Choi; DaeSik

Patent Applications and Registrations

Patent applications and USPTO patent grants for Choi; DaeSik.The latest application filed is for "semiconductor device and method of using partial wafer singulation for improved wafer level embedded system in package".

Company Profile

1.132.113

Choi; DaeSik - Seoul KR
Choi; Daesik - Yongin-Si KR
Choi; Daesik - Daejeon KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device and method of using partial wafer singulation for improved wafer level embedded system in package Grant 10,665,534 - Lee , et al.	2020-05-26
Semiconductor device and method of forming a low profile dual-purpose shield and heat-dissipation structure Grant 10,163,744 - Kim , et al. Dec	2018-12-25
Semiconductor device and method of forming WLCSP with semiconductor die embedded within interconnect structure Grant 10,068,877 - Lee , et al. September 4, 2	2018-09-04
Semiconductor Device and Method of Using Partial Wafer Singulation for Improved Wafer Level Embedded System In Package App 20180019195 - Lee; KyungHoon ; et al.	2018-01-18
Semiconductor device and method of using partial wafer singulation for improved wafer level embedded system in package Grant 9,799,590 - Lee , et al. October 24, 2	2017-10-24
Integrated circuit packaging system with chip stacking and method of manufacture thereof Grant 9,530,753 - Kim , et al. December 27, 2	2016-12-27
Semiconductor device and method of controlling warpage in semiconductor package Grant 9,406,579 - Choi , et al. August 2, 2	2016-08-02
Semiconductor Device and Method of Forming WLCSP with Semiconductor Die Embedded Within Interconnect Structure App 20160218089 - Lee; KyungHoon ; et al.	2016-07-28
Semiconductor device and method of backgrinding and singulation of semiconductor wafer while reducing kerf shifting and protecting wafer surfaces Grant 9,401,289 - Kim , et al. July 26, 2	2016-07-26
Semiconductor device and method of depositing underfill material with uniform flow rate Grant 9,390,945 - Lee , et al. July 12, 2	2016-07-12
Semiconductor device and method of mounting cover to semiconductor die and interposer with adhesive material Grant 9,378,983 - Choi , et al. June 28, 2	2016-06-28
Semiconductor device and method of forming interconnect structure with conductive pads having expanded interconnect surface area for enhanced interconnection properties Grant 9,373,578 - Choi , et al. June 21, 2	2016-06-21
Semiconductor device and method of forming WLCSP with semiconductor die embedded within interconnect structure Grant 9,349,616 - Lee , et al. May 24, 2	2016-05-24
Integrated circuit packaging system with package stacking Grant 9,349,666 - Bae , et al. May 24, 2	2016-05-24
Semiconductor device and method of forming POP with stacked semiconductor die and bumps formed directly on the lower die Grant 9,324,659 - Cho , et al. April 26, 2	2016-04-26
Semiconductor device and method of forming leadframe with conductive bodies for vertical electrical interconnect of semiconductor die Grant 9,312,218 - Choi , et al. April 12, 2	2016-04-12
Semiconductor package and method of mounting semiconductor die to opposite sides of TSV substrate Grant 9,305,897 - Choi , et al. April 5, 2	2016-04-05
Semiconductor device and method of forming thermal interface material and heat spreader over semiconductor die Grant 9,281,228 - Choi , et al. March 8, 2	2016-03-08
Semiconductor device and method of forming multi-layered UBM with intermediate insulating buffer layer to reduce stress for semiconductor wafer Grant 9,252,093 - Choi , et al. February 2, 2	2016-02-02
Semiconductor device and method of stacking semiconductor die in mold laser package interconnected by bumps and conductive vias Grant 9,252,032 - Choi , et al. February 2, 2	2016-02-02
