CHOI; Yun Hwa

Patent Applications and Registrations

Patent applications and USPTO patent grants for CHOI; Yun Hwa.The latest application filed is for "semiconductor package and method of manufacturing the same".

Company Profile

16.26.43

CHOI; Yun Hwa - Bucheon-si KR
CHOI; Yun Hwa - Busan KR
Choi; Yun Hwa - Gyeonggi-do KR
CHOI; Yun hwa - Seoul KR
Choi; Yun-hwa - Incheon KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor Package And Method Of Manufacturing The Same App 20220285304 - CHOI; Yun Hwa	2022-09-08
Semiconductor package and method of manufacturing the same Grant 11,417,577 - Choi August 16, 2	2022-08-16
System For Cooling Semiconductor Component, Method Of Manufacturing The Same, And Semiconductor Package Having The System App 20220246494 - Choi; Yun Hwa	2022-08-04
Metal powder layers between substrate, semiconductor chip and conductor Grant 11,393,744 - Choi July 19, 2	2022-07-19
Semiconductor Package App 20220223504 - CHOI; Yun Hwa	2022-07-14
Clip, lead frame, and substrate used in semiconductor package having engraved pattern formed thereon and the semiconductor package comprising the same Grant 11,367,666 - Choi , et al. June 21, 2	2022-06-21
Pressurizing members for semiconductor package Grant 11,362,021 - Choi , et al. June 14, 2	2022-06-14
Semiconductor Package App 20220148998 - CHOI; Yun Hwa ; et al.	2022-05-12
Heat sink board for a semiconductor device Grant 11,289,397 - Choi , et al. March 29, 2	2022-03-29
Semiconductor package Grant 11,270,969 - Choi , et al. March 8, 2	2022-03-08
Coupled Semiconductor Package App 20220051969 - CHOI; Yun Hwa	2022-02-17
Low-cost semiconductor package using conductive metal structure Grant 11,189,550 - Choi , et al. November 30, 2	2021-11-30
Semiconductor Package And Method Of Manufacturing The Same App 20210366799 - CHOI; Yun Hwa	2021-11-25
Metal Post, Semiconductor Package Including The Same, And Method Of Manufacturing The Semiconductor Package App 20210358832 - CHOI; Yun Hwa	2021-11-18
Heat sink board, manufacturing method thereof, and semiconductor package including the same Grant 11,171,074 - Choi , et al. November 9, 2	2021-11-09
Semiconductor Package App 20210343631 - CHOI; Yun Hwa	2021-11-04
Method Of Manufacturing Semiconductor Having Double-sided Substrate App 20210335691 - CHOI; Yun Hwa	2021-10-28
Apparatus For Attaching Semiconductor Parts App 20210320019 - CHOI; Yun Hwa ; et al.	2021-10-14
Semiconductor package having exposed heat sink for high thermal conductivity Grant 11,127,663 - Choi September 21, 2	2021-09-21
Pressurized Semiconductor Package And Method Of Manufacturing The Same App 20210280501 - CHOI; Yun Hwa ; et al.	2021-09-09
Semiconductor Package And Method Of Manufacturing The Same App 20210249342 - CHOI; Yun Hwa ; et al.	2021-08-12
Semiconductor Package Using Conductive Metal Structure App 20210166997 - CHOI; Yun Hwa ; et al.	2021-06-03
Heat Sink Board, Manufacturing Method Thereof, And Semiconductor Package Including The Same App 20210143076 - CHOI; Yun Hwa ; et al.	2021-05-13
Heat Sink Board, Manufacturing Method Thereof, And Semiconductor Package Including The Same App 20210118768 - CHOI; Yun Hwa ; et al.	2021-04-22
Semiconductor Package Having Exposed Heat Sink For High Thermal Conductivity App 20210057313 - CHOI; Yun Hwa	2021-02-25
Multilayer clip structure attached to a chip Grant 10,896,889 - Choi , et al. January 19, 2	2021-01-19
Semiconductor Package App 20200395264 - CHOI; Yun Hwa ; et al.	2020-12-17
Semiconductor Package App 20200388588 - CHOI; Yun Hwa ; et al.	2020-12-10
Press-fit pin, semiconductor package having the same and method for manufacturing the press-fit pin Grant 10,855,009 - Choi , et al. December 1, 2	2020-12-01
Method of bonding terminal of semiconductor chip using solder bump and semiconductor package using the same Grant 10,714,450 - Choi , et al.	2020-07-14
Press-fit Pin, Semiconductor Package Having The Same And Method For Manufacturing The Press-fit Pin App 20200185845 - Choi; Yun Hwa ; et al.	2020-06-11
Clip, Lead Frame, And Substrate Used In Semiconductor Package Having Engraved Pattern Formed Thereon And The Semiconductor Packa App 20200176342 - CHOI; Yun Hwa ; et al.	2020-06-04
