| Patent | Date |
|---|
Electronic Device For Transmitting And Receiving Network Configuration Information And Operating Method Thereof
App 20220256327 - JANG; Wonjun ; et al. | 2022-08-11 |
Electronic Device And Method For Performing Service Discovery In Electronic Device
App 20220182453 - JUNG; Buseop ; et al. | 2022-06-09 |
Electronic device and method for forming Wi-Fi direct group thereof
Grant 11,297,666 - Bang , et al. April 5, 2 | 2022-04-05 |
Method and apparatus for allocating IP address in wireless communication network
Grant 11,284,248 - Choi , et al. March 22, 2 | 2022-03-22 |
Semiconductor device and method of using leadframe bodies to form openings through encapsulant for vertical interconnect of semiconductor die
Grant 10,903,183 - Chi , et al. January 26, 2 | 2021-01-26 |
Device And Method For Transmitting Signals In Plurality Of Frequency Bands
App 20200404477 - JUNG; Buseop ; et al. | 2020-12-24 |
Electronic Device And Method For Forming Wi-fi Direct Group Thereof
App 20200288521 - BANG; Hyejung ; et al. | 2020-09-10 |
Electronic device and method for forming Wi-Fi direct group thereof
Grant 10,674,555 - Bang , et al. | 2020-06-02 |
Semiconductor device and method of forming ultra thin multi-die face-to-face WLCSP
Grant 10,573,600 - Chi , et al. Feb | 2020-02-25 |
Method and device for establishing communication connection
Grant 10,548,178 - Jung , et al. Ja | 2020-01-28 |
Semiconductor device and method of forming 3D dual side die embedded build-up semiconductor package
Grant 10,510,703 - Chi , et al. Dec | 2019-12-17 |
Method And Apparatus For Allocating Ip Address In Wireless Communication Network
App 20190335322 - Choi; Jongmu ; et al. | 2019-10-31 |
Method and apparatus for allocating IP address in wireless communication network
Grant 10,397,773 - Choi , et al. A | 2019-08-27 |
Electronic Device And Method For Forming Wi-fi Direct Group Thereof
App 20190053302 - BANG; Hyejung ; et al. | 2019-02-14 |
Method And Apparatus For Allocating Ip Address In Wireless Communication Network
App 20180139605 - Choi; Jongmu ; et al. | 2018-05-17 |
Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor die
Grant 9,966,335 - Cho , et al. May 8, 2 | 2018-05-08 |
Method and apparatus for allocating IP address in wireless communication network
Grant 9,894,516 - Choi , et al. February 13, 2 | 2018-02-13 |
Semiconductor device and method of forming vertical interconnect in FO-WLCSP using leadframe disposed between semiconductor die
Grant 9,842,808 - Shin , et al. December 12, 2 | 2017-12-12 |
Semiconductor Device and Method of Forming Ultra Thin Multi-Die Face-to-Face WLCSP
App 20170309572 - Chi; HeeJo ; et al. | 2017-10-26 |
Semiconductor Device and Method of Forming 3D Dual Side Die Embedded Build-Up Semiconductor Package
App 20170250154 - Chi; HeeJo ; et al. | 2017-08-31 |
Integrated circuit packaging system with joint assembly and method of manufacture thereof
Grant 9,748,157 - Chi , et al. August 29, 2 | 2017-08-29 |
Semiconductor device and method of forming ultra thin multi-die face-to-face WLCSP
Grant 9,735,113 - Chi , et al. August 15, 2 | 2017-08-15 |
Method and apparatus for discovering device in wireless communication network
Grant 9,730,256 - Kim , et al. August 8, 2 | 2017-08-08 |
Method And Device For Establishing Communication Connection
App 20170196034 - Jung; Bu-Seop ; et al. | 2017-07-06 |
Semiconductor device and method of forming 3D dual side die embedded build-up semiconductor package
Grant 9,691,707 - Chi , et al. June 27, 2 | 2017-06-27 |
Method And Apparatus For Allocating Ip Address In Wireless Communication Network
App 20170164188 - Choi; Jongmu ; et al. | 2017-06-08 |
Method and apparatus for allocating IP address in wireless communication network
Grant 9,578,494 - Choi , et al. February 21, 2 | 2017-02-21 |
Semiconductor device with thin profile WLCSP with vertical interconnect over package footprint
