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Patent applications and USPTO patent grants for Choi; Haengcheol.The latest application filed is for "integrated circuit packaging system with substrate mold gate and method of manufacture thereof".
Patent | Date |
---|---|
Integrated circuit packaging system with substrate mold gate and method of manufacture thereof Grant 8,859,342 - Kim , et al. October 14, 2 | 2014-10-14 |
Electronic system with expansion feature Grant 8,703,541 - Choi , et al. April 22, 2 | 2014-04-22 |
Integrated Circuit Packaging System With Substrate Mold Gate And Method Of Manufacture Thereof App 20130154079 - Kim; Oh Han ;   et al. | 2013-06-20 |
Electronic System With Expansion Feature App 20120193132 - Choi; Haengcheol ;   et al. | 2012-08-02 |
Electronic system with expansion feature Grant 8,178,392 - Choi , et al. May 15, 2 | 2012-05-15 |
Integrated circuit mount system with solder mask pad Grant 8,124,520 - Kim , et al. February 28, 2 | 2012-02-28 |
Electronic System With Expansion Feature App 20080283998 - Choi; Haengcheol ;   et al. | 2008-11-20 |
Integrated Circuit Mount System With Solder Mask Pad App 20080014738 - Kim; KyungOe ;   et al. | 2008-01-17 |
Spacerless Semiconductor Package Chip Stacking System App 20070268660 - Ahn; Seungyun ;   et al. | 2007-11-22 |
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