Semiconductor device and method of forming an interconnect structure with conductive material recessed within conductive ring over surface of conductive pillar Grant 9,252,094 - Choi , et al. February 2, 2	2016-02-02
Semiconductor Die and Method of Forming FO-WLCSP Vertical Interconnect Using TSV and TMV App 20150357274 - Choi; DaeSik ; et al.	2015-12-10
Semiconductor device and method of forming a stackable semiconductor package with vertically-oriented discrete electrical devices as interconnect structures Grant 9,190,297 - Choi , et al. November 17, 2	2015-11-17
Semiconductor die and method of forming Fo-WLCSP vertical interconnect using TSV and TMV Grant 9,153,494 - Choi , et al. October 6, 2	2015-10-06
Semiconductor device with protective layer over exposed surfaces of semiconductor die Grant 9,142,515 - Pagaila , et al. September 22, 2	2015-09-22
Integrated circuit packaging system with vertical interconnection and method of manufacture thereof Grant 9,093,392 - Cho , et al. July 28, 2	2015-07-28
Integrated circuit packaging system with posts and method of manufacture thereof Grant 9,082,887 - Choi , et al. July 14, 2	2015-07-14
Integrated circuit packaging system with interconnects Grant 9,059,108 - Choi , et al. June 16, 2	2015-06-16
Integrated circuit packaging system with perimeter antiwarpage structure and method of manufacture thereof Grant 8,994,192 - Choi March 31, 2	2015-03-31
Integrated circuit package and method for manufacturing the same Grant 8,941,225 - Choi , et al. January 27, 2	2015-01-27
Semiconductor die and method of forming Fo-WLCSP vertical interconnect using TSV and TMV Grant 8,895,440 - Choi , et al. November 25, 2	2014-11-25
Semiconductor device with bump formed on substrate to prevent ELK ILD delamination during reflow process Grant 8,884,339 - Jang , et al. November 11, 2	2014-11-11
Integrated Circuit Package And Method For Manufacturing The Same App 20140312481 - CHOI; Daesik ; et al.	2014-10-23
Semiconductor Device and Method of Forming Bump Interconnect Structure with Conductive Layer Over Buffer Layer App 20140312512 - Choi; DaeSik	2014-10-23
Integrated circuit packaging system with conductive pillars and molded cavities and method of manufacture thereof Grant 8,853,855 - Lee , et al. October 7, 2	2014-10-07
Semiconductor Device and Method of Forming WLCSP with Semiconductor Die Embedded within Interconnect Structure App 20140264905 - Lee; KyungHoon ; et al.	2014-09-18
Semiconductor Device and Method of Using Partial Wafer Singulation for Improved Wafer Level Embedded System in Package App 20140264817 - Lee; KyungHoon ; et al.	2014-09-18
Integrated circuit package system having cavity Grant 8,823,160 - Ha , et al. September 2, 2	2014-09-02
Semiconductor Device and Method of Forming Interconnect Structure with Conductive Pads Having Expanded Interconnect Surface Area for Enhanced Interconnection Properties App 20140175642 - Choi; DaeSik ; et al.	2014-06-26
Integrated circuit packaging system with underfill and method of manufacture thereof Grant 8,748,233 - Choi , et al. June 10, 2	2014-06-10
Integrated circuit packaging system having warpage prevention structures Grant 8,723,310 - Park , et al. May 13, 2	2014-05-13
Integrated circuit packaging system with heat slug and method of manufacture thereof Grant 8,710,640 - Choi , et al. April 29, 2	2014-04-29
Semiconductor device and method of forming interconnect structure with conductive pads having expanded interconnect surface area for enhanced interconnection properties Grant 8,709,935 - Choi , et al. April 29, 2	2014-04-29
Integrated circuit packaging system with coupling features and method of manufacture thereof Grant 8,710,670 - Kim , et al. April 29, 2	2014-04-29
Semiconductor Package and Method of Mounting Semiconductor Die to Opposite Sides of TSV Substrate App 20140110860 - Choi; DaeSik ; et al.	2014-04-24