Grant 9,558,965 - Chi , et al. January 31, 2 | 2017-01-31 |
Methods of forming conductive jumper traces
Grant 9,508,635 - Shin , et al. November 29, 2 | 2016-11-29 |
Carrier system with multi-tier conductive posts and method of manufacture thereof
Grant 9,496,152 - Cho , et al. November 15, 2 | 2016-11-15 |
Semiconductor Device and Method of Forming 3D Dual Side Die Embedded Build-Up Semiconductor Package
App 20160233168 - Chi; HeeJo ; et al. | 2016-08-11 |
Semiconductor device and method of forming pre-molded semiconductor die having bumps embedded in encapsulant
Grant 9,397,050 - Shin , et al. July 19, 2 | 2016-07-19 |
Semiconductor device and method of forming 3D dual side die embedded build-up semiconductor package
Grant 9,362,161 - Chi , et al. June 7, 2 | 2016-06-07 |
Integrated circuit package stacking system with shielding and method of manufacture thereof
Grant 9,355,939 - Cho , et al. May 31, 2 | 2016-05-31 |
Integrated circuit packaging system with single metal layer interposer and method of manufacture thereof
Grant 9,299,650 - Chi , et al. March 29, 2 | 2016-03-29 |
Semiconductor device and method of making an embedded wafer level ball grid array (EWLB) package on package (POP) device with a slotted metal carrier interposer
Grant 9,269,691 - Chi , et al. February 23, 2 | 2016-02-23 |
Semiconductor device with thin profile WLCSP with vertical interconnect over package footprint
Grant 9,269,595 - Chi , et al. February 23, 2 | 2016-02-23 |
Semiconductor device and method of forming open cavity in TSV interposer to contain semiconductor die in WLCSMP
Grant 9,263,332 - Chi , et al. February 16, 2 | 2016-02-16 |
Semiconductor Device and Method of Forming 3D Dual Side Die Embedded Build-Up Semiconductor Package
App 20150270237 - Chi; HeeJo ; et al. | 2015-09-24 |
Method And Apparatus For Discovering Device In Wireless Communication Network
App 20150257191 - KIM; Changsoon ; et al. | 2015-09-10 |
Semiconductor device and method of forming conductive posts and heat sink over semiconductor die using leadframe
Grant 9,064,859 - Chi , et al. June 23, 2 | 2015-06-23 |
Integrated circuit packaging system with redistribution layer and method of manufacture thereof
Grant 9,054,098 - Cho , et al. June 9, 2 | 2015-06-09 |
Method and apparatus for discovering device in wireless communication network
Grant 9,055,391 - Kim , et al. June 9, 2 | 2015-06-09 |
Semiconductor device and method of forming open cavity in TSV interposer to contain semiconductor die in WLCSMP
Grant 9,048,306 - Chi , et al. June 2, 2 | 2015-06-02 |
Semiconductor Device and Method of Forming Interposer Frame Electrically Connected to Embedded Semiconductor Die
App 20150123273 - Cho; NamJu ; et al. | 2015-05-07 |
Semiconductor Device and Method of Making an Embedded Wafer Level Ball Grid Array (EWLB) Package on Package (POP) Device With a Slotted Metal Carrier Interposer
App 20150091157 - Chi; HeeJo ; et al. | 2015-04-02 |
Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor die
Grant 8,932,907 - Cho , et al. January 13, 2 | 2015-01-13 |
Methods of Forming Conductive Jumper Traces
App 20150004748 - Shin; HanGil ; et al. | 2015-01-01 |
Methods of Forming Conductive Materials on Contact Pads
App 20150004750 - Chi; HeeJo ; et al. | 2015-01-01 |
Semiconductor Device and Method of Making an Embedded Wafer Level Ball Grid Array (EWLB) Package on Package (POP) Device With a Slotted Metal Carrier Interposer
App 20140367848 - Chi; HeeJo ; et al. | 2014-12-18 |
Semiconductor Device and Method of Using Leadframe Bodies to Form Openings Through Encapsulant for Vertical Interconnect of Semiconductor Die
App 20140361423 - Chi; HeeJo ; et al. | 2014-12-11 |
Semiconductor device and method of forming conductive layer over metal substrate for electrical interconnect of semiconductor die
Grant 8,901,755 - Chi , et al. December 2, 2 | 2014-12-02 |
Integrated circuit packaging system with package-on-package and method of manufacture thereof
