CHOI; Dong Kil

Patent Applications and Registrations

Patent applications and USPTO patent grants for CHOI; Dong Kil.The latest application filed is for "thermoplastic resin composition and molded article produced therefrom".

Company Profile

1.6.8

CHOI; Dong Kil - Uiwang-si KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Thermoplastic Resin Composition and Molded Article Produced Therefrom App 20220127456 - CHOI; Dong Kil ; et al.	2022-04-28
Thermoplastic resin composition and molding form for same Grant 9,732,214 - Choi , et al. August 15, 2	2017-08-15
Flame retardant thermoplastic resin composition and molded article comprising the same Grant 9,382,418 - Kim , et al. July 5, 2	2016-07-05
Thermoplastic resin composition and molded article including the same Grant 9,334,401 - Choi , et al. May 10, 2	2016-05-10
Flame Retardant Thermoplastic Resin Composition and Molded Article Comprising the Same App 20150247038 - KIM; Ji Yea ; et al.	2015-09-03
Flame retardant thermoplastic resin composition and molded article produced from the same Grant 8,916,632 - Choi , et al. December 23, 2	2014-12-23
Thermoplastic Resin Composition and Molding Form for Same App 20140322487 - Choi; Dong Kil ; et al.	2014-10-30
Thermoplastic Resin Composition and Molded Article Including the Same App 20140323642 - CHOI; Dong Kil ; et al.	2014-10-30
Flame Retardant Thermoplastic Resin Composition and Article Comprising the Same App 20140323625 - KIM; Pil Ho ; et al.	2014-10-30
Flame Retardant Thermoplastic Resin Composition and Molded Article Produced from the Same App 20140187690 - CHOI; Dong Kil ; et al.	2014-07-03
Transparent thermoplastic resin composition with improved impact strength and melt flow index Grant 8,288,494 - Kwon , et al. October 16, 2	2012-10-16
Transparent Thermoplastic Resin Composition with Improved Impact Strength and Melt Flow Index App 20110160383 - Kwon; Kee Hae ; et al.	2011-06-30

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