CHOI; Kwang-Seong

Patent Applications and Registrations

Patent applications and USPTO patent grants for CHOI; Kwang-Seong.The latest application filed is for "method of fabricating semiconductor package".

Company Profile

7.32.66

CHOI; Kwang-Seong - Daejeon KR
Choi; Kwang Seong - Seoul KR
CHOI; Kwang-Seong - Bucheon-si KR
Choi; Kwang-Seong - Yuseong-gu KR
Choi, Kwang-Seong - Cheongju KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method Of Fabricating Semiconductor Package App 20220102603 - CHOI; Kwang-Seong ; et al.	2022-03-31
Composition For Conductive Adhesive, Semiconductor Package Comprising Cured Product Thereof, And Method Of Manufacturing Semiconductor Package Using The Same App 20220077099 - CHOI; Gwang-Mun ; et al.	2022-03-10
Wire For Electric Bonding App 20210402525 - CHOI; GWANG-MUN ; et al.	2021-12-30
Laser Bonding Method And A Semiconductor Package Including A Bonding Part And A Bonding Target App 20210358885 - CHOI; Kwang-Seong ; et al.	2021-11-18
Method For Transferring And Bonding Of Devices App 20210320236 - JOO; Jiho ; et al.	2021-10-14
Laser bonding method Grant 11,107,790 - Choi , et al. August 31, 2	2021-08-31
Transfer And Bonding Method Using Laser App 20210252620 - CHOI; KWANG-SEONG ; et al.	2021-08-19
Method For Manufacturing Semiconductor Package App 20200266078 - EOM; Yong Sung ; et al.	2020-08-20
Method of fabricating a semiconductor package Grant 10,636,761 - Choi , et al.	2020-04-28
Laser Bonding Method App 20200075535 - CHOI; Kwang-Seong ; et al.	2020-03-05
Filling Composition For Semiconductor Package App 20190287870 - JANG; KeonSoo ; et al.	2019-09-19
Adhesive Film For Electric Device And Method Of Fabricating Semiconductor Package Using The Same App 20190211231 - JANG; KeonSoo ; et al.	2019-07-11
Method Of Fabricating A Semiconductor Package App 20190067235 - CHOI; Kwang-Seong ; et al.	2019-02-28
Pattern-forming method for forming a conductive circuit pattern Grant 9,980,393 - Eom , et al. May 22, 2	2018-05-22
Method of fabricating a semiconductor package Grant 9,853,010 - Choi , et al. December 26, 2	2017-12-26
Method Of Fabricating A Semiconductor Package App 20170141071 - CHOI; Kwang-Seong ; et al.	2017-05-18
Bonding structure of electronic equipment Grant 9,538,666 - Choi , et al. January 3, 2	2017-01-03
Semiconductor Package And Method For Manufacturing The Same App 20160358892 - LEE; Haksun ; et al.	2016-12-08
Transceiver Module And Communication Apparatus Including The Same App 20160094258 - BAE; Hyun-cheol ; et al.	2016-03-31
Method and apparatus for transmitting and receiving coherent optical OFDM Grant 9,270,381 - Youn , et al. February 23, 2	2016-02-23
Stack Module Package And Method For Manufacturing The Same App 20150364445 - CHOI; Kwang Seong ; et al.	2015-12-17
Pattern-forming Composition And Pattern-forming Method Using The Same App 20150237739 - EOM; Yong Sung ; et al.	2015-08-20
Semiconductor Device And Method Of Manufacturing The Same App 20150228617 - LEE; Haksun ; et al.	2015-08-13
Method of fabricating a solder-on-pad structure and flip-chip bonding method using the same Grant 9,034,750 - Choi , et al. May 19, 2	2015-05-19
Measuring device and method of measuring signal transmission time difference thereof Grant 9,031,421 - Choe , et al. May 12, 2	2015-05-12
Impact-type piezoelectric micro power generator Grant 9,024,511 - Jun , et al. May 5, 2	2015-05-05
Methods of forming bump and semiconductor device with the same Grant 9,006,037 - Choi , et al. April 14, 2	2015-04-14
Bonding Structure Of Electronic Equipment App 20150043175 - CHOI; KWANG-SEONG ; et al.	2015-02-12
Method Of Fabricating A Solder Particle App 20140367375 - BAE; Hyun-cheol ; et al.	2014-12-18
