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name:-0.005612850189209
name:-0.0013911724090576
Cho; Kyoung-Bok Patent Filings

Cho; Kyoung-Bok

Patent Applications and Registrations

Patent applications and USPTO patent grants for Cho; Kyoung-Bok.The latest application filed is for "bonding apparatus".

Company Profile
1.4.8
  • Cho; Kyoung-Bok - Cheonan-si KR
  • Cho; Kyoung-Bok - Chungcheongnam-do KR
  • Cho, Kyoung Bok - Cheonan-city KR
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Apparatus for correcting a parallelism between a bonding head and a stage, and a chip bonder including the same
Grant 10,692,833 - Kim , et al.
2020-06-23
Bonding Apparatus
App 20180229329 - KIM; MYUNG IL ;   et al.
2018-08-16
Solder ball mounter
Grant 10,016,833 - Lee , et al. July 10, 2
2018-07-10
Apparatus For Correcting A Parallelism Between A Bonding Head And A Stage, And A Chip Bonder Including The Same
App 20180102340 - KIM; Jae-Cheol ;   et al.
2018-04-12
Solder Ball Mounter
App 20150001278 - LEE; SEOK-YONG ;   et al.
2015-01-01
Apparatus For Semiconductor Die Bonding
App 20110079361 - Park; Byeong-kuk ;   et al.
2011-04-07
In-line die attaching and curing apparatus for a multi-chip package
Grant 7,074,646 - Kim , et al. July 11, 2
2006-07-11
In-line die attaching and curing apparatus for a multi-chip package
App 20050106778 - Kim, Hyun-Ho ;   et al.
2005-05-19
In-line die attaching and curing apparatus for a multi-chip package
Grant 6,863,109 - Kim , et al. March 8, 2
2005-03-08
In-line die attaching and curing apparatus for a multi-chip package
App 20040108582 - Kim, Hyun-Ho ;   et al.
2004-06-10
Dual die bonder for a semiconductor device and a method thereof
App 20030145939 - Ahn, Seung Chul ;   et al.
2003-08-07
Apparatus For Cutting Adhesive Tape Mounted On Semiconductor Wafer
App 20010002569 - LEE, SUNG HO ;   et al.
2001-06-07

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