Choi; Kyoung-sei

Patent Applications and Registrations

Patent applications and USPTO patent grants for Choi; Kyoung-sei.The latest application filed is for "image sensor package".

Company Profile

0.26.32

Choi; Kyoung-sei - Yongin-si KR
Choi; Kyoung-sei - Suwon-si N/A KR
Choi; Kyoung-Sei - Gyeonggi-do KR
Choi; Kyoung-Sei - Suwon KR
Choi; Kyoung-Sei - Cheonan-si KR
CHOI; Kyoung-Sei - Chungcheongnam-do KR
Choi; Kyoung-Sei - Suwon-City KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Image sensor package Grant 9,793,309 - Seo , et al. October 17, 2	2017-10-17
Semiconductor package Grant 9,730,323 - Kim , et al. August 8, 2	2017-08-08
Semiconductor package Grant 9,570,400 - Baek , et al. February 14, 2	2017-02-14
Stack type semiconductor package Grant 9,230,876 - Lee , et al. January 5, 2	2016-01-05
Image Sensor Package App 20150340397 - SEO; Byoung-rim ; et al.	2015-11-26
Semiconductor Package App 20150318226 - BAEK; Bo-Na ; et al.	2015-11-05
Semiconductor Package App 20150245487 - KIM; Jin Gyu ; et al.	2015-08-27
Stack Type Semiconductor Package App 20140374902 - LEE; Jang-Woo ; et al.	2014-12-25
Methods for forming circuit pattern forming region in an insulating substrate Grant 8,796,158 - Choi August 5, 2	2014-08-05
Multi-layer Printed Circuit Board Comprising Film And Method For Fabricating The Same App 20140059852 - PARK; Soo-Jeoung ; et al.	2014-03-06
Flexible heat sink having ventilation ports and semiconductor package including the same Grant 8,648,478 - Yoo , et al. February 11, 2	2014-02-11
Semiconductor chip package Grant 8,629,547 - Cho , et al. January 14, 2	2014-01-14
Chip on flexible printed circuit type semiconductor package Grant 8,575,746 - Lee , et al. November 5, 2	2013-11-05
Device for removing electromagnetic interference and semiconductor package including the same Grant 8,513,781 - Yoo , et al. August 20, 2	2013-08-20
Method of fabricating a semiconductor device package Grant 8,266,796 - Park , et al. September 18, 2	2012-09-18
Method for manufacturing tape wiring board Grant 8,250,750 - Choi , et al. August 28, 2	2012-08-28
Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the same Grant 8,222,089 - Choi , et al. July 17, 2	2012-07-17
Methods For Forming Circuit Pattern Forming Region In An Insulating Substrate App 20120102734 - Choi; Kyoung-sei	2012-05-03
Semiconductor Chip Package App 20120074540 - CHO; Kyong-Soon ; et al.	2012-03-29
Flexible substrate for a semiconductor package, method of manufacturing the same, and semiconductor package including flexible substrate Grant 8,110,918 - Choi February 7, 2	2012-02-07
Flexible Heat Sink Having Ventilation Ports And Semiconductor Package Including The Same App 20110316144 - Yoo; Jae-Wook ; et al.	2011-12-29
Image Sensor Chip And Camera Module Having The Same App 20110304763 - Choi; Mi-Na ; et al.	2011-12-15
Camera Module App 20110285890 - Choi; Mi-Na ; et al.	2011-11-24
Multi-layer Printed Circuit Board Comprising Film And Method For Fabricating The Same App 20110247871 - Park; Soo-Jeoung ; et al.	2011-10-13
Tape For Heat Dissipating Member, Chip On Film Type Semiconductor Package Including Heat Dissipating Member, And Electronic Apparatus Including The Same App 20110143625 - Choi; Kyoung-sei ; et al.	2011-06-16
Flip chip packages Grant 7,956,452 - Choi , et al. June 7, 2	2011-06-07
Method For Manufacturing Tape Wiring Board App 20110119912 - Choi; Kyoung-Sei ; et al.	2011-05-26
Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the same Grant 7,915,727 - Choi , et al. March 29, 2	2011-03-29
Method for manufacturing tape wiring board Grant 7,895,742 - Choi , et al. March 1, 2	2011-03-01
Method of cutting semiconductor wafer, semiconductor chip apparatus, and chamber to cut wafer Grant 7,888,237 - Kim , et al. February 15, 2	2011-02-15
Flip chip packages App 20100044851 - Choi; Yun-Seok ; et al.	2010-02-25
Method of manufacturing a wiring substrate, method of manufacturing a tape package and method of manufacturing a display device App 20100005652 - Kim; Dong-Han ; et al.	2010-01-14
Electronic Device Having Electrostatic Discharge Protection Device And Methods Of Fabricating The Same App 20090284883 - LEE; Hee-Seok ; et al.	2009-11-19
CMOS type image sensor module having transparent polymeric encapsulation material Grant 7,534,645 - Choi May 19, 2	2009-05-19
Method Of Cutting Semiconductor Wafer, Semiconductor Chip Apparatus, And Chamber To Cut Wafer App 20090117710 - KIM; Dong-Han ; et al.	2009-05-07
Wiring substrate, semiconductor device package including the wiring substrate and methods of fabricating the same App 20080291655 - Park; Ji-Yong ; et al.	2008-11-27
Method For Manufacturing Tape Wiring Board App 20080029923 - CHOI; Kyoung-Sei ; et al.	2008-02-07
Chip on flexible printed circuit type semiconductor package App 20080023822 - Lee; Si-Hoon ; et al.	2008-01-31
Method for manufacturing tape wiring board Grant 7,299,547 - Choi , et al. November 27, 2	2007-11-27
Circuit Film With Bump, Film Package Using The Same, And Related Fabrication Methods App 20070126110 - KWON; Yong-Hwan ; et al.	2007-06-07
Circuit film with bump, film package using the same, and related fabrication methods Grant 7,190,073 - Kwon , et al. March 13, 2	2007-03-13
Substrate applicable to both wire bonding and flip chip bonding, smart card modules having the substrate and methods for fabricating the same App 20070015338 - Lee; Seok-Won ; et al.	2007-01-18
Semiconductor Package With Molded Back Side And Method Of Fabricating The Same App 20070007664 - LEE; Chung-Sun ; et al.	2007-01-11
CMOS type image sensor module having transparent polymeric encapsulation material App 20060270094 - Choi; Kyoung-Sei	2006-11-30
CMOS type image sensor module having transparent polymeric encapsulation material Grant 7,105,904 - Choi September 12, 2	2006-09-12
Film substrate of a semiconductor package and a manufacturing method App 20060071303 - Lee; Chung-Sun ; et al.	2006-04-06
Method for manufacturing tape wiring board App 20060003568 - Choi; Kyoung-Sei ; et al.	2006-01-05
Circuit film with bump, film package using the same, and related fabrication methods App 20050285277 - Kwon, Yong-Hwan ; et al.	2005-12-29
Method of manufacturing tape wiring substrate App 20050205524 - Lee, Chung-Sun ; et al.	2005-09-22
Flexible substrate for a semiconductor package, method of manufacturing the same, and semiconductor package including flexible substrate App 20040251537 - Choi, Kyoung-sei	2004-12-16
CMOS type image sensor module having transparent polymeric encapsulation material App 20040251509 - Choi, Kyoung-Sei	2004-12-16

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