Conductive Composition, Silicon Solar Cell Including The Same, And Manufacturing Method Thereof App 20140318615 - OH; Soo Young ; et al.	2014-10-30
Methods Of Forming Bump And Semiconductor Device With The Same App 20140287556 - CHOI; Kwang-Seong ; et al.	2014-09-25
Method of forming solder on pad on fine pitch PCB and method of flip chip bonding semiconductor using the same Grant 8,794,502 - Eom , et al. August 5, 2	2014-08-05
Measuring Device And Method Of Measuring Signal Transmission Time Difference Thereof App 20140205280 - CHOE; Joong-Seon ; et al.	2014-07-24
Impact-type Piezoelectric Micro Power Generator App 20140159547 - JUN; Chi Hoon ; et al.	2014-06-12
Silicon interposer including backside inductor Grant 8,723,292 - Bae , et al. May 13, 2	2014-05-13
Method Of Fabricating A Solder-on-pad Structure And Flip-chip Bonding Method Using The Same App 20140117070 - Choi; Kwang-Seong ; et al.	2014-05-01
Polarization division multiplexed optical orthogonal frequency division multiplexing transmitter and receiver Grant 8,693,459 - Youn , et al. April 8, 2	2014-04-08
Method Of Forming Solder On Pad On Fine Pitch Pcb And Method Of Flip Chip Bonding Semiconductor Using The Same App 20130334291 - EOM; Yong Sung ; et al.	2013-12-19
Optical Orthogonal Frequency Division Multiple Multiplexing Receiver And Optical Signal Receiving Method Thereof App 20130308949 - YOUN; Chun Ju ; et al.	2013-11-21
Optical orthogonal frequency division multiplexing receiver and optical signal receiving method thereof Grant 8,521,040 - Youn , et al. August 27, 2	2013-08-27
Optical Communication Module And Method Of Manufacturing The Same App 20130156394 - CHOE; Joong-Seon ; et al.	2013-06-20
Core And Optical Waveguide App 20130156362 - KIM; Duk Jun ; et al.	2013-06-20
Pattern-forming Composition And Pattern-forming Method Using The Same App 20130146342 - EOM; Yong Sung ; et al.	2013-06-13
Piezoelectric Micro Power Generator And Fabrication Method Thereof App 20130127295 - JUN; Chi Hoon ; et al.	2013-05-23
Silicon Interposer Including Backside Inductor App 20130087884 - BAE; Hyun-Cheol ; et al.	2013-04-11
Device and method for separation/conversion of multiband signal Grant 8,335,200 - Chung , et al. December 18, 2	2012-12-18
Method For Controlling Mobile Terminal App 20120270611 - CHOI; Kwang-Seong ; et al.	2012-10-25
Method Of Manufacturing Solder Powder Having Diameter Of Sub-micrometers Or Several Micrometers App 20120240727 - EOM; Yong Sung ; et al.	2012-09-27
Adapter assembly and method for compensating optical fibers for length difference Grant 8,272,789 - Choe , et al. September 25, 2	2012-09-25
Conductive Composition, Silicon Solar Cell Including The Same, And Manufacturing Method Thereof App 20120222738 - OH; Soo Young ; et al.	2012-09-06
Method and structure for bonding flip chip Grant 8,211,745 - Eom , et al. July 3, 2	2012-07-03
Composition For Filling Through Silicon Via (tsv), Tsv Filling Method And Substrate Including Tsv Plug Formed Of The Composition App 20120161326 - Choi; Kwang-Seong ; et al.	2012-06-28
Method And Apparatus For Transmitting And Receiving Coherent Optical Ofdm App 20120155887 - YOUN; Chun Ju ; et al.	2012-06-21
Optical Module Comprising Optical Hybrid Using Metal Optical Waveguide And Photo Detector App 20120132792 - Choe; Joong-Seon ; et al.	2012-05-31
Optical Waveguide Structure Having Angled Mirror And Lens App 20120114293 - Choe; Joong-Seon ; et al.	2012-05-10
Electronic device including LTCC inductor Grant 8,044,757 - Bae , et al. October 25, 2	2011-10-25
Method for fabricating a semiconductor package Grant 8,030,200 - Eom , et al. October 4, 2	2011-10-04
Filling Composition, Semiconductor Device Including The Same, And Method Of Fabricating The Semiconductor Device App 20110227228 - EOM; Yong Sung ; et al.	2011-09-22
