Choe; Hyoun S.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Choe; Hyoun S..The latest application filed is for "method of depositing diffusion barrier for copper interconnect in integrated circuit".
- Choe; Hyoun S. - La Palma CA
- Choe; Hyoun S. - Waltham MA
| Patent | Date |
|---|---|
| Method of depositing diffusion barrier for copper interconnect in integrated circuit Grant 6,534,404 - Danek , et al. March 18, 2 | 2003-03-18 |
| Solid polymer electrolytes Grant 5,474,860 - Abraham , et al. December 12, 1 | 1995-12-12 |
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