Cho; Moon Gi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Cho; Moon Gi.The latest application filed is for "substrate transferring system".

Company Profile

8.19.29

Cho; Moon Gi - Gyeonggi-do KR
Cho; Moon Gi - Anyang-si KR
Cho; Moon Gi - Seoul KR
CHO; Moon Gi - Gunpo-si KR
Cho; Moon-Gi - Suwon-si KR
Cho; Moon-Gi - Hwasung KR
CHO; Moon-Gi - Hwasung-City KR
CHO; Moon Gi - Daejeon KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Substrate Transferring System App 20220274264 - Cho; Moon Gi ; et al.	2022-09-01
Semiconductor Devices App 20210167063 - Cho; Moon Gi ; et al.	2021-06-03
Semiconductor devices having multi-level metallization structures Grant 10,930,648 - Cho , et al. February 23, 2	2021-02-23
Printed circuit board having insulating metal oxide layer covering connection pad Grant 10,770,384 - Park , et al. Sep	2020-09-08
Semiconductor device Grant 10,636,785 - Jun , et al.	2020-04-28
Substrate processing system Grant 10,518,382 - Kweon , et al. Dec	2019-12-31
Semiconductor device Grant 10,453,838 - Jun , et al. Oc	2019-10-22
Semiconductor Devices App 20190287965 - Cho; Moon Gi ; et al.	2019-09-19
Semiconductor Device App 20190252372 - Jun; Hwichan ; et al.	2019-08-15
Semiconductor devices Grant 10,347,627 - Cho , et al. July 9, 2	2019-07-09
Semiconductor device and method of fabricating the same Grant 10,211,089 - Cho , et al. Feb	2019-02-19
Semiconductor Devices App 20180366463 - Cho; Moon Gi ; et al.	2018-12-20
Printed Circuit Board, And Semiconductor Package Including The Same App 20180247887 - PARK; Soo-jae ; et al.	2018-08-30
Semiconductor Device App 20180130796 - JUN; Hwichan ; et al.	2018-05-10
Semiconductor Device And Method Of Fabricating The Same App 20180082890 - CHO; Moon Gi ; et al.	2018-03-22
Substrate Processing System App 20170320188 - Kweon; Young Kyu ; et al.	2017-11-09
Substrate cleaning apparatus and method and brush assembly used therein Grant 9,704,729 - Cho , et al. July 11, 2	2017-07-11
Package Substrate And Methods For Manufacturing The Same App 20160329275 - PARK; Soojae ; et al.	2016-11-10
Semiconductor device having fuse pattern Grant 9,449,918 - Cho , et al. September 20, 2	2016-09-20
Bump structures having an extension Grant 9,312,213 - Cho , et al. April 12, 2	2016-04-12
Semiconductor packages having through electrodes and methods for fabricating the same Grant 9,245,771 - Chung , et al. January 26, 2	2016-01-26
Wafer Polishing Method App 20150364387 - CHO; Moon-gi ; et al.	2015-12-17
Semiconductor Device Having Fuse Pattern App 20150325518 - CHO; Moon-Gi ; et al.	2015-11-12
Semiconductor device having fuse pattern Grant 9,123,725 - Cho , et al. September 1, 2	2015-09-01
Solder collapse free bumping process of semiconductor device Grant 8,980,739 - Cho , et al. March 17, 2	2015-03-17
Multi-chip package and method of manufacturing the same Grant 8,928,150 - Cho , et al. January 6, 2	2015-01-06
Bump structure, having concave lateral sides, semiconductor package having the bump structure, and method of forming the bump structure Grant 8,922,008 - Myung , et al. December 30, 2	2014-12-30
Semiconductor Packages Having Through Electrodes And Methods For Fabricating The Same App 20140377909 - CHUNG; Hyunsoo ; et al.	2014-12-25
Substrate Cleaning Apparatus And Method And Brush Assembly Used Therein App 20140366913 - CHO; Moon Gi ; et al.	2014-12-18
Semiconductor Device Having Fuse Pattern App 20140151845 - CHO; Moon-Gi ; et al.	2014-06-05
Semiconductor assembly and semiconductor package including a solder channel Grant 8,710,657 - Park , et al. April 29, 2	2014-04-29
Bump Structures, Electrical Connection Structures, And Methods Of Forming The Same App 20140084457 - CHO; Moon Gi ; et al.	2014-03-27
Multi-chip Package And Method Of Manufacturing The Same App 20140015145 - CHO; Moon-Gi ; et al.	2014-01-16
Bump Structure, Semiconductor Package Having The Bump Structure, And Method Of Forming The Bump Structure App 20130292822 - MYUNG; Jong-Yun ; et al.	2013-11-07
Semiconductor Package App 20130256876 - LEE; Ui-hyoung ; et al.	2013-10-03
Methods Of Forming Connection Bump Of Semiconductor Device App 20130082090 - CHO; Moon-gi ; et al.	2013-04-04
Semiconductor Chip And Flip-chip Package Comprising The Same App 20130009286 - Kim; Young-lyong ; et al.	2013-01-10
Solder Collapse Free Bumping Process Of Semiconductor Device App 20120295434 - CHO; Moon-gi ; et al.	2012-11-22
Method For Manufacturing Semiconductor Package And Semiconductor Package Manufactured Using The Same App 20120129333 - YIM; Ha-Young ; et al.	2012-05-24
Semiconductor Assembly And Semiconductor Package Including A Solder Channel App 20120086123 - PARK; JEONG-WOO ; et al.	2012-04-12
JOINT RELIABILITY OF SOLDER JOINT BETWEEN Sn-yAg SOLDER AND Ni-P UNDER BUMP METALLIC LAYER BY COBALT ADDITION App 20090212422 - LEE; Hyuck Mo ; et al.	2009-08-27

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