Adapter Assembly And Method For Compensating Optical Fibers For Length Difference App 20110142398 - Choe; Joong-Seon ; et al.	2011-06-16
Optical Orthogonal Frequency Division Multiplexing Receiver And Optical Signal Receiving Method Thereof App 20110135319 - YOUN; Chun Ju ; et al.	2011-06-09
Polarization Division Multiplexed Optical Orthogonal Frequency Division Multiplexing Transmitter And Receiver App 20110096855 - YOUN; Chun Ju ; et al.	2011-04-28
Method And Structure For Bonding Flip Chip App 20110089577 - Eom; Yong Sung ; et al.	2011-04-21
Polarization Splitter, Optical Hybrid And Optical Receiver Including The Same App 20110064422 - Kim; Jong-Hoi ; et al.	2011-03-17
Electronic Device Including Ltcc Inductor App 20110018670 - BAE; Hyun-Cheol ; et al.	2011-01-27
Method For Fabricating Semiconductor Package And Semiconductor Package Using The Same App 20100320596 - Eom; Yong Sung ; et al.	2010-12-23
Device and Method for Separation/Conversion of Multiband Signal App 20100246451 - Chung; Yong Duck ; et al.	2010-09-30
Buried Capacitor, Method Of Manufacturing The Same, And Method Of Changing Capacitance Thereof App 20100142115 - Bae; Hyun-Cheol ; et al.	2010-06-10
Vertically formed inductor and electronic device having the same Grant 7,733,207 - Yun , et al. June 8, 2	2010-06-08
Microstrip Patch Antenna With High Gain And Wide Band Characteristics App 20100073238 - JUN; Dong Suk ; et al.	2010-03-25
System and method for switching channels using tunable laser diodes Grant 7,599,624 - Park , et al. October 6, 2	2009-10-06
Electroabsorption duplexer Grant 7,583,869 - Kang , et al. September 1, 2	2009-09-01
Optical module and optical module package Grant 7,553,092 - Choi , et al. June 30, 2	2009-06-30
Vertically Formed Inductor And Electronic Device Having The Same App 20080297299 - Yun; Ho Gyeong ; et al.	2008-12-04
Optical Hybrid Module App 20080285978 - Choi; Kwang Seong ; et al.	2008-11-20
Reflection-type Optical Modulator Module App 20080137178 - CHUNG; Yong Duck ; et al.	2008-06-12
Enhanced coplanar waveguide and optical communication module using the same Grant 7,331,723 - Yoon , et al. February 19, 2	2008-02-19
Optical module Grant 7,298,933 - Choi , et al. November 20, 2	2007-11-20
Electroabsorption duplexer App 20070171515 - Kang; Young Shik ; et al.	2007-07-26
Enhanced coplanar waveguide and optical communication module using the same App 20070133933 - Yoon; Ho Gyeong ; et al.	2007-06-14
Optical module and optical module package App 20070047878 - Choi; Kwang Seong ; et al.	2007-03-01
System and method for switching channels using tunable laser diodes App 20060127093 - Park; Sahng Gi ; et al.	2006-06-15
Optical module App 20060115197 - Choi; Kwang Seong ; et al.	2006-06-01
Wavelength stabilization module having light-receiving element array and method of manufacturing the same Grant 7,012,939 - Choi , et al. March 14, 2	2006-03-14
System for monitoring optical output/wavelength Grant 7,009,716 - Kim , et al. March 7, 2	2006-03-07
Structure for manufacturing optical module App 20050123249 - Yun, Ho Gyeong ; et al.	2005-06-09
Optical transceiver for reducing crosstalk App 20050053380 - Kim, Sung Il ; et al.	2005-03-10
System for monitoring optical output/wavelength App 20050046868 - Kim, Jong-Deog ; et al.	2005-03-03
Wavelength stabilization module having light-receiving element array and method of manufacturing the same App 20040101319 - Choi, Kwang Seong ; et al.	2004-05-27
BGA semiconductor package improving solder joint reliability and fabrication method thereof App 20020102770 - Choi, Kwang-Seong	2002-08-01
BGA semiconductor package improving solder joint reliability and fabrication method thereof Grant 6,395,581 - Choi May 28, 2	2002-05-28

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