Integrated circuit packaging system with external wire connection and method of manufacture thereof Grant 8,703,538 - Choi April 22, 2	2014-04-22
Integrated circuit packaging system with warpage preventing mechanism and method of manufacture thereof Grant 8,703,535 - Kim , et al. April 22, 2	2014-04-22
Integrated circuit packaging system with stack device Grant 8,698,297 - Bae , et al. April 15, 2	2014-04-15
Integrated circuit packaging system with encapsulation and underfill and method of manufacture thereof Grant 8,685,797 - Park , et al. April 1, 2	2014-04-01
Integrated circuit packaging system with heat conduction and method of manufacture thereof Grant 8,679,900 - Choi , et al. March 25, 2	2014-03-25
Semiconductor Device with Protective Layer Over Exposed Surfaces of Semiconductor Die App 20140077344 - Pagaila; Reza A. ; et al.	2014-03-20
Semiconductor Device and Method of Forming Multi-Layered UBM with Intermediate Insulating Buffer Layer to Reduce Stress for Semiconductor Wafer App 20140070410 - Choi; DaeSik ; et al.	2014-03-13
Semiconductor package and method of mounting semiconductor die to opposite sides of TSV substrate Grant 8,648,469 - Choi , et al. February 11, 2	2014-02-11
Semiconductor device and method of forming protective layer over exposed surfaces of semiconductor die Grant 8,642,381 - Pagaila , et al. February 4, 2	2014-02-04
Semiconductor device and method of forming multi-layered UBM with intermediate insulating buffer layer to reduce stress for semiconductor wafer Grant 8,642,469 - Choi , et al. February 4, 2	2014-02-04
Integrated circuit packaging system with step mold and method of manufacture thereof Grant 8,633,058 - Choi , et al. January 21, 2	2014-01-21
Semiconductor Device and Method of Forming Electrical Interconnection Between Semiconductor Die and Substrate with Continuous Body of Solder Tape App 20140008783 - Cho; SungWon ; et al.	2014-01-09
Integrated Circuit Packaging System With Warpage Prevention Mechanism And Method Of Manufacture Thereof App 20130334714 - Park; YiSu ; et al.	2013-12-19
Integrated Circuit Packaging System With Film Assist And Method Of Manufacture Thereof App 20130328220 - Lee; KyungHoon ; et al.	2013-12-12
Integrated Circuit Packaging System With Warpage Preventing Mechanism And Method Of Manufacture Thereof App 20130328179 - Kim; MinJung ; et al.	2013-12-12
Integrated circuit packaging system with dual side mold and method of manufacture thereof Grant 8,603,859 - Yang , et al. December 10, 2	2013-12-10
Semiconductor Device and Method of Backgrinding and Singulation of Semiconductor Wafer while Reducing Kerf Shifting and Protecting Wafer Surfaces App 20130320519 - Kim; MinJung ; et al.	2013-12-05
Integrated circuit packaging system with package-on-package stacking and method of manufacture thereof Grant 8,592,973 - Park , et al. November 26, 2	2013-11-26
Semiconductor Die and Method of Forming FO-WLCSP Vertical Interconnect Using TSV and TMV App 20130299973 - Choi; DaeSik ; et al.	2013-11-14
Semiconductor Device and Method of Depositing Underfill Material With Uniform Flow Rate App 20130299995 - Lee; KyungHoon ; et al.	2013-11-14
Semiconductor Device and Method of Controlling Warpage in Semiconductor Package App 20130300004 - Choi; DaeSik ; et al.	2013-11-14
Semiconductor device and method of forming electrical interconnection between semiconductor die and substrate with continuous body of solder tape Grant 8,574,964 - Cho , et al. November 5, 2	2013-11-05
Integrated circuit package system with stackable devices and a method of manufacture thereof Grant 8,559,185 - Lee , et al. October 15, 2	2013-10-15
Semiconductor Device and Method of Forming Bump on Substrate to Prevent ELK ILD Delamination During Reflow Process App 20130264705 - Jang; KiYoun ; et al.	2013-10-10