Composite Clip Structure And Semiconductor Package Using The Same App 20200168576 - CHOI; Yun Hwa ; et al.	2020-05-28
Press-fit pin and semiconductor package including the same Grant 10,541,197 - Choi , et al. Ja	2020-01-21
Clip structure and semiconductor package using the same Grant 10,535,589 - Choi , et al. Ja	2020-01-14
Method Of Bonding Terminal Of Semiconductor Chip Using Solder Bump And Semiconductor Package Using The Same App 20200006281 - CHOI; Yun Hwa ; et al.	2020-01-02
Low-cost Semiconductor Package Using Conductive Metal Structure App 20190311975 - CHOI; Yun Hwa ; et al.	2019-10-10
Press-fit Pin And Semiconductor Package Including The Same App 20190139872 - CHOI; Yun Hwa ; et al.	2019-05-09
Semiconductor package having double-sided heat dissipation structure Grant 10,249,552 - Choi , et al.	2019-04-02
Clip Structure And Semiconductor Package Using The Same App 20190019746 - CHOI; Yun Hwa ; et al.	2019-01-17
Semiconductor Package Having Double-sided Heat Dissipation Structure App 20180240731 - CHOI; Yun Hwa ; et al.	2018-08-23
Semiconductor package with clip structure Grant 9,685,397 - Choi June 20, 2	2017-06-20
Semiconductor Package With Clip Structure App 20160336257 - CHOI; Yun Hwa	2016-11-17
Method For Inputting Household Accounting Data For Double-entry Bookkeeping And Household Accounting System Using Same App 20160300309 - CHOI; Yun hwa	2016-10-13
Power module having stacked flip-chip and method for fabricating the power module Grant 9,130,065 - Im , et al. September 8, 2	2015-09-08
Power Module Having Stacked Flip-Chip and Method for Fabricating the Power Module App 20140273349 - Lim; Seung-won ; et al.	2014-09-18
Power module having stacked flip-chip and method of fabricating the power module Grant 8,766,419 - Lim , et al. July 1, 2	2014-07-01
Location tracking method in coordinator-based wireless network Grant 8,538,453 - Choi , et al. September 17, 2	2013-09-17
Location tracking method in coordinator-based wireless network Grant 8,504,057 - Choi , et al. August 6, 2	2013-08-06
Method of allocating frequency subband and apparatus adopting the same Grant 7,957,340 - Choi , et al. June 7, 2	2011-06-07
Location Tracking Method In Coordinator-based Wireless Network App 20100189082 - Choi; Yun-hwa ; et al.	2010-07-29
Power Module Having Stacked Flip-Chip and Method of Fabricating the Power Module App 20100155914 - Lim; Seung-won ; et al.	2010-06-24
Power module having stacked flip-chip and method of fabricating the power module Grant 7,675,148 - Lim , et al. March 9, 2	2010-03-09
Method of allocating frequency subband and apparatus adopting the same Grant 7,551,594 - Choi , et al. June 23, 2	2009-06-23
Power module having stacked flip-chip and method of fabricating the power module App 20080224285 - Lim; Seung-won ; et al.	2008-09-18
Method Of Allocating Frequency Subband And Apparatus Adopting The Same App 20080019346 - CHOI; Yun-hwa ; et al.	2008-01-24
Location tracking method in coordinator-based wireless network App 20060018295 - Choi; Yun-hwa ; et al.	2006-01-26
Method for ultra wideband communication, and ultra wideband transmitter and receiver App 20050276310 - Choi, Yun-hwa ; et al.	2005-12-15
Method and apparatus for ultra wideband communication App 20050195883 - Choi, Yun-hwa ; et al.	2005-09-08
Method for multi-band ultra wide band communication of frequency hopping type App 20050083896 - Hong, Seong-seol ; et al.	2005-04-21
Method of allocating frequency subband and apparatus adopting the same App 20050068930 - Choi, Yun-hwa ; et al.	2005-03-31
Method for ultra wideband communication using frequency band modulation, and system for the same App 20050013345 - Choi, Yun-hwa	2005-01-20
Method and apparatus for transferring and receiving ultra wideband signals using differential phase shift keying scheme App 20040223556 - Choi, Yun-hwa	2004-11-11
Method and apparatus for ultra wideband wireless communication using channel information App 20040219897 - Choi, Yun-hwa	2004-11-04
Apparatus and method for transmitting and receiving ultra wideband signals App 20040176063 - Choi, Yun-hwa	2004-09-09

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