Choi; Wan Gyan
Patent Applications and Registrations
Patent applications and USPTO patent grants for Choi; Wan Gyan.The latest application filed is for "semiconductor device package structure having column leads and a method for production thereof".
- Choi; Wan Gyan - Kyungki-do KR
- Choi; Wan Gyan - Seongnam KR
| Patent | Date |
|---|---|
| Semiconductor device package structure having column leads and a method for production thereof Grant 5,900,676 - Kweon , et al. May 4, 1 | 1999-05-04 |
| Chip-size package (CSP) using a multi-layer laminated lead frame Grant 5,894,107 - Lee , et al. April 13, 1 | 1999-04-13 |
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