Cho; Jeonghun

Patent Applications and Registrations

Patent applications and USPTO patent grants for Cho; Jeonghun.The latest application filed is for "semiconductor package".

Company Profile

2.7.10

Cho; Jeonghun - Goyang-si KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Pressurizing members for semiconductor package Grant 11,362,021 - Choi , et al. June 14, 2	2022-06-14
Semiconductor Package App 20220148998 - CHOI; Yun Hwa ; et al.	2022-05-12
Heat sink board for a semiconductor device Grant 11,289,397 - Choi , et al. March 29, 2	2022-03-29
Semiconductor package Grant 11,270,969 - Choi , et al. March 8, 2	2022-03-08
Heat sink board, manufacturing method thereof, and semiconductor package including the same Grant 11,171,074 - Choi , et al. November 9, 2	2021-11-09
Pressurized Semiconductor Package And Method Of Manufacturing The Same App 20210280501 - CHOI; Yun Hwa ; et al.	2021-09-09
Semiconductor Package And Method Of Manufacturing The Same App 20210249342 - CHOI; Yun Hwa ; et al.	2021-08-12
Pressing-type semiconductor power device package Grant 11,056,420 - Choi , et al. July 6, 2	2021-07-06
Heat Sink Board, Manufacturing Method Thereof, And Semiconductor Package Including The Same App 20210143076 - CHOI; Yun Hwa ; et al.	2021-05-13
Heat Sink Board, Manufacturing Method Thereof, And Semiconductor Package Including The Same App 20210118768 - CHOI; Yun Hwa ; et al.	2021-04-22
Semiconductor Package App 20200395264 - CHOI; Yun Hwa ; et al.	2020-12-17
Semiconductor Package App 20200388588 - CHOI; Yun Hwa ; et al.	2020-12-10
Semiconductor chip package having heat dissipating structure Grant 10,438,873 - Choi , et al. O	2019-10-08
Pressing-type Semiconductor Power Device Package App 20190259686 - CHOI; Yunhwa ; et al.	2019-08-22
Semiconductor chip package having heat dissipating structure Grant 10,204,848 - Choi , et al. Feb	2019-02-12
Semiconductor Chip Package Having Heat Dissipating Structure App 20180233439 - Choi; Yunhwa ; et al.	2018-08-16
Semiconductor Chip Package Having Heat Dissipating Structure App 20180040541 - CHOI; YUNHWA ; et al.	2018-02-08

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