Integrated circuit packaging system with interconnects and method of manufacture thereof Grant 8,546,194 - Choi , et al. October 1, 2	2013-10-01
Integrated Circuit Packaging System With Conductive Pillars And Molded Cavities And Method Of Manufacture Thereof App 20130241053 - Lee; KyungHoon ; et al.	2013-09-19
Semiconductor Device and Method of Mounting Cover to Semiconductor Die and Interposer with Adhesive Material App 20130241039 - Choi; DaeSik ; et al.	2013-09-19
Integrated Circuit Packaging System With Interconnects And Method Of Manufacture Thereof App 20130221543 - Choi; DaeSik ; et al.	2013-08-29
Semiconductor device and method of forming WLCSP structure using protruded MLP Grant 8,519,544 - Kim , et al. August 27, 2	2013-08-27
Integrated circuit packaging system with stackable package and method of manufacture thereof Grant 8,518,752 - Yang , et al. August 27, 2	2013-08-27
Semiconductor device including bump formed on substrate to prevent extremely-low dielectric constant (ELK) interlayer dielectric layer (ILD) delamination during reflow process Grant 8,519,536 - Jang , et al. August 27, 2	2013-08-27
Integrated circuit packaging system with routable underlayer and method of manufacture thereof Grant 8,513,057 - Kim , et al. August 20, 2	2013-08-20
Integrated circuit packaging system with vertical interconnection and method of manufacture thereof Grant 8,502,387 - Choi , et al. August 6, 2	2013-08-06
Integrated circuit packaging system with lead frame stacking module and method of manufacture thereof Grant 8,481,420 - Ha , et al. July 9, 2	2013-07-09
Semiconductor device and method of mounting cover to semiconductor die and interposer with adhesive material Grant 8,476,115 - Choi , et al. July 2, 2	2013-07-02
Integrated Circuit Packaging System With Heat Slug And Method Of Manufacture Thereof App 20130154078 - Choi; DaeSik ; et al.	2013-06-20
Semiconductor Device and Method of Forming Interconnect Structure with Conductive Pads Having Expanded Interconnect Surface Area for Enhanced Interconnection Properties App 20130154090 - Choi; DaeSik ; et al.	2013-06-20
Integrated Circuit Packaging System With Coupling Features And Method Of Manufacture Thereof App 20130154107 - Kim; MinJung ; et al.	2013-06-20
Integrated Circuit Packaging System With Interconnects And Method Of Manufacture Thereof App 20130157418 - Choi; JoonYoung ; et al.	2013-06-20
Integrated Circuit Packaging System With Perimeter Antiwarpage Structure And Method Of Manufacture Thereof App 20130154116 - Choi; DaeSik	2013-06-20
Integrated Circuit Packaging System With Heat Conduction And Method Of Manufacture Thereof App 20130154085 - Choi; DaeSik ; et al.	2013-06-20
Integrated circuit packaging system with stack interconnect and method of manufacture thereof Grant 8,466,567 - Choi , et al. June 18, 2	2013-06-18
Integrated circuit packaging system with rounded interconnect Grant 8,461,680 - Bae , et al. June 11, 2	2013-06-11
Semiconductor Device and Method of Forming Sloped Surface in Patterning Layer to Separate Bumps of Semiconductor Die from Patterning Layer App 20130113118 - Kim; MinJung ; et al.	2013-05-09
Semiconductor Device and Method of Forming Thermal Interface Material and Heat Spreader Over Semiconductor Die App 20130105963 - Choi; DaeSik ; et al.	2013-05-02
Semiconductor Device and Method of Forming Bump on Substrate to Prevent ELK ILD Delamination During Reflow Process App 20130087913 - Jang; KiYoun ; et al.	2013-04-11
Integrated circuit package system including honeycomb molding Grant 8,409,921 - Kuan , et al. April 2, 2	2013-04-02
Semiconductor device and method of forming interconnect structure with conductive pads having expanded interconnect surface area for enhanced interconnection properties Grant 8,409,979 - Choi , et al. April 2, 2	2013-04-02
