Chiwata; Nobuhiko

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chiwata; Nobuhiko.The latest application filed is for "magnetic core powder, magnetic core and coil device using it, and method for producing magnetic core powder".

Company Profile

2.8.11

Chiwata; Nobuhiko - Tokyo JP
CHIWATA; Nobuhiko - Minato-ku Tokyo
Chiwata; Nobuhiko - Kitakyushu JP
CHIWATA; Nobuhiko - Kitakyushu-shi JP
Chiwata; Nobuhiko - Matsue JP
Chiwata; Nobuhiko - Yasugi JP
Chiwata; Nobuhiko - Shimane JP
CHIWATA; Nobuhiko - Yasugi-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Fe-based nanocrystalline alloy powder, method of producing the same, Fe-based amorphous alloy powder, and magnetic core Grant 11,170,920 - Ohta , et al. November 9, 2	2021-11-09
Magnetic Core Powder, Magnetic Core And Coil Device Using It, And Method For Producing Magnetic Core Powder App 20210313111 - KATO; Tetsuro ; et al.	2021-10-07
ALLOY POWDER, Fe-BASED NANOCRYSTALLINE ALLOY POWDER AND MAGNETIC CORE App 20210114091 - OHTA; Motoki ; et al.	2021-04-22
Fe-BASED NANOCRYSTALLINE ALLOY POWDER, METHOD OF PRODUCING THE SAME, Fe-BASED AMORPHOUS ALLOY POWDER, AND MAGNETIC CORE App 20200373045 - OHTA; Motoki ; et al.	2020-11-26
CRYSTALLINE Fe-BASED ALLOY POWDER AND METHOD FOR PRODUCING SAME App 20200243238 - KATO; Tetsuro ; et al.	2020-07-30
Method for producing ceramic circuit board Grant 10,104,783 - Chiwata October 16, 2	2018-10-16
Method For Producing Ceramic Circuit Board App 20160192503 - CHIWATA; Nobuhiko	2016-06-30
Semiconductor device including arrangement to control connection height and alignment between a plurity of stacked semiconductor chips Grant 8,368,195 - Tanie , et al. February 5, 2	2013-02-05
Semiconductor device Grant 8,053,908 - Tanie , et al. November 8, 2	2011-11-08
Solder alloy and glass bonded body using the same Grant 7,901,782 - Chiwata , et al. March 8, 2	2011-03-08
Semiconductor Device App 20100193936 - TANIE; Hisashi ; et al.	2010-08-05
Semiconductor Device And Method For Manufacturing The Same App 20100171209 - Tanie; Hisashi ; et al.	2010-07-08
Solder alloy for bonding oxide material, and solder joint using the same Grant 7,744,706 - Yamada , et al. June 29, 2	2010-06-29
Method For Oxide Bonding Using Solder Alloy App 20100147926 - YAMADA; MINORU ; et al.	2010-06-17
Solder Alloy For Oxide Bonding App 20090208363 - Yamada; Minoru ; et al.	2009-08-20
Solder Alloy For Bonding Oxide Material, And Solder Joint Using The Same App 20090104071 - YAMADA; Minoru ; et al.	2009-04-23
Solder Alloy And Glass Bonded Body Using The Same App 20080241552 - CHIWATA; Nobuhiko ; et al.	2008-10-02
Method of producing minute metal balls Grant 6,911,618 - Chiwata June 28, 2	2005-06-28

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