Choi; Jin-Hak
Patent Applications and Registrations
Patent applications and USPTO patent grants for Choi; Jin-Hak.The latest application filed is for "method of nickel-gold plating and printed circuit board".
- Choi; Jin-Hak - Suwon-si KR
| Patent | Date |
|---|---|
| Method of nickel-gold plating and printed circuit board Grant 7,982,138 - Choi , et al. July 19, 2 | 2011-07-19 |
| Method Of Nickel-gold Plating And Printed Circuit Board App 20100059257 - CHOI; Jin-Hak ; et al. | 2010-03-11 |
| Method of forming solder bump with reduced surface defects Grant 7,553,751 - Jeong , et al. June 30, 2 | 2009-06-30 |
| Method of forming solder bump with reduced surface defects App 20070020913 - Jeong; Se-Young ; et al. | 2007-01-25 |
| Method of forming solder bump with reduced surface defects Grant 7,132,358 - Jeong , et al. November 7, 2 | 2006-11-07 |
| X-ray photoelectron spectroscopy App 20060169893 - Lee; Jae-cheol ; et al. | 2006-08-03 |
| Method of forming solder bump with reduced surface defects App 20050164483 - Jeong, Se-Young ; et al. | 2005-07-28 |
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