name:-0.026717901229858
name:-0.010149002075195
name:-0.0027098655700684
Choi; Yunseok Patent Filings

Choi; Yunseok

Patent Applications and Registrations

Patent applications and USPTO patent grants for Choi; Yunseok.The latest application filed is for "semiconductor package having stiffening structure".

Company Profile
3.10.27
  • Choi; Yunseok - Seoul KR
  • Choi; Yunseok - Suwon-si KR
  • CHOI; Yunseok - Hwaseong-si KR
  • Choi; YunSeok - Hwasung-si N/A KR
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Trademarks
Patent Activity
PatentDate
Image encoder, image decoder, and image processing method
Grant 11,405,623 - Lee , et al. August 2, 2
2022-08-02
Apparatus and method for managing uplink control channels in wireless communication system
Grant 11,395,323 - Jeong , et al. July 19, 2
2022-07-19
Semiconductor Package Having Stiffening Structure
App 20220223543 - CHOI; Eunkyoung ;   et al.
2022-07-14
Semiconductor Package
App 20220199577 - PARK; Sungwoo ;   et al.
2022-06-23
Image Processing Apparatus Including Neural Network Processor And Method Of Operating The Same
App 20220182537 - KIM; Irina ;   et al.
2022-06-09
Semiconductor package having stiffening structure
Grant 11,315,886 - Choi , et al. April 26, 2
2022-04-26
Device For Improving Image Resolution In Camera System Having Lens That Permits Distortion And Operation Method Thereof
App 20220122219 - LEE; JEONGGUK ;   et al.
2022-04-21
Mobile Electronic Devices Having Multi-camera Modules
App 20220053150 - JEONG; Soyoung ;   et al.
2022-02-17
Interposer And Semiconductor Package Having The Same
App 20220051970 - Park; Yukyung ;   et al.
2022-02-17
Image Compression Method Using Saturated Pixel, Encoder, And Electronic Device
App 20220020180 - LEE; Wonseok ;   et al.
2022-01-20
Image Sensor Module, Image Processing System, And Image Compression Method
App 20220020181 - LEE; Wonseok ;   et al.
2022-01-20
Image Sensor Module, Image Processing System, And Image Compression Method
App 20220021889 - Lee; Wonseok ;   et al.
2022-01-20
Camera Module, Image Processing System And Image Compression Method
App 20220020179 - Lee; Wonseok ;   et al.
2022-01-20
Interposer And Semiconductor Package Including The Same
App 20210391269 - PARK; Yukyung ;   et al.
2021-12-16
Image Sensor, Electronic Device, And Operating Method Of Image Sensor
App 20210385389 - LEE; Jeongguk ;   et al.
2021-12-09
Interposer with through electrode having a wiring protection layer
Grant 11,195,785 - Park , et al. December 7, 2
2021-12-07
Image Compression Method, Encoder, And Camera Module Including The Encoder
App 20210344834 - Lee; Wonseok ;   et al.
2021-11-04
Camera Module, Image Processing Device And Image Compression Method
App 20210337240 - LEE; Wonseok ;   et al.
2021-10-28
Interposer And Semiconductor Package Having The Same
App 20210167001 - Park; Yukyung ;   et al.
2021-06-03
Semiconductor Package Having Stiffening Structure
App 20210151388 - CHOI; Eunkyoung ;   et al.
2021-05-20
Image Encoder, Image Decoder, And Image Processing Method
App 20210136391 - Lee; Wonseok ;   et al.
2021-05-06
Image Sensor And Image Processing System Comprising The Same
App 20210021751 - LEE; Jeongguk ;   et al.
2021-01-21
Apparatus And Method For Managing Uplink Control Channels In Wireless Communication System
App 20200396761 - JEONG; Youngmin ;   et al.
2020-12-17
Apparatus and method for allocating resources in wireless communication system
Grant 10,869,308 - Park , et al. December 15, 2
2020-12-15
Imaging System For Generating High Dynamic Range Image
App 20200366827 - LEE; Jeongguk ;   et al.
2020-11-19
Apparatus And Method For Allocating Resources In Wireless Communication System
App 20190208510 - PARK; Hyoyol ;   et al.
2019-07-04
Carrier Head And Chemical Mechanical Polishing Apparatus
App 20160023323 - CHOI; YunSeok ;   et al.
2016-01-28
Semiconductor package having through silicon via (TSV) interposer and method of manufacturing the semiconductor package
Grant 8,928,132 - Choi , et al. January 6, 2
2015-01-06
Semiconductor packages
Grant 8,823,185 - O , et al. September 2, 2
2014-09-02
Semiconductor Package
App 20130001798 - Choi; YunSeok
2013-01-03
Semiconductor package including a plurality of stacked semiconductor devices
Grant 8,330,278 - Lee , et al. December 11, 2
2012-12-11
Semiconductor Package Having Through Silicon Via (tsv) Interposer And Method Of Manufacturing The Semiconductor Package
App 20120211885 - Choi; YunSeok ;   et al.
2012-08-23
Semiconductor Packages
App 20120168918 - O; In Won ;   et al.
2012-07-05
Semiconductor Package
App 20120074595 - Ha; JeongOh ;   et al.
2012-03-29
Semiconductor Package
App 20100102428 - Lee; Heeseok ;   et al.
2010-04-29

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