Grant 8,749,040 - Chi , et al. June 10, 2 | 2014-06-10 |
Integrated circuit packaging system with encapsulation and method of manufacture thereof
Grant 8,716,065 - Chi , et al. May 6, 2 | 2014-05-06 |
Integrated circuit packaging system with an interposer and method of manufacture thereof
Grant 8,624,370 - Chi , et al. January 7, 2 | 2014-01-07 |
Integrated circuit packaging system with through silicon via base and method of manufacture thereof
Grant 8,587,129 - Chi , et al. November 19, 2 | 2013-11-19 |
Semiconductor Device and Method of Forming Open Cavity in TSV Interposer to Contain Semiconductor Die in WLCSMP
App 20130299974 - Chi; HeeJo ; et al. | 2013-11-14 |
Integrated circuit packaging system with embedded thermal heat shield and method of manufacture thereof
Grant 8,564,125 - Cho , et al. October 22, 2 | 2013-10-22 |
Semiconductor Device and Method of Forming Conductive Layer Over Metal Substrate for Electrical Interconnect of Semiconductor Die
App 20130249104 - Chi; HeeJo ; et al. | 2013-09-26 |
Integrated circuit package system with package stacking and method of manufacture thereof
Grant 8,541,872 - Cho , et al. September 24, 2 | 2013-09-24 |
Method And Apparatus For Discovering Device In Wireless Communication Network
App 20130223341 - KIM; Changsoon ; et al. | 2013-08-29 |
Method And Apparatus For Allocating Ip Address In Wireless Communication Network
App 20130223280 - Choi; Jongmu ; et al. | 2013-08-29 |
Integrated circuit packaging system with stiffener and method of manufacture thereof
Grant 8,492,888 - Chi , et al. July 23, 2 | 2013-07-23 |
Integrated circuit packaging system with intra substrate die and method of manufacture thereof
Grant 8,476,111 - Cho , et al. July 2, 2 | 2013-07-02 |
Integrated circuit packaging system with package-on-package and method of manufacture thereof
Grant 8,471,394 - Jang , et al. June 25, 2 | 2013-06-25 |
Integrated circuit package system with embedded die superstructure and method of manufacture thereof
Grant 8,455,300 - Chi , et al. June 4, 2 | 2013-06-04 |
Semiconductor Device and Method of Forming Conductive Posts and Heat Sink Over Semiconductor Die Using Leadframe
App 20130105970 - Chi; HeeJo ; et al. | 2013-05-02 |
Semiconductor Device and Method of Forming Interposer Frame Electrically Connected to Embedded Semiconductor Die
App 20130099378 - Cho; NamJu ; et al. | 2013-04-25 |
Integrated circuit packaging system with foldable substrate and method of manufacture thereof
Grant 8,421,203 - Chi , et al. April 16, 2 | 2013-04-16 |
Integrated Circuit Packaging System With Encapsulation And Method Of Manufacture Thereof
App 20130075927 - Chi; HeeJo ; et al. | 2013-03-28 |
Integrated Circuit Packaging System With Embedded Thermal Heat Shield And Method Of Manufacture Thereof
App 20130056864 - Cho; NamJu ; et al. | 2013-03-07 |
Integrated Circuit Packaging System With Stiffener And Method Of Manufacture Thereof
App 20130056863 - Chi; HeeJo ; et al. | 2013-03-07 |
Integrated circuit packaging system with package stacking and method of manufacture thereof
Grant 8,389,329 - Cho , et al. March 5, 2 | 2013-03-05 |
Integrated circuit packaging system with stacking interconnect and method of manufacture thereof
Grant 8,390,108 - Cho , et al. March 5, 2 | 2013-03-05 |
Integrated Circuit Packaging System With Redistribution Layer And Method Of Manufacture Thereof
App 20130049208 - Cho; NamJu ; et al. | 2013-02-28 |
Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor die
Grant 8,384,227 - Cho , et al. February 26, 2 | 2013-02-26 |
Semiconductor Device and Method of Forming Vertical Interconnect in FO-WLCSP Using Leadframe Disposed Between Semiconductor Die
App 20130026654 - Shin; HanGil ; et al. | 2013-01-31 |
Semiconductor device and method of forming conductive posts and heat sink over semiconductor die using leadframe
Grant 8,349,658 - Chi , et al. January 8, 2 | 2013-01-08 |
