Cho; Chong Ho
Patent Applications and Registrations
Patent applications and USPTO patent grants for Cho; Chong Ho.The latest application filed is for "semiconductor packages having interconnection members".
- Cho; Chong Ho - Incheon KR
| Patent | Date |
|---|---|
| Semiconductor packages having interconnection members Grant 9,668,344 - Jung , et al. May 30, 2 | 2017-05-30 |
| Semiconductor Packages Having Interconnection Members App 20160316559 - JUNG; Won Duck ; et al. | 2016-10-27 |
| Semiconductor packages with optical transceivers Grant 9,397,757 - Hwang , et al. July 19, 2 | 2016-07-19 |
| Semiconductor Packages With Optical Transceivers App 20150222364 - HWANG; In Chul ; et al. | 2015-08-06 |
| Semiconductor packages including semiconductor chips having protrusions and methods of fabricating the same Grant 9,093,441 - Kim , et al. July 28, 2 | 2015-07-28 |
| Methods for forming interconnection line using screen printing technique Grant 8,951,810 - Lee , et al. February 10, 2 | 2015-02-10 |
| Semiconductor Packages Including Semiconductor Chips Having Protrusions And Methods Of Fabricating The Same App 20140175638 - KIM; Ji Eun ; et al. | 2014-06-26 |
| Methods For Forming Interconnection Line Using Screen Printing Technique App 20140057369 - LEE; Kyu Won ; et al. | 2014-02-27 |
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