Choi; Seung Yong
Patent Applications and Registrations
Patent applications and USPTO patent grants for Choi; Seung Yong.The latest application filed is for "package module and method of manufacturing the same".
Company Profile
0.19.29
- Choi; Seung Yong - Suwon-si KR
- Choi; Seung Yong - Gyunggi-do KR
- Choi; Seung-Yong - Seoul N/A KR
- CHOI; Seung Yong - Suwon KR
- Choi; Seung Yong - Gyeonggi-do KR
- Choi; Seung-yong - Kyungki-do KR
- Choi, Seung Yong - Pungmu-dong KR
- Choi; Seung-Yong - Greensboro NC
Patent Activity
| Patent | Date |
|---|---|
| Electronic device module and method of manufacturing the same Grant 9,929,116 - Choi March 27, 2 | 2018-03-27 |
| Package Module And Method Of Manufacturing The Same App 20170243833 - CHOI; Jong Woo ; et al. | 2017-08-24 |
| Electronic Device Module And Method Of Manufacturing The Same App 20170229411 - CHOI; Seung Yong | 2017-08-10 |
| Electronic device module and manufacturing method thereof Grant 9,706,661 - Choi July 11, 2 | 2017-07-11 |
| Electronic device module and method of manufacturing the same Grant 9,673,123 - Choi June 6, 2 | 2017-06-06 |
| Electric component module and method of manufacturing the same Grant 9,510,461 - Lee , et al. November 29, 2 | 2016-11-29 |
| Electronic Device Module And Method Of Manufacturing The Same App 20160086866 - CHOI; Seung Yong | 2016-03-24 |
| Solder Joint Structure And Electronic Component Module Including The Same App 20160029486 - JEON; Young Ho ; et al. | 2016-01-28 |
| Electronic Device Module And Manufacturing Method Thereof App 20150325529 - CHOI; Seung Yong | 2015-11-12 |
| Flip chip MLP with conductive ink Grant 9,147,627 - Choi , et al. September 29, 2 | 2015-09-29 |
| Electronic Component Module And Method Of Manufacturing The Same App 20150062854 - CHOI; Seung Yong ; et al. | 2015-03-05 |
| Electric Component Module And Method Of Manufacturing The Same App 20140376193 - LEE; Il Hyeong ; et al. | 2014-12-25 |
| Heat Sink Package App 20140217572 - Eom; Joo-Yang ; et al. | 2014-08-07 |
| Rf (radio Frequency) Module And Method Of Maufacturing The Same App 20140145348 - CHOI; Seung Yong | 2014-05-29 |
| Heat sink package Grant 8,604,606 - Eom , et al. December 10, 2 | 2013-12-10 |
| Semiconductor package formed within an encapsulation Grant 8,168,475 - Choi , et al. May 1, 2 | 2012-05-01 |
| Multi-chip package Grant 7,936,054 - Eom , et al. May 3, 2 | 2011-05-03 |
| Heat Sink Package App 20100289137 - Eom; Joo-yang ; et al. | 2010-11-18 |
| Heat sink package Grant 7,786,570 - Eom , et al. August 31, 2 | 2010-08-31 |
| Semiconductor Package Formed Within An Encapsulation App 20100203684 - Choi; Seung-yong ; et al. | 2010-08-12 |
| Semiconductor Power Module Package Having External Bonding Area App 20100140786 - LEE; Keun-hyuk ; et al. | 2010-06-10 |
| Flip Chip Mlp With Conductive Ink App 20100052127 - Choi; Seung-Yong ; et al. | 2010-03-04 |
| Flip chip MLP with conductive ink Grant 7,638,861 - Choi , et al. December 29, 2 | 2009-12-29 |
| Wafer-level chip scale package and method for fabricating and using the same Grant 7,632,719 - Choi , et al. December 15, 2 | 2009-12-15 |
| Semiconductor device package App 20090243079 - Lim; Seung-won ; et al. | 2009-10-01 |
| Power Device Substrates and Power Device Packages Including the Same App 20090244848 - Lim; Seung-won ; et al. | 2009-10-01 |
| Heat Sink Package App 20090194869 - Eom; Joo-yang ; et al. | 2009-08-06 |
| Wafer Level Chip Scale Packages Including Redistribution Substrates and Methods of Fabricating the Same App 20090189272 - Park; Min-hyo ; et al. | 2009-07-30 |
| Multi-chip package App 20090174044 - Eom; Joo-yang ; et al. | 2009-07-09 |
| Molded Leadless Packages and Assemblies Having Stacked Molded Leadless Packages App 20090146284 - Kim; Ji-hwan ; et al. | 2009-06-11 |
| Wafer-level Chip Scale Package And Method For Fabricating And Using The Same App 20090111219 - Choi; Seung-Yong ; et al. | 2009-04-30 |
| Power module flip chip package Grant 7,492,043 - Choi , et al. February 17, 2 | 2009-02-17 |
| Method of assembly for multi-flip chip on lead frame on overmolded IC package Grant 7,335,532 - Noquil , et al. February 26, 2 | 2008-02-26 |
| Semiconductor package having solder joint of improved reliability Grant 7,268,414 - Choi , et al. September 11, 2 | 2007-09-11 |
| Flip chip MLP with conductive ink App 20070132077 - Choi; Seung-Yong ; et al. | 2007-06-14 |
| Method Of Assembly For Multi-flip Chip On Lead Frame On Overmolded Ic Package App 20070072347 - Noquil; Jonathan A. ; et al. | 2007-03-29 |
| Multi-flip chip on lead frame on over molded IC package and method of assembly Grant 7,154,186 - Noquil , et al. December 26, 2 | 2006-12-26 |
| Multi-flip chip on lead frame on over molded IC package and method of assembly App 20050206010 - Noquil, Jonathan A. ; et al. | 2005-09-22 |
| Power module flip chip package App 20050087854 - Choi, Seung-yong ; et al. | 2005-04-28 |
| Wafer-level chip scale package and method for fabricating and using the same App 20050012225 - Choi, Seung-Yong ; et al. | 2005-01-20 |
| Amino acid derivatives Grant 6,809,207 - Alla , et al. October 26, 2 | 2004-10-26 |
| Synthesis and method of purification of cyclic nucleotide derivatives App 20040186282 - Chait, Edward M. ; et al. | 2004-09-23 |
| Semiconductor package having solder joint of improved reliability App 20030209785 - Choi, Seung-Yong ; et al. | 2003-11-13 |
| Stacked intelligent power module package Grant 6,574,107 - Jeon , et al. June 3, 2 | 2003-06-03 |
| Amino acid derivatives App 20030064976 - Alla, Sekar ; et al. | 2003-04-03 |
| Stacked intelligent power module package App 20020057553 - Jeon, O-seob ; et al. | 2002-05-16 |
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