Integrated circuit packaging system with underfill and method of manufacture thereof Grant 8,409,923 - Kim , et al. April 2, 2	2013-04-02
Integrated Circuit Packaging System With External Wire Connection And Method Of Manufacture Thereof App 20130075916 - Choi; DaeSik	2013-03-28
Integrated Circuit Packaging System With Package Stacking And Method Of Manufacture Thereof App 20130075926 - Bae; JoHyun ; et al.	2013-03-28
Integrated Circuit Packaging System With Chip Stacking And Method Of Manufacture Thereof App 20130075915 - Kim; DaeSup ; et al.	2013-03-28
Integrated circuit packaging system with stacked configuration and method of manufacture thereof Grant 8,405,197 - Ha , et al. March 26, 2	2013-03-26
Integrated Circuit Packaging System With Dual Side Mold And Method Of Manufacture Thereof App 20130069240 - Yang; DeokKyung ; et al.	2013-03-21
Integrated Circuit Packaging System With Routable Underlayer And Method Of Manufacture Thereof App 20130069224 - Kim; Oh Han ; et al.	2013-03-21
Semiconductor Device and Method of Forming a Low Profile Dual-Purpose Shield and Heat-Dissipation Structure App 20130056862 - Kim; OhHan ; et al.	2013-03-07
Semiconductor Device and Method of Forming TIM Within Recesses of MUF Material App 20130049188 - Choi; DaeSik ; et al.	2013-02-28
Integrated circuit package system employing an offset stacked configuration and method for manufacturing thereof Grant 8,383,458 - Choi , et al. February 26, 2	2013-02-26
Semiconductor Device and Method of Forming a Stackable Semiconductor Package with Vertically-Oriented Discrete Electrical Devices as Interconnect Structures App 20130037936 - Choi; DaeSik ; et al.	2013-02-14
Semiconductor Device and Method of Forming POP With Stacked Semiconductor Die and Bumps Formed Directly on the Lower Die App 20130032952 - Cho; SungWon ; et al.	2013-02-07
Semiconductor method of forming bump on substrate to prevent ELK ILD delamination during reflow process Grant 8,367,467 - Jang , et al. February 5, 2	2013-02-05
Semiconductor Device and Method of Forming a Wafer Level Package Structure Using Conductive Via and Exposed Bump App 20130001773 - Cho; SungWon ; et al.	2013-01-03
Integrated Circuit Packaging System With Underfill And Method Of Manufacture Thereof App 20120326291 - Choi; DaeSik ; et al.	2012-12-27
Integrated Circuit Packaging System With Underfill And Method Of Manufacture Thereof App 20120319300 - Kim; Oh Han ; et al.	2012-12-20
Integrated Circuit Packaging System With Encapsulation And Underfill And Method Of Manufacture Thereof App 20120319266 - Park; Soo-San ; et al.	2012-12-20
Semiconductor Device and Method of Forming Interconnect Structure With Conductive Pads Having Expanded Interconnect Surface Area for Enhanced Interconnection Properties App 20120306104 - Choi; DaeSik ; et al.	2012-12-06
Semiconductor Device and Method of Forming WLCSP Structure using Protruded MLP App 20120306097 - Kim; OhHan ; et al.	2012-12-06
Semiconductor Device and Method of Stacking Semiconductor Die in Mold Laser Package Interconnected By Bumps and Conductive Vias App 20120299174 - Choi; DaeSik ; et al.	2012-11-29
Semiconductor Device and Method of Forming Leadframe with Conductive Bodies for Vertical Electrical Interconnect of Semiconductor Die App 20120286407 - Choi; DaeSik ; et al.	2012-11-15
Semiconductor Device and Method of Mounting Cover to Semiconductor Die and Interposer with Adhesive Material App 20120280374 - Choi; DaeSik ; et al.	2012-11-08
Semiconductor Device and Method of Forming Bump Interconnect Structure with Conductive Layer Over Buffer Layer App 20120273937 - Choi; DaeSik	2012-11-01
Semiconductor Device and Method of Forming an Interconnect Structure with Conductive Material Recessed Within Conductive Ring Over Surface of Conductive Pillar App 20120273938 - Choi; DaeSik ; et al.	2012-11-01
