CHOI; Bongsuk

Patent Applications and Registrations

Patent applications and USPTO patent grants for CHOI; Bongsuk.The latest application filed is for "electronic device including flexible display".

Company Profile

4.7.11

CHOI; Bongsuk - Suwon-si KR
CHOI; Bongsuk - Gyeonggi-do KR
Choi; Bongsuk - Seoul KR
Choi; Bongsuk - Kyoungki-do N/A KR
Choi; Bongsuk - Singapore SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electronic Device Including Flexible Display App 20210352813 - CHO; Joongyeon ; et al.	2021-11-11
Electronic Device Including Fingerprint Sensor App 20210160354 - CHOI; Bongsuk ; et al.	2021-05-27
Electronic Device Including Rotating Optical Module App 20200329130 - CHOI; Bongsuk ; et al.	2020-10-15
Housing, Manufacturing Method Thereof, And Electronic Device Having The Housing App 20200287275 - SON; Kwonho ; et al.	2020-09-10
Housing, manufacturing method thereof, and electronic device having the housing Grant 10,665,924 - Son , et al.	2020-05-26
Battery pack mounting structure and electronic device having the same Grant 10,051,096 - Baek , et al. August 14, 2	2018-08-14
Electronic Device For Measuring Biometric Information And Device For Charging The Electronic Device App 20170296088 - CHOI; Bongsuk	2017-10-19
Electronic device with cover Grant 9,578,759 - Seo , et al. February 21, 2	2017-02-21
Battery Pack Mounting Structure and Electronic Device Having the Same App 20160234361 - BAEK; Sangin ; et al.	2016-08-11
Housing, Manufacturing Method Thereof, And Electronic Device Having The Housing App 20160233573 - SON; Kwonho ; et al.	2016-08-11
Electronic Device With Cover App 20160234949 - SEO; Jaeil ; et al.	2016-08-11
Electronic system with vertical intermetallic compound Grant 8,709,934 - Kim , et al. April 29, 2	2014-04-29
Wafer level chip scale package system Grant 8,012,867 - Lee , et al. September 6, 2	2011-09-06
Electronic System With Vertical Intermetallic Compound App 20080303142 - Kim; BaeYong ; et al.	2008-12-11
Stacked integrated circuits package system with dense routability and high thermal conductivity Grant 7,445,962 - Choi , et al. November 4, 2	2008-11-04
Wafer Level Chip Scale Package System App 20070178667 - Lee; Koo Hong ; et al.	2007-08-02
Stacked Integrated Circuits Package System With Dense Routability And High Thermal Conductivity App 20060197209 - Choi; Bongsuk ; et al.	2006-09-07

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