Choi; A Leam

Patent Applications and Registrations

Patent applications and USPTO patent grants for Choi; A Leam.The latest application filed is for "integrated circuit packaging system with interposer and method of manufacture thereof".

Company Profile

1.15.13

Choi; A Leam - Ichon-si KR
Choi; A Leam - Guri-si KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Integrated circuit packaging system with vertical interconnects and method of manufacture thereof Grant 8,970,044 - Choi , et al. March 3, 2	2015-03-03
Integrated circuit packaging system with interposer and method of manufacture thereof Grant 8,699,232 - Choi , et al. April 15, 2	2014-04-15
Integrated circuit packaging system with encapsulation and method of manufacture thereof Grant 8,569,869 - Park , et al. October 29, 2	2013-10-29
Integrated circuit packaging system with interposer interconnections and method of manufacture thereof Grant 8,558,366 - Choi , et al. October 15, 2	2013-10-15
Integrated Circuit Packaging System With Interposer And Method Of Manufacture Thereof App 20130070438 - Choi; A Leam ; et al.	2013-03-21
Integrated Circuit Packaging System With Vertical Interconnects And Method Of Manufacture Thereof App 20120326325 - Choi; A Leam ; et al.	2012-12-27
Integrated Circuit Packaging System With Leads And Method Of Manufacture Thereof App 20120223435 - Choi; A Leam ; et al.	2012-09-06
Method for manufacturing package system incorporating flip-chip assembly Grant 8,183,089 - Choi , et al. May 22, 2	2012-05-22
Integrated Circuit Packaging System With Interposer Interconnections And Method Of Manufacture Thereof App 20120086115 - Choi; A Leam ; et al.	2012-04-12
Integrated circuit packaging system with a dual board-on-chip structure and method of manufacture thereof Grant 8,106,498 - Shin , et al. January 31, 2	2012-01-31
Integrated circuit packaging system having through silicon via with direct interconnects and method of manufacture thereof Grant 8,093,100 - Choi , et al. January 10, 2	2012-01-10
Integrated circuit packaging system with interposer interconnections and method of manufacture thereof Grant 8,080,446 - Choi , et al. December 20, 2	2011-12-20
Integrated Circuit Packaging System With Encapsulation And Method Of Manufacture Thereof App 20110233736 - Park; HyungSang ; et al.	2011-09-29
Integrated circuit package system with delamination prevention structure Grant 8,008,787 - Park , et al. August 30, 2	2011-08-30
Method For Manufacturing Package System Incorporating Flip-chip Assembly App 20110092021 - Choi; A Leam ; et al.	2011-04-21
Integrated Circuit Packaging System Having Through Silicon Via With Direct Interconnects And Method Of Manufacture Thereof App 20110062591 - Choi; A Leam ; et al.	2011-03-17
Integrated circuit packaging system having through silicon via with direct interconnects and method of manufacture thereof Grant 7,859,099 - Choi , et al. December 28, 2	2010-12-28
Package system incorporating a flip-chip assembly Grant 7,859,120 - Choi , et al. December 28, 2	2010-12-28
Integrated Circuit Packaging System With Interposer Interconnections And Method Of Manufacture Thereof App 20100301469 - Choi; A Leam ; et al.	2010-12-02
Integrated Circuit Packaging System With A Dual Board-on-chip Structure And Method Of Manufacture Thereof App 20100224975 - Shin; HanGil ; et al.	2010-09-09
Integrated Circuit Packaging System Having Through Silicon Via With Direct Interconnects And Method Of Manufacture Thereof App 20100148354 - Choi; A Leam ; et al.	2010-06-17
Package System Incorporating A Flip-chip Assembly App 20090283888 - Choi; A Leam ; et al.	2009-11-19
Integrated Circuit Package System With Delamination Prevention Structure App 20090072377 - Park; DongSam ; et al.	2009-03-19

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