Choi; Youngnam
Patent Applications and Registrations
Patent applications and USPTO patent grants for Choi; Youngnam.The latest application filed is for "integrated circuit package system using heat slug".
- Choi; Youngnam - Seoul KR
- Choi; Youngnam - Singapore SG
| Patent | Date |
|---|---|
| Integrated circuit package system with leadframe substrate Grant 8,174,120 - Lee , et al. May 8, 2 | 2012-05-08 |
| Integrated circuit package system using heat slug Grant 8,022,531 - Yu , et al. September 20, 2 | 2011-09-20 |
| Integrated Circuit Package System Using Heat Slug App 20100327418 - Yu; Kyungsic ; et al. | 2010-12-30 |
| Integrated circuit package system using heat slug Grant 7,851,268 - Yu , et al. December 14, 2 | 2010-12-14 |
| Integrated Circuit Package System With Leadframe Substrate App 20100019369 - Lee; Cheonhee ; et al. | 2010-01-28 |
| Integrated circuit package system with leadframe substrate Grant 7,645,640 - Lee , et al. January 12, 2 | 2010-01-12 |
| Integrated Circuit Package System Using Heat Slug App 20070108596 - Yu; Kyungsic ; et al. | 2007-05-17 |
| Integrated Circuit Package System With Leadframe Substrate App 20060102989 - Lee; Cheonhee ; et al. | 2006-05-18 |
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