CHO; Bong Ju
Patent Applications and Registrations
Patent applications and USPTO patent grants for CHO; Bong Ju.The latest application filed is for "fan-out semiconductor package".
- CHO; Bong Ju - Hwaseong-si KR
- CHO; Bong Ju - Suwon-si KR
| Patent | Date |
|---|---|
| Fan-out Semiconductor Package App 20220037259 - KANG; Myung Sam ; et al. | 2022-02-03 |
| Semiconductor Package App 20210320058 - KANG; Myung Sam ; et al. | 2021-10-14 |
| Semiconductor package Grant 11,075,152 - Kang , et al. July 27, 2 | 2021-07-27 |
| Fan-out semiconductor package Grant 10,985,127 - Lee , et al. April 20, 2 | 2021-04-20 |
| Semiconductor Package App 20200312757 - KANG; Myung Sam ; et al. | 2020-10-01 |
| Fan-out Semiconductor Package App 20200126942 - LEE; Jeong Ho ; et al. | 2020-04-23 |
| Fan-out semiconductor package Grant 10,522,497 - Lee , et al. Dec | 2019-12-31 |
| Fan-out semiconductor package Grant 10,504,825 - Lee , et al. Dec | 2019-12-10 |
| Fan-out semiconductor package Grant 10,453,788 - Lee , et al. Oc | 2019-10-22 |
| Fan-out semiconductor package Grant 10,347,586 - Kim , et al. July 9, 2 | 2019-07-09 |
| Fan-out Semiconductor Package App 20190172781 - LEE; Jeong Il ; et al. | 2019-06-06 |
| Fan-out Semiconductor Package App 20190164895 - KIM; Jin Su ; et al. | 2019-05-30 |
| Fan-out Semiconductor Package App 20190139876 - LEE; Jeong Il ; et al. | 2019-05-09 |
| Fan-out Semiconductor Package App 20190131270 - LEE; Jeong Ho ; et al. | 2019-05-02 |
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