Semiconductor device and method of forming a wafer level package structure using conductive via and exposed bump Grant 8,288,203 - Cho , et al. October 16, 2	2012-10-16
Integrated Circuit Packaging System With Step Mold And Method Of Manufacture Thereof App 20120241979 - Choi; DaeSik ; et al.	2012-09-27
Integrated circuit packaging system with encapsulation and underfill and method of manufacture thereof Grant 8,273,607 - Park , et al. September 25, 2	2012-09-25
Semiconductor device and method of forming WLCSP structure using protruded MLP Grant 8,273,604 - Kim , et al. September 25, 2	2012-09-25
Integrated Circuit Packaging System With Lead Frame Stacking Module And Method Of Manufacture Thereof App 20120235307 - Ha; Jong-Woo ; et al.	2012-09-20
Integrated Circuit Package System With Stackable Devices And A Method Of Manufacture Thereof App 20120228767 - Lee; Sang-Ho ; et al.	2012-09-13
Semiconductor device and method of stacking semiconductor die in mold laser package interconnected by bumps and conductive vias Grant 8,263,435 - Choi , et al. September 11, 2	2012-09-11
Semiconductor Device and Method of Forming a Wafer Level Package Structure Using Conductive Via and Exposed Bump App 20120217629 - Cho; SungWon ; et al.	2012-08-30
Semiconductor Device and Method of Forming WLCSP Structure Using Protruded MLP App 20120211892 - Kim; OhHan ; et al.	2012-08-23
Semiconductor Device and Method of Forming Multi-Layered UBM with Intermediate Insulating Buffer Layer to Reduce Stress for Semiconductor Wafer App 20120211900 - Choi; DaeSik ; et al.	2012-08-23
Integrated circuit packaging system with conductive pillars and method of manufacture thereof Grant 8,232,141 - Choi , et al. July 31, 2	2012-07-31
Integrated Circuit Packaging System With Vertical Interconnection And Method Of Manufacture Thereof App 20120146229 - Cho; SungWon ; et al.	2012-06-14
Integrated Circuit Packaging System With Vertical Interconnection And Method Of Manufacture Thereof App 20120146235 - Choi; DaeSik ; et al.	2012-06-14
Integrated circuit package system for stackable devices Grant 8,189,344 - Lee , et al. May 29, 2	2012-05-29
Integrated Circuit Packaging System With Device Mount And Method Of Manufacture Thereof App 20120119345 - Cho; SungWon ; et al.	2012-05-17
Semiconductor Device and Method of Stacking Semiconductor Die in Mold Laser Package Interconnected by Bumps and Conductive Vias App 20120104624 - Choi; DaeSik ; et al.	2012-05-03
Battery module of improved safety and middle or large-sized battery pack containing the same Grant 8,168,317 - Yoon , et al. May 1, 2	2012-05-01
Integrated Circuit Packaging System With Stack Interconnect And Method Of Manufacture Thereof App 20120068319 - Choi; DaeSik ; et al.	2012-03-22
Semiconductor Die and Method of Forming FO-WLCSP Vertical Interconnect Using TSV and TMV App 20120032340 - Choi; DaeSik ; et al.	2012-02-09
Integrated Circuit Packaging System With Rounded Interconnect App 20120025374 - Bae; JoHyun ; et al.	2012-02-02
Semiconductor Device and Method of Forming Protective Layer Over Exposed Surfaces of Semiconductor Die App 20120012990 - Pagaila; Reza A. ; et al.	2012-01-19
Integrated Circuit Packaging System With Encapsulation And Underfill And Method Of Manufacture Thereof App 20110312133 - Park; Soo-San ; et al.	2011-12-22
Integrated Circuit Packaging System With Posts And Method Of Manufacture Thereof App 20110291264 - Choi; DaeSik ; et al.	2011-12-01
Integrated circuit package system for stackable devices Grant 8,067,307 - Choi , et al. November 29, 2	2011-11-29
Semiconductor package system with through silicon via interposer Grant 8,063,475 - Choi , et al. November 22, 2	2011-11-22
Semiconductor Device and Method of Forming Bump on Substrate to Prevent ELK ILD Delamination During Reflow Process App 20110260316 - Jang; KiYoun ; et al.	2011-10-27
