Cholewczynski; Kenneth
Patent Applications and Registrations
Patent applications and USPTO patent grants for Cholewczynski; Kenneth.The latest application filed is for "low temperature method for forming solder bump interconnections to a plated circuit trace".
- Cholewczynski; Kenneth - Streamwood IL
| Patent | Date |
|---|---|
| Low temperature method for forming solder bump interconnections to a plated circuit trace Grant 5,269,453 - Melton , et al. December 14, 1 | 1993-12-14 |
| Method for forming solder bump interconnections to a solder-plated circuit trace Grant 5,186,383 - Melton , et al. February 16, 1 | 1993-02-16 |
| Electrical component package comprising polymer-reinforced solder bump interconnection Grant 5,120,678 - Moore , et al. June 9, 1 | 1992-06-09 |
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