| Patent | Date |
|---|
Semiconductor packages including stack modules comprised of interposing bridges and semiconductor dies
Grant 11,430,763 - Choi , et al. August 30, 2 | 2022-08-30 |
Semiconductor Package Including Stacked Semiconductor Chips
App 20220254756 - CHOI; Bok Kyu | 2022-08-11 |
Storage System Including A Decoupling Device Having A Plurality Of Unit Capacitors
App 20220173030 - CHOI; Bok Kyu | 2022-06-02 |
Stack packages including through mold via structures
Grant 11,342,315 - Eom , et al. May 24, 2 | 2022-05-24 |
Semiconductor Package Including Stacked Semiconductor Chips
App 20220068884 - CHOI; Bok Kyu | 2022-03-03 |
Storage system including a decoupling device having a plurality of unit capacitors
Grant 11,264,319 - Choi March 1, 2 | 2022-03-01 |
Storage System Including A Decoupling Device Having A Plurality Of Unit Capacitors
App 20220059452 - CHOI; Bok Kyu | 2022-02-24 |
Semiconductor package including stacked semiconductor chips
Grant 11,222,872 - Lee , et al. January 11, 2 | 2022-01-11 |
Stack packages with interposer bridge
Grant 11,217,564 - Choi January 4, 2 | 2022-01-04 |
Stack packages including an interconnection structure
Grant 11,205,638 - Choi December 21, 2 | 2021-12-21 |
Semiconductor packages including stacked sub-packages with interposing bridges
Grant 11,201,140 - Choi December 14, 2 | 2021-12-14 |
Stack Package Including Core Die Stacked Over A Controller Die
App 20210366874 - CHOI; Bok Kyu | 2021-11-25 |
Stack packages including vertically stacked sub-packages with interposer bridges
Grant 11,127,722 - Choi September 21, 2 | 2021-09-21 |
Semiconductor packages including modules stacked with interposing bridges
Grant 11,127,687 - Choi September 21, 2 | 2021-09-21 |
Stacked semiconductor package having heat dissipation structure
Grant 11,114,362 - Choi , et al. September 7, 2 | 2021-09-07 |
Semiconductor Packages Including Stack Modules Comprised Of Interposing Bridges And Semiconductor Dies
App 20210265307 - CHOI; Bok Kyu ; et al. | 2021-08-26 |
Semiconductor Packages Including Modules Stacked With Interposing Bridges
App 20210217700 - CHOI; Bok Kyu | 2021-07-15 |
Semiconductor Packages Including Stacked Sub-packages With Interposing Bridges
App 20210193622 - CHOI; Bok Kyu | 2021-06-24 |
Stack Packages Including Vertically Stacked Sub-packages With Interposer Bridges
App 20210175218 - CHOI; Bok Kyu | 2021-06-10 |
Semiconductor packages configured for measuring contact resistances and methods of obtaining contact resistances of the semiconductor packages
Grant 11,018,094 - Lee , et al. May 25, 2 | 2021-05-25 |
Stack Packages With Interposer Bridge
App 20210143128 - CHOI; Bok Kyu | 2021-05-13 |
Semiconductor packages including bridge die
Grant 10,991,640 - Kim , et al. April 27, 2 | 2021-04-27 |
Semiconductor packages including a bridge die
Grant 10,957,627 - Choi March 23, 2 | 2021-03-23 |
Semiconductor Package Including Stacked Semiconductor Chips
App 20210074679 - LEE; Chae-Sung ; et al. | 2021-03-11 |
Semiconductor packages having EMI shielding layers
Grant 10,923,434 - Choi , et al. February 16, 2 | 2021-02-16 |
Stacked Semiconductor Package Having Heat Dissipation Structure
App 20210005527 - CHOI; Bok Kyu ; et al. | 2021-01-07 |
Stack Packages Including An Interconnection Structure
App 20200381399 - CHOI; Bok Kyu | 2020-12-03 |
Semiconductor Packages Including A Bridge Die
App 20200294889 - CHOI; Bok Kyu | 2020-09-17 |
Semiconductor Packages Including Bridge Die
App 20200243422 - KIM; Jong Hoon ; et al. | 2020-07-30 |
Semiconductor Packages Configured For Measuring Contact Resistances And Methods Of Obtaining Contact Resistances Of The Semicond
App 20200191860 - LEE; Ki Yong ; et al. | 2020-06-18 |
Stack packages including through mold vias
Grant 10,665,570 - Eom , et al. | 2020-05-26 |
Semiconductor Packages Having Emi Shielding Layers
App 20190333865 - CHOI; Bok Kyu ; et al. | 2019-10-31 |
Stack Packages Including Through Mold Via Structures
App 20190333899 - EOM; Juil ; et al. | 2019-10-31 |
Stack Packages Including Through Mold Vias
App 20190333894 - EOM; Juil ; et al. | 2019-10-31 |
Electrode for electrochemical device with low resistance, method for manufacturing the same, and electrochemical device comprising the electrode
Grant 10,270,102 - Lee , et al. | 2019-04-23 |
Package Substrates With Signal Transmission Paths Relating To Parasitic Capacitance Values
App 20190080999 - EOM; Juil ; et al. | 2019-03-14 |
Method for prelithiation, method for fabricating lithium secondary battery comprising the method, and lithium secondary battery fabricated from the fabricating method
Grant 9,705,154 - Lee , et al. July 11, 2 | 2017-07-11 |
Package substrate with band stop filter and semiconductor package including the same
Grant 9,231,286 - Bang , et al. January 5, 2 | 2016-01-05 |
Electrode For Electrochemical Device With Low Resistance, Method For Manufacturing The Same, And Electrochemical Device Comprising The Electrode
App 20150270552 - Lee; Sang-Kyun ; et al. | 2015-09-24 |
Method For Prelithiation, Method For Fabricating Lithium Secondary Battery Comprising The Method, And Lithium Secondary Battery Fabricated From The Fabricating Method
App 20150017543 - Lee; Sang-Kyun ; et al. | 2015-01-15 |
Package Substrate With Band Stop Filter And Semiconductor Package Including The Same
App 20140176262 - BANG; Byung Jun ; et al. | 2014-06-26 |
Semiconductor package, stacked semiconductor package having the same, and a method for selecting one semiconductor chip in a stacked semiconductor package
Grant 8,168,450 - Choi May 1, 2 | 2012-05-01 |
Circuit board having conductive shield member and semiconductor package using the same
Grant 8,084,839 - Choi , et al. December 27, 2 | 2011-12-27 |
Circuit Board Having Conductive Shield Member And Semiconductor Package Using The Same
App 20100321900 - CHOI; Bok Kyu ; et al. | 2010-12-23 |
Semiconductor Package, Stacked Semiconductor Package Having The Same, And A Method For Selecting One Semiconductor Chip In A Stacked Semiconductor Package
App 20100253390 - CHOI; Bok Kyu | 2010-10-07 |
Circuit board having conductive shield member and semiconductor package using the same
Grant 7,808,072 - Choi , et al. October 5, 2 | 2010-10-05 |
Semiconductor package, stacked semiconductor package having the same, and a method for selecting one semiconductor chip in a stacked semiconductor package
Grant 7,768,114 - Choi August 3, 2 | 2010-08-03 |
Semiconductor Package, Stacked Semiconductor Package Having The Same, And A Method For Selecting One Semiconductor Chip In A Stacked Semiconductor Package
App 20090321910 - CHOI; Bok Kyu | 2009-12-31 |
Circuit Board Having Conductive Shield Member And Semiconductor Package Using The Same
App 20090224376 - CHOI; Bok Kyu ; et al. | 2009-09-10 |
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