CHOI; Eun-Kyoung

Patent Applications and Registrations

Patent applications and USPTO patent grants for CHOI; Eun-Kyoung.The latest application filed is for "semiconductor package".

Company Profile

2.15.20

CHOI; Eun-Kyoung - Hwaseong-si KR
Choi; Eun Kyoung - Wonju-si KR
CHOI; Eun Kyoung - Seoul KR
CHOI; Eun-Kyoung - Gyeonggi-do KR
Choi; Eun Kyoung - Chungbuk KR
CHOI; Eun-Kyoung - Bucheonsi KR
Choi; Eun-kyoung - Bucheon-si N/A KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor Package App 20210358866 - CHOI; Eun-Kyoung	2021-11-18
Sign language recognition system and method Grant 10,685,219 - Kim , et al.	2020-06-16
Sign Language Recognition System And Method App 20190073525 - KIM; Young Ho ; et al.	2019-03-07
Hydrogel composition for a mask base and method for manufacturing a hydrogel using same Grant 10,011,712 - Yoo , et al. July 3, 2	2018-07-03
Biomarker For Predicting The Sensitivity To A Protein Kinase Inhibitor And A Use Thereof App 20180180616 - KIM; Tae Won ; et al.	2018-06-28
Semiconductor Package App 20160225721 - CHOI; EUN-KYOUNG ; et al.	2016-08-04
Oil-in-water Form Organogel Cosmetic Composition Having Variable Transparency App 20150305990 - YOO; Hyun-Oh ; et al.	2015-10-29
Sticky Hydrogel Cosmetic Composition App 20150290110 - YOO; Hyun-Oh ; et al.	2015-10-15
Semiconductor package and method of manufacturing the semiconductor package Grant 9,159,659 - Kim , et al. October 13, 2	2015-10-13
Semiconductor packages and methods of fabricating the same Grant 9,059,072 - Choi , et al. June 16, 2	2015-06-16
Semiconductor packages including a heat spreader and methods of forming the same Grant 9,054,228 - Choi , et al. June 9, 2	2015-06-09
Semiconductor Package Having Heat Spreader App 20150137345 - CHOI; Eun-Kyoung ; et al.	2015-05-21
Graphene prepared by using edge functionalization of graphite Grant 9,017,638 - Baek , et al. April 28, 2	2015-04-28
Method of fabricating wafer level package Grant 8,940,557 - Kim , et al. January 27, 2	2015-01-27
Semiconductor Packages Including A Heat Spreader And Methods Of Forming The Same App 20140299980 - Choi; Eun-Kyoung ; et al.	2014-10-09
Semiconductor Packages And Methods Of Fabricating The Same App 20140300004 - CHOI; Eun-Kyoung ; et al.	2014-10-09
Emulsified Hydrogel Composition And A Production Method Therefor App 20140271596 - Kim; Sung Jang ; et al.	2014-09-18
Hydrogel Composition For A Mask Base And Method For Manufacturing A Hydrogel Using Same App 20140239536 - Yoo; Hyun Oh ; et al.	2014-08-28
Semiconductor Device And Method For Fabricating The Same App 20140239478 - HONG; Ji-Seok ; et al.	2014-08-28
Semiconductor package including underfill layers Grant 8,816,509 - Hong , et al. August 26, 2	2014-08-26
Stack package and semiconductor package including the same Grant 8,791,562 - Lee , et al. July 29, 2	2014-07-29
Semiconductor packages and methods of fabricating the same Grant 8,759,147 - Choi , et al. June 24, 2	2014-06-24
Method Of Fabricating Wafer Level Package App 20130344627 - Kim; Sang-won ; et al.	2013-12-26
Semiconductor Package And Method Of Manufacturing The Semiconductor Package App 20130299969 - KIM; Sang-Won ; et al.	2013-11-14
Semiconductor Package App 20130193588 - Hong; Ji-Seok ; et al.	2013-08-01
Graphene Prepared By Using Edge Functionalization Of Graphite App 20130108540 - Baek; Jong Beom ; et al.	2013-05-02
Semiconductor Packages And Methods Of Fabricating The Same App 20120171814 - CHOI; Eun-Kyoung ; et al.	2012-07-05

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