Chong; Chee Chiew
Patent Applications and Registrations
Patent applications and USPTO patent grants for Chong; Chee Chiew.The latest application filed is for "topside-cooled semiconductor package with molded standoff".
- Chong; Chee Chiew - Batu Caves MY
| Patent | Date |
|---|---|
| Topside-cooled semiconductor package with molded standoff Grant 11,239,127 - Myers , et al. February 1, 2 | 2022-02-01 |
| Topside-cooled Semiconductor Package With Molded Standoff App 20210398867 - MYERS; Edward ; et al. | 2021-12-23 |
| Semiconductor Package And Method For Fabricating The Same App 20210313294 - Chiang; Chau Fatt ; et al. | 2021-10-07 |
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