Choi; Hyung Ju

Patent Applications and Registrations

Patent applications and USPTO patent grants for Choi; Hyung Ju.The latest application filed is for "semiconductor packages including chip enablement pads".

Company Profile

0.9.7

Choi; Hyung Ju - Seoul KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor packages including chip enablement pads Grant 10,002,851 - Lee , et al. June 19, 2	2018-06-19
Semiconductor package including planar stacked semiconductor chips Grant 9,875,990 - Choi , et al. January 23, 2	2018-01-23
Semiconductor Packages Including Chip Enablement Pads App 20170294411 - LEE; Ki Yong ; et al.	2017-10-12
EMI shielding in semiconductor packages Grant 9,589,905 - Choi , et al. March 7, 2	2017-03-07
Semiconductor Package Including Planar Stacked Semiconductor Chips App 20170040291 - CHOI; Hyung Ju ; et al.	2017-02-09
Printed Circuit Boards Having Blind Vias, Method Of Testing Electric Current Flowing Through Blind Via Thereof And Method Of Manufacturing Semiconductor Packages Including The Same App 20160351534 - LEE; Ki Yong ; et al.	2016-12-01
Semiconductor packages and methods for manufacturing the same Grant 9,508,683 - Choi November 29, 2	2016-11-29
Printed circuit boards having blind vias, method of testing electric current flowing through blind via thereof and method of manufacturing semiconductor packages including the same Grant 9,502,378 - Lee , et al. November 22, 2	2016-11-22
Semiconductor packages having EMI shielding layers, methods of fabricating the same, electronic systems including the same, and memory cards including the same Grant 9,275,959 - Choi , et al. March 1, 2	2016-03-01
Semiconductor Packages Having Emi Shielding Layers, Methods Of Fabricating The Same, Electronic Systems Including The Same, And Memory Cards Including The Same App 20160027741 - CHOI; Hyung Ju ; et al.	2016-01-28
Semiconductor packages having emi shielding layers, methods of fabricating the same, electronic systems including the same, and memory cards including the same Grant 9,184,140 - Choi , et al. November 10, 2	2015-11-10
Semiconductor Packages Having Emi Shielding Layers, Methods Of Fabricating The Same, Electronic Systems Including The Same, And Memory Cards Including The Same App 20150179588 - CHOI; Hyung Ju ; et al.	2015-06-25
Emi Shielding In Semiconductor Packages App 20150129874 - CHOI; Hyung Ju ; et al.	2015-05-14
Semiconductor chip module, semiconductor package having the same and package module Grant 8,736,075 - Choi , et al. May 27, 2	2014-05-27
Semiconductor Chip Module, Semiconductor Package Having The Same And Package Module App 20120187560 - CHOI; Hyung Ju ; et al.	2012-07-26

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