Choi; Beomseok
Patent Applications and Registrations
Patent applications and USPTO patent grants for Choi; Beomseok.The latest application filed is for "gallium nitride (gan) three-dimensional integrated circuit technology".
- Choi; Beomseok - Chandler AZ
| Patent | Date |
|---|---|
| Multi-level distributed clamps Grant 11,380,652 - Choi , et al. July 5, 2 | 2022-07-05 |
| Integrated cross-domain power transfer voltage regulators Grant 11,353,900 - Choi , et al. June 7, 2 | 2022-06-07 |
| Gallium Nitride (gan) Three-dimensional Integrated Circuit Technology App 20220102344 - THEN; Han Wui ; et al. | 2022-03-31 |
| Gallium Nitride (gan) Three-dimensional Integrated Circuit Technology App 20220102339 - THEN; Han Wui ; et al. | 2022-03-31 |
| Two Stage Multi-input Multi-output Regulator App 20220094256 - RADHAKRISHNAN; Kaladhar ; et al. | 2022-03-24 |
| Magnetic Wires And Their Applications App 20220085143 - CHOI; Beomseok ; et al. | 2022-03-17 |
| Modular Coupled Magnetic Voltage Regulators App 20220085142 - CHOI; Beomseok | 2022-03-17 |
| Embedded Cooling Channel In Magnetics App 20220084740 - CHOI; Beomseok ; et al. | 2022-03-17 |
| Tandem Magnetics In Package App 20220084736 - CHOI; Beomseok ; et al. | 2022-03-17 |
| High-throughput Additively Manufactured Power Delivery Vias And Traces App 20210407903 - Elsherbini; Adel ; et al. | 2021-12-30 |
| Reconfigurable inductor Grant 11,211,866 - Lambert , et al. December 28, 2 | 2021-12-28 |
| Power Delivery Structures App 20210398895 - Elsherbini; Adel ; et al. | 2021-12-23 |
| Reconfigurable Inductor App 20210036618 - Lambert; WILLIAM J. ; et al. | 2021-02-04 |
| Multi-level Distributed Clamps App 20200251448 - Kind Code | 2020-08-06 |
| Integrated Mult-die Partitioned Voltage Regulator App 20200006292 - Choi; Beomseok ; et al. | 2020-01-02 |
| Integrated Cross-domain Power Transfer Voltage Regulators App 20200004282 - Choi; Beomseok ; et al. | 2020-01-02 |
| Integrated Heterogenous Power Management Circuitries App 20200006305 - Lambert; William J. ; et al. | 2020-01-02 |
| Package Stiffening Magnetic Core App 20200006250 - Hill; Michael J. ; et al. | 2020-01-02 |
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