Semiconductor device and method of forming shielding layer after encapsulation and grounded through interconnect structure
Grant 8,350,368 - Chi , et al. January 8, 2 | 2013-01-08 |
Semiconductor Device and Method of Using Leadframe Bodies to Form Openings Through Encapsulant for Vertical Interconnect of Semiconductor Die
App 20130001762 - Chi; HeeJo ; et al. | 2013-01-03 |
Integrated Circuit Packaging System With Pads And Method Of Manufacture Thereof
App 20120319295 - Chi; HeeJo ; et al. | 2012-12-20 |
Integrated Circuit Packaging System With Intra Substrate Die And Method Of Manufacture Thereof
App 20120319263 - Cho; NamJu ; et al. | 2012-12-20 |
Integrated Circuit Packaging System With Package Stacking And Method Of Manufacture Thereof
App 20120306102 - Cho; NamJu ; et al. | 2012-12-06 |
Method of manufacture of integrated circuit packaging system with multi-tier conductive interconnects
Grant 8,318,539 - Cho , et al. November 27, 2 | 2012-11-27 |
Semiconductor device and method of forming vertical interconnect in FO-WLCSP using leadframe disposed between semiconductor die
Grant 8,318,541 - Shin , et al. November 27, 2 | 2012-11-27 |
Integrated circuit packaging system with shield and method of manufacture thereof
Grant 8,314,486 - Chi , et al. November 20, 2 | 2012-11-20 |
Semiconductor device and method of using leadframe bodies to form openings through encapsulant for vertical interconnect of semiconductor die
Grant 8,288,209 - Chi , et al. October 16, 2 | 2012-10-16 |
Integrated circuit packaging system with encapsulated via and method of manufacture thereof
Grant 8,264,091 - Cho , et al. September 11, 2 | 2012-09-11 |
Semiconductor Device and Method of Forming Open Cavity in TSV Interposer to Contain Semiconductor Die in WLCSMP
App 20120168916 - Chi; HeeJo ; et al. | 2012-07-05 |
Semiconductor Device and Method of Forming Thin Profile WLCSP with Vertical Interconnect over Package Footprint
App 20120153467 - Chi; HeeJo ; et al. | 2012-06-21 |
Semiconductor Device and Method of Forming Thin Profile WLCSP with Vertical Interconnect over Package Footprint
App 20120153505 - Chi; HeeJo ; et al. | 2012-06-21 |
Integrated circuit system with recessed through silicon via pads and method of manufacture thereof
Grant 8,202,797 - Chi , et al. June 19, 2 | 2012-06-19 |
Semiconductor Device and Method of Forming Interposer Frame Electrically Connected to Embedded Semiconductor Die
App 20120119388 - Cho; NamJu ; et al. | 2012-05-17 |
Integrated Circuit Packaging System With Flexible Substrate And Method Of Manufacture Thereof
App 20120119393 - Chi; HeeJo ; et al. | 2012-05-17 |
Semiconductor device and method of forming open cavity in TSV interposer to contain semiconductor die in WLCSMP
Grant 8,143,097 - Chi , et al. March 27, 2 | 2012-03-27 |
Method of forming thin profile WLCSP with vertical interconnect over package footprint
Grant 8,138,014 - Chi , et al. March 20, 2 | 2012-03-20 |
Semiconductor Device and Method of Forming Vertical Interconnect in FO-WLCSP Using Leadframe Disposed Between Semiconductor Die
App 20120038034 - Shin; HanGil ; et al. | 2012-02-16 |
Integrated Circuit Packaging System With Package-on-package And Method Of Manufacture Thereof
App 20120025398 - Jang; Ki Youn ; et al. | 2012-02-02 |
Integrated Circuit System With Recessed Through Silicon Via Pads And Method Of Manufacture Thereof
App 20110309492 - Chi; HeeJo ; et al. | 2011-12-22 |
Semiconductor Device and Method of Forming Shielding Layer After Encapsulation and Grounded Through Interconnect Structure
App 20110298105 - Chi; HeeJo ; et al. | 2011-12-08 |
Integrated Circuit Package System With Package Stacking And Method Of Manufacture Thereof
App 20110298119 - Cho; NamJu ; et al. | 2011-12-08 |
Integrated Circuit Package System With Embedded Die Superstructure And Method Of Manufacture Thereof
App 20110291283 - Chi; HeeJo ; et al. | 2011-12-01 |