Semiconductor Device and Method of Forming Electrical Interconnection Between Semiconductor Die and Substrate with Continuous Body of Solder Tape App 20110254146 - Cho; SungWon ; et al.	2011-10-20
Integrated circuit packaging system with rounded interconnect and method of manufacture thereof Grant 8,039,275 - Bae , et al. October 18, 2	2011-10-18
Semiconductor package and method of mounting semiconductor die to opposite sides of TSV substrate Grant 8,008,121 - Choi , et al. August 30, 2	2011-08-30
Integrated circuit packaging system having an internal structure protrusion and method of manufacture thereof Grant 7,994,625 - Choi , et al. August 9, 2	2011-08-09
Battery Module Of Improved Safety And Middle Or Large-sized Battery Pack Containing The Same App 20110189515 - YOON; Hee Soo ; et al.	2011-08-04
Integrated Circuit Packaging System With Conductive Pillars And Method Of Manufacture Thereof App 20110180935 - Choi; DaeSik ; et al.	2011-07-28
Integrated Circuit Packaging System With Stackable Package And Method Of Manufacture Thereof App 20110127662 - Yang; DeokKyung ; et al.	2011-06-02
Battery module of improved safety and middle or large-sized battery pack containing the same Grant 7,943,252 - Yoon , et al. May 17, 2	2011-05-17
Semiconductor Package and Method of Mounting Semiconductor Die to Opposite Sides of TSV Substrate App 20110101512 - Choi; DaeSik ; et al.	2011-05-05
Integrated Circuit Packaging System With Package-on-package Stacking And Method Of Manufacture Thereof App 20110089552 - Park; HyungSang ; et al.	2011-04-21
Integrated Circuit Package System Employing An Offset Stacked Configuration And Method For Manufacturing Thereof App 20110084373 - Choi; DaeSik ; et al.	2011-04-14
Integrated circuit packaging system with conductive pillars and method of manufacture thereof Grant 7,923,304 - Choi , et al. April 12, 2	2011-04-12
Integrated Circuit Packaging System With Conductive Pillars And Method Of Manufacture Thereof App 20110057308 - Choi; DaeSik ; et al.	2011-03-10
Integrated circuit package system employing an offset stacked configuration Grant 7,872,340 - Choi , et al. January 18, 2	2011-01-18
Battery Module Of Improved Safety And Middle Or Large-sized Battery Pack Containing The Same App 20100297482 - Yoon; Hee Soo ; et al.	2010-11-25
Integrated Circuit Package System Including Honeycomb Molding App 20100279504 - Kuan; Heap Hoe ; et al.	2010-11-04
Integrated Circuit Packaging System With Stacked Configuration And Method Of Manufacture Thereof App 20100244217 - Ha; Jong-Woo ; et al.	2010-09-30
N grouping of traffic and pattern-free internet worm response system and method using N grouping of traffic Grant 7,779,467 - Choi , et al. August 17, 2	2010-08-17
Integrated Circuit Packaging System Having An Internal Structure Protrusion And Method Of Manufacture Thereof App 20100123232 - Choi; DaeSik ; et al.	2010-05-20
Semiconductor Package System With Through Silicon Via Interposer App 20100078789 - Choi; DaeSik ; et al.	2010-04-01
Integrated Circuit Package System Having Cavity App 20100044878 - Ha; Jong-Woo ; et al.	2010-02-25
Integrated Circuit Package System For Stackable Devices App 20090303690 - Lee; Sang-Ho ; et al.	2009-12-10
Integrated Circuit Package System For Stackable Devices App 20090212408 - Choi; DaeSik ; et al.	2009-08-27
Integrated Circuit Package System With Flip Chip App 20090152740 - Park; Soo-San ; et al.	2009-06-18
Integrated Circuit Package System Employing An Offset Stacked Configuration App 20090057864 - Choi; DaeSik ; et al.	2009-03-05
System and method for detecting internet worm traffics through classification of traffic characteristics by types App 20070226803 - Kim; Woonyon ; et al.	2007-09-27
N grouping of traffic and pattern-free Internet worm response system and method using N grouping of traffic App 20070150958 - Choi; Daesik ; et al.	2007-06-28