severing film App 20050034577 - Au, Yuk Cheung ; et al. | 2005-02-17 |
| Pick and place assembly for transporting a film of material App 20040238112 - Cheung, Yiu Ming ; et al. | 2004-12-02 |
| Apparatus and method for thin die detachment App 20040115904 - Cheung, Yiu Ming ; et al. | 2004-06-17 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.
| 