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name:-0.01484203338623
name:-0.0078089237213135
name:-0.00037693977355957
Cho; Kuo-Yao Patent Filings

Cho; Kuo-Yao

Patent Applications and Registrations

Patent applications and USPTO patent grants for Cho; Kuo-Yao.The latest application filed is for "exposure method".

Company Profile
0.8.10
  • Cho; Kuo-Yao - Da-An Shiang N/A TW
  • Cho; Kuo-Yao - Taichung County TW
  • Cho; Kuo-Yao - Taipei TW
  • Cho; Kuo-Yao - Da-An Township Taichung County TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Lithography resolution improving method
Grant 8,658,051 - Cho , et al. February 25, 2
2014-02-25
Exposure method
Grant 7,998,660 - Shih , et al. August 16, 2
2011-08-16
Method of forming a trench capacitor
Grant 7,915,133 - Cho , et al. March 29, 2
2011-03-29
Exposure method
Grant 7,892,712 - Shih , et al. February 22, 2
2011-02-22
Method for forming ring pattern
Grant 7,799,512 - Cho , et al. September 21, 2
2010-09-21
Photomask layout pattern
Grant 7,776,496 - Cho August 17, 2
2010-08-17
Patterning method for a semiconductor substrate
Grant 7,713,882 - Huang , et al. May 11, 2
2010-05-11
Exposure Method
App 20100009294 - Shih; Chiang-Lin ;   et al.
2010-01-14
Exposure Method
App 20090290134 - Shih; Chiang-Lin ;   et al.
2009-11-26
Lithography Resolution Improving Method
App 20090233448 - CHO; Kuo-Yao ;   et al.
2009-09-17
Method Of Forming Iso Space Pattern
App 20090155733 - Cho; Kuo-Yao ;   et al.
2009-06-18
Pattering method for a semiconductor substrate
App 20090149024 - Huang; Chien-Er ;   et al.
2009-06-11
Exposure Method
App 20090111060 - Shih; Chiang-Lin ;   et al.
2009-04-30
Photomask Layout Pattern
App 20090029267 - Cho; Kuo-Yao
2009-01-29
Method Of Forming A Trench Capacitor
App 20080286934 - CHO; Kuo-Yao ;   et al.
2008-11-20
Metal Interconnect Structure
App 20080251933 - Cho; Kuo-Yao ;   et al.
2008-10-16
Method For Forming Ring Pattern
App 20080206684 - CHO; Kuo-Yao ;   et al.
2008-08-28

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