Cho; Chongkun

Patent Applications and Registrations

Patent applications and USPTO patent grants for Cho; Chongkun.The latest application filed is for "structure of hinge for foldable electronic device, and electronic device including the same".

Company Profile

9.7.10

Cho; Chongkun - Suwon-si KR
CHO; Chongkun - Gyeonggi-do KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Housing and electronic device including the same Grant 11,452,220 - Cho , et al. September 20, 2	2022-09-20
Electronic device with bonding structure Grant 11,402,872 - Park , et al. August 2, 2	2022-08-02
Electronic device including display Grant 11,402,875 - Cho , et al. August 2, 2	2022-08-02
Structure Of Hinge For Foldable Electronic Device, And Electronic Device Including The Same App 20220011827 - KIM; Jaehee ; et al.	2022-01-13
Electronic Device Including Housing And Method For Manufacturing The Housing App 20210303028 - CHO; Chongkun ; et al.	2021-09-30
Electronic device including housing and method for manufacturing the housing Grant 11,036,255 - Cho , et al. June 15, 2	2021-06-15
Housing And Electronic Device Including The Same App 20210144866 - CHO; Chongkun ; et al.	2021-05-13
Electronic Device With Bonding Structure App 20210089085 - PARK; Daehyeong ; et al.	2021-03-25
Electronic Device And Electronic Device Housing Structure App 20210037126 - YOO; Minwoo ; et al.	2021-02-04
Housing and electronic device including the same Grant 10,897,827 - Cho , et al. January 19, 2	2021-01-19
Electronic device with bonding structure Grant 10,860,061 - Park , et al. December 8, 2	2020-12-08
Electronic Device Including Housing And Method For Manufacturing The Housing App 20200379512 - Cho; Chongkun ; et al.	2020-12-03
Electronic Device Including Display App 20200333849 - Cho; Chongkun ; et al.	2020-10-22
Electronic device including housing and method for manufacturing the housing Grant 10,768,664 - Cho , et al. Sep	2020-09-08
Housing And Electronic Device Including The Same App 20200253064 - Kind Code	2020-08-06
Electronic Device With Bonding Structure App 20200183455 - PARK; Daehyeong ; et al.	2020-06-11
Electronic Device Including Housing And Method For Manufacturing The Housing App 20190317553 - CHO; Chongkun ; et al.	2019-10-17

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