Cho; Jae Choon

Patent Applications and Registrations

Patent applications and USPTO patent grants for Cho; Jae Choon.The latest application filed is for "laminate for printed circuit board and printed circuit board using the same".

Company Profile

0.13.33

Cho; Jae Choon - Suwon-si KR
Cho; Jae Choon - Suwon KR
CHO; Jae Choon - Gyunggi-do KR
Cho; Jae Choon - Gyeonggi-do KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Insulating film and producing method for insulating film Grant 9,318,234 - Lee , et al. April 19, 2	2016-04-19
Conductive paste composition for external electrode and multilayer ceramic electronic component fabricated using the same Grant 9,202,624 - Cho , et al. December 1, 2	2015-12-01
Insulating Film For Printed Circuit Board And Products Having The Same App 20150053458 - Lee; Choon Keun ; et al.	2015-02-26
Laminate for Printed Circuit Board and Printed Circuit Board Using The Same App 20150056472 - LEE; Chung Hee ; et al.	2015-02-26
Method for manufacturing printed circuit board including flame retardant insulation layer Grant 8,840,967 - Cho , et al. September 23, 2	2014-09-23
Poly(p-xylylene)-based polymer having low dielectric constant and low-loss property and insulating material, printed circuit board and functional element using the same Grant 8,829,155 - Cho , et al. September 9, 2	2014-09-09
Insulating Film And Producing Method For Insulating Film App 20140065413 - LEE; Chung Hee ; et al.	2014-03-06
Apparatus For Measuring Drying Rate And Method For Measuring Drying Rate Using The Same App 20140041445 - Chun; Hee Sun ; et al.	2014-02-13
Insulator For Build-up Pcb And Method Of Manufacturing Pcb Using The Same App 20140037889 - JANG; Jong-Yoon ; et al.	2014-02-06
Insulation Film Having Metal Layer App 20140017487 - Chun; Hee Sun ; et al.	2014-01-16
Epoxy Resin Composition For Build-up Insulating Film, Insulating Film Formed Therefrom, And Multilayer Printed Circuit Board Having The Same App 20140014402 - Cho; Jae Choon ; et al.	2014-01-16
Conductive Paste Composition For External Electrode And Multilayer Ceramic Electronic Component Fabricated Using The Same App 20130329336 - CHO; Jae Choon ; et al.	2013-12-12
Curable cyclic phosphazene compound and method of preparing the same Grant 8,431,656 - Cho , et al. April 30, 2	2013-04-30
Flame retardant resin composition for multilayer wiring board and multilayer wiring board including the same Grant 8,309,636 - Jung , et al. November 13, 2	2012-11-13
Method for manufacturing printed circuit board using imprinting Grant 8,216,503 - Cho , et al. July 10, 2	2012-07-10
Printed Circuit Board And Method Of Manufacturing The Same App 20120125667 - JUNG; Hyung Mi ; et al.	2012-05-24
Flame Retardant Resin Composition For Multilayer Wiring Board And Multilayer Wiring Board Including The Same App 20120111618 - Jung; Hyung Mi ; et al.	2012-05-10
Photosensitive composite and build-up insulation film with the photosensitive composite, and method for manufacturing circuit board using the build-up insulation film App 20120103507 - Cho; Jae Choon ; et al.	2012-05-03
Radiating substrate and method for manufacturing the radiating substrate, and luminous element package with the radiating substrate App 20120074430 - Lee; Kyu Sang ; et al.	2012-03-29
Polymer Resin Composition, Insulating Film Manufactured Using The Polymer Resin Composition, And Method Of Manufacturing The Insulating Film App 20120077039 - LEE; Kyu Sang ; et al.	2012-03-29
Method For Manufacturing Printed Circuit Board Including Flame Retardant Insulation Layer App 20120064231 - Cho; Jae-Choon ; et al.	2012-03-15
Insulating resin composition and printed circuit substrate using the same App 20110317382 - Cho; Jae Choon ; et al.	2011-12-29
Color electronic paper display device and method for manufacturing the same App 20110298786 - Cho; Jae Choon ; et al.	2011-12-08
Curable Cyclic Phosphazene Compound And Method Of Preparing The Same App 20110028584 - CHO; Jae Choon ; et al.	2011-02-03
Resin Composition For Printed Circuit Board and Printed Circuit Board Using The Same App 20100270065 - Cho; Jae Choon ; et al.	2010-10-28
Resin Composition For Printed Circuit Board And Printed Circuit Board Using The Same App 20100270064 - Cho; Jae Choon ; et al.	2010-10-28
Norbornene-based Polymer Having Low Dielectric Constant And Low-loss Properties And Insulating Material Using The Same App 20100210803 - CHO; Jae-Choon ; et al.	2010-08-19
Norbornene-based Polymer Having Low Dielectric Constant And Low-loss Properties, And Insulating Material, Printed Circuit Board And Function Element Using The Same App 20100063226 - Cho; Jae-Choon ; et al.	2010-03-11
Poly(p-xylylene)-based Polymer Having Low Dielectric Constant And Low-loss Property And Insulating Material, Printed Circuit Board And Functional Element Using The Same App 20100048858 - CHO; Jae-Choon ; et al.	2010-02-25
Method of manufacturing printed circuit board using imprinting process Grant 7,666,292 - Cho , et al. February 23, 2	2010-02-23
Manufacturing method for imprinting stamper Grant 7,644,496 - Kwak , et al. January 12, 2	2010-01-12
Method of manufacturing printed circuit board for fine circuit formation Grant 7,562,447 - Lee , et al. July 21, 2	2009-07-21
Flame Retardant Resin Composition For Printed Circuit Board, Printed Circuit Board Using The Same And Manufacturing Method Thereof App 20090072207 - CHO; Jae-Choon ; et al.	2009-03-19
Manufacturing method for imprinting stamper App 20080086877 - Kwak; Jeong-Bok ; et al.	2008-04-17
Flame retardant resin composition for printed circuit board and printed circuit board using the same App 20080090084 - Cho; Jae-Choon ; et al.	2008-04-17
Method of manufacturing a broad stamper App 20080057444 - Ra; Seung-Hyun ; et al.	2008-03-06
Method for manufacturing printed circuit board App 20080034581 - Ra; Seung-Hyun ; et al.	2008-02-14
Method for manufacturing printed circuit board App 20080012168 - Ra; Senug-Hyun ; et al.	2008-01-17
Method for manufacturing printed circuit board using imprinting App 20080008824 - Cho; Jae-Choon ; et al.	2008-01-10
Method of manufacturing printed circuit board for fine circuit formation App 20070264755 - Lee; Choon Keun ; et al.	2007-11-15
Method of fabricating printed circuit board using imprinting process App 20070020397 - Cho; Jae Choon ; et al.	2007-01-25
Method of manufacturing printed circuit board using imprinting process App 20060240360 - Cho; Jae Choon ; et al.	2006-10-26
Imprinting mold for printed circuit board having excellent durability and method of manufacturing printed circuit board using the same App 20060222833 - Maeng; Il Sang ; et al.	2006-10-05

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