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name:-0.0090141296386719
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Cho; Tai-heui Patent Filings

Cho; Tai-heui

Patent Applications and Registrations

Patent applications and USPTO patent grants for Cho; Tai-heui.The latest application filed is for "semiconductor device having contact plug and method of manufacturing the same".

Company Profile
0.6.13
  • Cho; Tai-heui - Suwon-si KR
  • CHO; Tai-Heui - Gyeonggi-do KR
  • Cho; Tai-heui - Suwon KR
  • Cho, Tai-heui - Suwon-city KR
  • Cho, Tai-Heui - Seoul KR
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Semiconductor Device Having Contact Plug And Method Of Manufacturing The Same
App 20140327056 - Park; Jung-hwan ;   et al.
2014-11-06
Semiconductor Device Having Fuse Pattern And Methods Of Fabricating The Same
App 20090236688 - CHO; Tai-Heui ;   et al.
2009-09-24
Semiconductor device having fuse pattern and methods of fabricating the same
Grant 7,556,989 - Cho , et al. July 7, 2
2009-07-07
Method of fabricating a semiconductor device and semiconductor device fabricated thereby
App 20080029899 - Song; Du-heon ;   et al.
2008-02-07
Method of forming a pattern and method of manufacturing a semiconductor device using the same
App 20070269979 - Cho; Tai-Heui
2007-11-22
Integrated circuit devices having corrosion resistant fuse regions and methods of fabricating the same
App 20070114635 - Cho; Tai-Heui ;   et al.
2007-05-24
Integrated circuit devices having corrosion resistant fuse regions and methods of fabricating the same
Grant 7,180,154 - Cho , et al. February 20, 2
2007-02-20
Semiconductor device having fuse pattern and methods of fabricating the same
App 20060214260 - Cho; Tai-Heui ;   et al.
2006-09-28
Semiconductor device having multilevel interconnections and method of manufacturing the same
Grant 7,074,712 - Cho July 11, 2
2006-07-11
Bonding pad structure of a semiconductor device
Grant 6,984,895 - Cho , et al. January 10, 2
2006-01-10
Bonding pad structure of a semiconductor device and method for manufacturing the same
Grant 6,867,070 - Cho , et al. March 15, 2
2005-03-15
Semiconductor device having multilevel interconnections and method of manufacturing the same
App 20050003657 - Cho, Tai-heui
2005-01-06
Integrated circuit devices having corrosion resistant fuse regions and methods of fabricating the same
App 20040262768 - Cho, Tai-Heui ;   et al.
2004-12-30
Semiconductor device having multilevel interconnections and method of manufacturing the same
Grant 6,806,574 - Cho October 19, 2
2004-10-19
Bonding pad structure of a semiconductor device and method for manufacturing the same
App 20030136979 - Cho, Tai-Heui ;   et al.
2003-07-24
Bonding pad structure of a semiconductor device and method for manufacturing the same
App 20030094634 - Cho, Tai-Heui ;   et al.
2003-05-22
Semiconductor device having a contact window and fabrication method thereof
App 20030008453 - Kang, Hyuck-Jin ;   et al.
2003-01-09
Semiconductor device having multilevel interconnections and method of manufacturing the same
App 20020185740 - Cho, Tai-Heui
2002-12-12
Metal contact structure in semiconductor device and method for forming the same
App 20020070457 - Sun, Ho-Won ;   et al.
2002-06-13

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