Cho; Jeong Hun

Patent Applications and Registrations

Patent applications and USPTO patent grants for Cho; Jeong Hun.The latest application filed is for "method of preparing acrylonitrile-based copolymer for carbon fiber".

Company Profile

6.7.11

Cho; Jeong Hun - Daejeon KR
Cho; Jeong Hun - Goyang-si KR
Cho; Jeong Hun - Gyeonggi-do KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method of preparing acrylonitrile-based polymer for producing carbon fiber Grant 11,427,659 - Kim , et al. August 30, 2	2022-08-30
Clip, lead frame, and substrate used in semiconductor package having engraved pattern formed thereon and the semiconductor package comprising the same Grant 11,367,666 - Choi , et al. June 21, 2	2022-06-21
Method for producing acrylonitrile-based fiber Grant 11,286,580 - Kim , et al. March 29, 2	2022-03-29
Method Of Preparing Acrylonitrile-based Copolymer For Carbon Fiber App 20210301051 - KIM; Jong Gil ; et al.	2021-09-30
Acrylonitrile-based Copolymer For Carbon Fiber App 20210230330 - Kim; Chang Hun ; et al.	2021-07-29
Method of preparing (meth)acrylonitrile-based polymer for preparing carbon fiber Grant 11,046,792 - Cho , et al. June 29, 2	2021-06-29
Dispersing Apparatus and Defoaming Apparatus Comprising Same App 20210039021 - Jang; Jung Kee ; et al.	2021-02-11
Multilayer clip structure attached to a chip Grant 10,896,889 - Choi , et al. January 19, 2	2021-01-19
Press-fit pin, semiconductor package having the same and method for manufacturing the press-fit pin Grant 10,855,009 - Choi , et al. December 1, 2	2020-12-01
Method For Producing Acrylonitrile-based Fiber App 20200190701 - KIM; Sang Jin ; et al.	2020-06-18
Press-fit Pin, Semiconductor Package Having The Same And Method For Manufacturing The Press-fit Pin App 20200185845 - Choi; Yun Hwa ; et al.	2020-06-11
Clip, Lead Frame, And Substrate Used In Semiconductor Package Having Engraved Pattern Formed Thereon And The Semiconductor Packa App 20200176342 - CHOI; Yun Hwa ; et al.	2020-06-04
Composite Clip Structure And Semiconductor Package Using The Same App 20200168576 - CHOI; Yun Hwa ; et al.	2020-05-28
Method For Producing Polyacrylonitrile-based Fiber And Polyacrylonitrile-based Copolymer Used Therein App 20200149196 - LEE; Jeong Kyu ; et al.	2020-05-14
Press-fit pin and semiconductor package including the same Grant 10,541,197 - Choi , et al. Ja	2020-01-21
Method Of Preparing Acrylonitrile-based Polymer For Producing Carbon Fiber App 20190375870 - KIM; Chang Hun ; et al.	2019-12-12
Method Of Preparing (meth)acrylonitrile-based Polymer For Preparing Carbon Fiber App 20190315889 - CHO; Jeong Hun ; et al.	2019-10-17
Press-fit Pin And Semiconductor Package Including The Same App 20190139872 - CHOI; Yun Hwa ; et al.	2019-05-09

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