| Patent | Date |
|---|
Semiconductor Package
App 20210225782 - Cho; Kyong Soon | 2021-07-22 |
Semiconductor package
Grant 10,978,409 - Cho April 13, 2 | 2021-04-13 |
Printed circuit board, semiconductor package including the printed circuit board, and method of manufacturing the printed circuit board
Grant 10,672,694 - Kim , et al. | 2020-06-02 |
Semiconductor package
Grant 10,600,729 - Cho , et al. | 2020-03-24 |
Semiconductor Package
App 20190221513 - CHO; Kyong Soon ; et al. | 2019-07-18 |
Semiconductor Package
App 20190206807 - CHO; Kyong Soon | 2019-07-04 |
Semiconductor package
Grant 10,262,933 - Cho , et al. | 2019-04-16 |
Semiconductor Package
App 20180337120 - CHO; Kyong Soon ; et al. | 2018-11-22 |
Package for processing sensed-data, sensed-data processor, and system for processing sensed-data
Grant 10,105,102 - Umemoto , et al. October 23, 2 | 2018-10-23 |
Wafer level package
Grant 9,865,552 - Ryu , et al. January 9, 2 | 2018-01-09 |
Semiconductor device and method of manufacturing the same
Grant 9,728,497 - Kim , et al. August 8, 2 | 2017-08-08 |
Printed Circuit Board, Semiconductor Package Including The Printed Circuit Board, And Method Of Manufacturing The Printed Circuit Board
App 20170207155 - KIM; Dong-suk ; et al. | 2017-07-20 |
Semiconductor Device And Method Of Manufacturing The Same
App 20170011992 - KIM; Yu-duk ; et al. | 2017-01-12 |
Wafer Level Package
App 20160365319 - RYU; Han-Sung ; et al. | 2016-12-15 |
Chip On Film Package And Display Device Including The Same
App 20160162091 - HA; JEONG-KYU ; et al. | 2016-06-09 |
Chip-on-film package and device assembly including the same
Grant 9,305,990 - Jung , et al. April 5, 2 | 2016-04-05 |
Chip on film package and display device including the same
Grant 9,280,182 - Ha , et al. March 8, 2 | 2016-03-08 |
Package For Processing Sensed-data, Sensed-data Processor, And System For Processing Sensed-data
App 20160051197 - UMEMOTO; Mitsuo ; et al. | 2016-02-25 |
Tape wiring substrate and chip-on-film package including the same
Grant 9,113,545 - Han , et al. August 18, 2 | 2015-08-18 |
Chip on film (COF) substrate, COF package and display device including the same
Grant 9,059,162 - Ha , et al. June 16, 2 | 2015-06-16 |
Semiconductor chip and film and tab package comprising the chip and film
Grant 8,952,510 - Cho , et al. February 10, 2 | 2015-02-10 |
Chip-on-film Package And Device Assembly Including The Same
App 20140300849 - JUNG; JAE-MIN ; et al. | 2014-10-09 |
Chip On Film Package And Display Device Including The Same
App 20140246687 - Ha; Jeong-Kyu ; et al. | 2014-09-04 |
Semiconductor package
Grant 8,803,301 - Cho , et al. August 12, 2 | 2014-08-12 |
Semiconductor Chip And Film And Tab Package Comprising The Chip And Film
App 20140084430 - Cho; Young-Sang ; et al. | 2014-03-27 |
Chip on Film (COF) Substrate, COF Package and Display Device Including the Same
App 20140054793 - Ha; Jeong-Kyu ; et al. | 2014-02-27 |
Semiconductor chip package
Grant 8,629,547 - Cho , et al. January 14, 2 | 2014-01-14 |
Semiconductor chip and film and TAB package comprising the chip and film
Grant 8,575,735 - Cho , et al. November 5, 2 | 2013-11-05 |
Semiconductor Package Having A Conductive Layer For Electrostatic Discharge And Display Device Including The Same
App 20130240917 - Cho; Kyong soon ; et al. | 2013-09-19 |
Flip Chip Package And Method Of Manufacturing The Same
App 20130234310 - Youn; Han-Shin ; et al. | 2013-09-12 |
Tape Wiring Substrate And Chip-on-film Package Including The Same
App 20130148312 - Han; Sang-Uk ; et al. | 2013-06-13 |
Semiconductor Package
App 20120274868 - Cho; Kyong-soon ; et al. | 2012-11-01 |
Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the same
Grant 8,222,089 - Choi , et al. July 17, 2 | 2012-07-17 |
Semiconductor Chip Package
App 20120074540 - CHO; Kyong-Soon ; et al. | 2012-03-29 |
Semiconductor Chip And Film And Tab Package Comprising The Chip And Film
App 20110210433 - Cho; Young-Sang ; et al. | 2011-09-01 |
Tape For Heat Dissipating Member, Chip On Film Type Semiconductor Package Including Heat Dissipating Member, And Electronic Apparatus Including The Same
App 20110143625 - Choi; Kyoung-sei ; et al. | 2011-06-16 |
Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the same
Grant 7,915,727 - Choi , et al. March 29, 2 | 2011-03-29 |
Method of manufacturing a wiring substrate, method of manufacturing a tape package and method of manufacturing a display device
App 20100005652 - Kim; Dong-Han ; et al. | 2010-01-14 |
Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and elctronic apparatus including the same
App 20090273076 - CHOI; Kyong-sei ; et al. | 2009-11-05 |
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