Cho; Ching-Wen

Patent Applications and Registrations

Patent applications and USPTO patent grants for Cho; Ching-Wen.The latest application filed is for "method for reducing fluorine induced defects on a bonding pad surface".

Company Profile

0.9.2

Cho; Ching-Wen - Taipei TW
Cho; Ching-Wen - Industrial Pk. TW
Cho; Ching-Wen - Chu-San TW
Cho; Ching-Wen - Nan-Tao TW
Cho; Ching-Wen - Nan-Tow TW
Cho, Ching-Wen - Industrial Park TW
Cho, Ching-Wen - Chu-San Town TW
Cho; Ching-Wen - Nan Tou TW
Cho; Ching-Wen - Chu-Shan TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for forming corrosion inhibited conductor layer Grant 6,682,659 - Cho , et al. January 27, 2	2004-01-27
Method for reducing fluorine induced defects on a bonding pad surface Grant 6,660,624 - Tzeng , et al. December 9, 2	2003-12-09
Buried photodiode structure for CMOS image sensor Grant 6,627,475 - Yang , et al. September 30, 2	2003-09-30
Implant method for forming Si3N4 spacer Grant 6,624,466 - Chen , et al. September 23, 2	2003-09-23
Twin-bit memory cell having shared word lines and shared bit-line contacts for electrically erasable and programmable read-only memory (EEPROM) and method of manufacturing the same Grant 6,620,683 - Lin , et al. September 16, 2	2003-09-16
Method for reducing fluorine induced defects on a bonding pad surface App 20030153196 - Tzeng, Jiann-Tyng ; et al.	2003-08-14
Implant method for forming Si3N4 spacer App 20020110972 - Chen, Sen-Fu ; et al.	2002-08-15
Implant method for forming Si3N4 spacer Grant 6,380,030 - Chen , et al. April 30, 2	2002-04-30
Method and system for on-line monitoring plasma chamber condition by comparing intensity of certain wavelength Grant 6,157,867 - Hwang , et al. December 5, 2	2000-12-05
Method of manufacturing CMOS image sensor leakage free with double layer spacer Grant 6,071,826 - Cho , et al. June 6, 2	2000-06-06
Method of stripping photoresist from Al bonding pads that prevents corrosion Grant 6,006,764 - Chu , et al. December 28, 1	1999-12-28

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