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Patent applications and USPTO patent grants for CHOI; Kwang-deok.The latest application filed is for "method for manufacturing circuit board including metal-containing layer".
Patent | Date |
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Method For Manufacturing Circuit Board Including Metal-containing Layer App 20220132676 - BYUN; Ji Young ;   et al. | 2022-04-28 |
Non-metal Member With Colored Surface And Method Of Coloring Non-metal Surface App 20210115550 - Byun; Ji Young ;   et al. | 2021-04-22 |
Coloring Pattern Structure And Method Of Manufacturing The Same App 20200310016 - BYUN; Ji Young ;   et al. | 2020-10-01 |
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