Choi; Yoon-hwa

Patent Applications and Registrations

Patent applications and USPTO patent grants for Choi; Yoon-hwa.The latest application filed is for "optical coupler package".

Company Profile

0.9.8

Choi; Yoon-hwa - Incheon KR
Choi; Yoon Hwa - Kyonggido KR
Choi; Yoon-hwa - Incheon Metropolitan KR
Choi; Yoon-hwa - Incheon Metropolitan City KR
Choi, Yoon-Hwa - Incheon City KR
Choi; Yoon Hwa - Kyoungki-do KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Wafer-level chip scale package having stud bump and method for fabricating the same Grant 8,058,735 - Lee , et al. November 15, 2	2011-11-15
Optical coupler package Grant 7,659,531 - Choi , et al. February 9, 2	2010-02-09
Package frame and semiconductor package using the same Grant 7,541,668 - Choi June 2, 2	2009-06-02
Optical Coupler Package App 20080251739 - Choi; Yoon Hwa ; et al.	2008-10-16
Molded leadless package having a partially exposed lead frame pad Grant 7,315,077 - Choi , et al. January 1, 2	2008-01-01
Package frame and semiconductor package using the same App 20070034994 - Choi; Yoon-hwa	2007-02-15
Wafer-level chip scale package and method for fabricating and using the same App 20050176233 - Joshi, Rajeev ; et al.	2005-08-11
Molded leadless package having improved reliability and high thermal transferability, and sawing type molded leadless package and method of manufacturing the same App 20050104168 - Choi, Yoon-hwa ; et al.	2005-05-19
Wafer-level chip scale package and method for fabricating and using the same App 20040191955 - Joshi, Rajeev ; et al.	2004-09-30
Method for fabricating stacked chip package device Grant 6,677,181 - Park , et al. January 13, 2	2004-01-13
Thin, small-sized power semiconductor package Grant 6,621,152 - Choi , et al. September 16, 2	2003-09-16
Wafer-level chip scale package having stud bump and method for fabricating the same App 20030090884 - Lee, Sang-Do ; et al.	2003-05-15
Thin, small-sized power semiconductor package App 20020074634 - Choi, Yoon-Hwa ; et al.	2002-06-20
Stack package and method for fabricating the same App 20020005575 - Park, Myung Geun ; et al.	2002-01-17
Chip stack package utilizing a connecting hole to improve electrical connection between leadframes Grant 6,316,825 - Park , et al. November 13, 2	2001-11-13
Chip scale package Grant 6,297,543 - Hong , et al. October 2, 2	2001-10-02
Stack package Grant 6,075,284 - Choi , et al. June 13, 2	2000-06-13

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