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Choi; Young Nam Patent Filings

Choi; Young Nam

Patent Applications and Registrations

Patent applications and USPTO patent grants for Choi; Young Nam.The latest application filed is for "cutting insert and cutting tool having same mounted therein".

Company Profile
6.11.11
  • Choi; Young Nam - Cheongju-si KR
  • Choi; Young Nam - Uiwang-si KR
  • Choi; Young Nam - Seoul KR
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Cutting insert and cutting tool having same mounted therein
Grant 11,389,883 - Choi , et al. July 19, 2
2022-07-19
Single-sided high feed cutting insert and cutting tool equipped with same
Grant 11,117,201 - Lee , et al. September 14, 2
2021-09-14
High-feed cutting insert and cutting tool equipped with same
Grant 11,117,202 - Lee , et al. September 14, 2
2021-09-14
Cutting Insert And Cutting Tool Having Same Mounted Therein
App 20200338652 - CHOI; Young Nam ;   et al.
2020-10-29
CMP slurry composition for polishing copper line and polishing method using same
Grant 10,607,853 - Noh , et al.
2020-03-31
Double-sided cutting insert having high feed rate and cutting tool equipped therewith
Grant 10,556,277 - Lee , et al. Feb
2020-02-11
Cutting Insert Cooling Device
App 20200030885 - MUN; Jae Yeong ;   et al.
2020-01-30
High-feed Cutting Insert And Cutting Tool Equipped With Same
App 20200023446 - LEE; Sang Yong ;   et al.
2020-01-23
Single-sided High Feed Cutting Insert And Cutting Tool Equipped With Same
App 20190388981 - LEE; Sang Yong ;   et al.
2019-12-26
Cutting insert
Grant 10,259,055 - Choi , et al.
2019-04-16
Double-sided Cutting Insert Having High Feed Rate And Cutting Tool Equipped Therewith
App 20180333791 - LEE; Sang Yong ;   et al.
2018-11-22
Cutting Insert
App 20180085836 - CHOI; Young-nam ;   et al.
2018-03-29
Cmp Slurry Composition For Polishing Copper Line And Polishing Method Using Same
App 20170271172 - NOH; Jong IL ;   et al.
2017-09-21
CMP slurry composition for polishing copper, and polishing method using same
Grant 9,593,260 - Noh , et al. March 14, 2
2017-03-14
Leadframe and semiconductor package made using the leadframe
Grant 9,362,210 - Ahn , et al. June 7, 2
2016-06-07
Cmp Slurry Composition For Polishing Copper, And Polishing Method Using Same
App 20160017181 - NOH; Jong Il ;   et al.
2016-01-21
Leadframe And Semiconductor Package Made Using The Leadframe
App 20130181335 - Ahn; Byung Hoon ;   et al.
2013-07-18
Leadframe and semiconductor package made using the leadframe
Grant 8,410,585 - Ahn , et al. April 2, 2
2013-04-02
Leadframe and semiconductor package made using the leadframe
App 20060151858 - Ahn; Byung Hoon ;   et al.
2006-07-13
Leadframe and semiconductor package made using the leadframe
Grant 7,042,068 - Ahn , et al. May 9, 2
2006-05-09
Leadframe and semiconductor package made using the leadframe
App 20050029638 - Ahn, Byung Hoon ;   et al.
2005-02-10
Company Registrations
NCAGE Code1Z59FCHOI, YOUNG NAM
CAGE Code1Z59FCHOI, YOUNG NAM CHOI, YOUNG NAM
S.A.M. Registration1Z59F [631102139]CHOI, YOUNG NAM

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