Semiconductor Device and Method of Forming Conductive Posts and Heat Sink Over Semiconductor Die Using Leadframe
App 20110291249 - Chi; HeeJo ; et al. | 2011-12-01 |
Semiconductor Device and Method of Forming Ultra Thin Multi-Die Face-to-Face WLCSP
App 20110285007 - Chi; HeeJo ; et al. | 2011-11-24 |
Integrated circuit packaging system with package-on-package and method of manufacture thereof
Grant 8,035,235 - Jang , et al. October 11, 2 | 2011-10-11 |
Base package system for integrated circuit package stacking and method of manufacture thereof
Grant 8,022,538 - Ko , et al. September 20, 2 | 2011-09-20 |
Carrier System With Multi-tier Conductive Posts And Method Of Manufacture Thereof
App 20110220395 - Cho; NamJu ; et al. | 2011-09-15 |
Method Of Manufacture Of Integrated Circuit Packaging System With Multi-tier Conductive Interconnects
App 20110223721 - Cho; NamJu ; et al. | 2011-09-15 |
Semiconductor device and method of forming shielding layer after encapsulation and grounded through interconnect structure
Grant 8,018,034 - Chi , et al. September 13, 2 | 2011-09-13 |
Integrated Circuit Packaging System With Encapsulation And Method Of Manufacture Thereof
App 20110215450 - Chi; HeeJo ; et al. | 2011-09-08 |
Integrated Circuit Package System With Package Stacking And Method Of Manufacture Thereof
App 20110215448 - Cho; NamJu ; et al. | 2011-09-08 |
Integrated Circuit Packaging System With Shield And Method Of Manufacture Thereof
App 20110204494 - Chi; HeeJo ; et al. | 2011-08-25 |
Semiconductor Device and Method of Forming Thin Profile WLCSP with Vertical Interconnect over Package Footprint
App 20110186977 - Chi; HeeJo ; et al. | 2011-08-04 |
Integrated Circuit Packaging System With Stacking Interconnect And Method Of Manufacture Thereof
App 20110140259 - Cho; NamJu ; et al. | 2011-06-16 |
Integrated circuit packaging system with multi-tier conductive interconnects and method of manufacture thereof
Grant 7,928,552 - Cho , et al. April 19, 2 | 2011-04-19 |
Integrated Circuit Packaging System With Package-on-package And Method Of Manufacture Thereof
App 20110068464 - Chi; HeeJo ; et al. | 2011-03-24 |
Semiconductor Device and Method of Forming Open Cavity in TSV Interposer to Contain Semiconductor Die in WLCSMP
App 20110068444 - Chi; HeeJo ; et al. | 2011-03-24 |
Integrated Circuit Packaging System With Encapsulated Via And Method Of Manufacture Thereof
App 20110068453 - Cho; NamJu ; et al. | 2011-03-24 |
Integrated Circuit Packaging System With Package-on-package And Method Of Manufacture Thereof
App 20110062574 - Jang; Ki Youn ; et al. | 2011-03-17 |
Semiconductor Device and Method of Forming Pre-Molded Semiconductor Die Having Bumps Embedded in Encapsulant
App 20110049695 - Shin; HanGil ; et al. | 2011-03-03 |
Integrated Circuit Packaging System With Through Silicon Via Base And Method Of Manufacture Thereof
App 20110024887 - Chi; HeeJo ; et al. | 2011-02-03 |
Integrated circuit packaging system with a tiered substrate package and method of manufacture thereof
Grant 7,863,735 - Cho , et al. January 4, 2 | 2011-01-04 |
Semiconductor Device and Method of Forming Shielding Layer After Encapsulation and Grounded Through Interconnect Structure
App 20100276792 - Chi; HeeJo ; et al. | 2010-11-04 |
Integrated Circuit Packaging System With An Integral-interposer-structure And Method Of Manufacture Thereof
App 20100244223 - Cho; NamJu ; et al. | 2010-09-30 |
Integrated Circuit Packaging System With Dual Sided Connection And Method Of Manufacture Thereof
App 20100237481 - Chi; HeeJo ; et al. | 2010-09-23 |
Integrated Circuit Packaging System With An Interposer And Method Of Manufacture Thereof
App 20100237483 - Chi; HeeJo ; et al. | 2010-09-23 |
Base Package System For Integrated Circuit Package Stacking And Method Of Manufacture Thereof
App 20100123247 - Ko; WonJun ; et al. | 2010-05-20 |
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