CHO; Byeong-yeon

Patent Applications and Registrations

Patent applications and USPTO patent grants for CHO; Byeong-yeon.The latest application filed is for "package-on-package (pop) semiconductor package and electronic system including the same".

Company Profile

2.10.13

CHO; Byeong-yeon - Suwon-si KR
CHO; Byeong-yeon - Yeongtong-gu KR
Cho; Byeong-Yeon - Yongin-si KR
Cho; Byeong-Yeon - Gyeonggi-do KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Package-on-package (pop) Semiconductor Package And Electronic System Including The Same App 20210242186 - KIM; Tong-suk ; et al.	2021-08-05
Package-on-package (PoP) semiconductor package and electronic system including the same Grant 10,971,484 - Kim , et al. April 6, 2	2021-04-06
Package-on-package (pop) Semiconductor Package And Electronic System Including The Same App 20200294979 - KIM; Tong-suk ; et al.	2020-09-17
Package-on-package (PoP) semiconductor package and electronic system including the same Grant 10,692,846 - Kim , et al.	2020-06-23
Stack package and method of manufacturing the stack package Grant 10,546,844 - Kim , et al. Ja	2020-01-28
Package-on-package (pop) Semiconductor Package And Electronic System Including The Same App 20190139946 - KIM; Tong-suk ; et al.	2019-05-09
Stack Package And Method Of Manufacturing The Stack Package App 20170154878 - Kim; Jae-Choon ; et al.	2017-06-01
Semiconductor device having markings and package on package including the same Grant 9,665,122 - Kwon , et al. May 30, 2	2017-05-30
Semiconductor Packages And Methods Of Manufacturing Semiconductor Packages App 20170012025 - KWON; Heung-Kyu ; et al.	2017-01-12
Package On Package And Computing Device Including The Same App 20160099205 - KWON; HEUNG KYU ; et al.	2016-04-07
Semiconductor packages having passive elements mounted thereonto Grant 8,618,671 - Kwon , et al. December 31, 2	2013-12-31
Semiconductor Packages And Methods Of Manufacturing Semiconductor Packages App 20130256916 - KWON; Heung-Kyu ; et al.	2013-10-03
Package on package structure Grant 8,253,228 - Kim , et al. August 28, 2	2012-08-28
Package On Package Structure App 20110241168 - KIM; YONG-HOON ; et al.	2011-10-06
Interposer chip and multi-chip package having the interposer chip Grant 7,928,435 - Park , et al. April 19, 2	2011-04-19
Semiconductor Packages Having Passive Elements Mounted Thereonto App 20110084380 - Kwon; Heung-kyu ; et al.	2011-04-14
Interposer chip and multi-chip package having the interposer chip App 20090272974 - Park; Sung-Yong ; et al.	2009-11-05
Semiconductor package with conductive molding compound and manufacturing method thereof Grant 7,374,969 - Cho , et al. May 20, 2	2008-05-20
Semiconductor package with conductive molding compound and manufacturing method thereof App 20060097404 - Cho; Byeong-Yeon ; et al.	2006-05-11

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