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name:-0.0050690174102783
name:-0.0033621788024902
Chiu; Wei-Lan Patent Filings

Chiu; Wei-Lan

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chiu; Wei-Lan.The latest application filed is for "through substrate via structure and manufacturing method thereof, redistribution layer structure and manufacturing method thereof".

Company Profile
2.4.11
  • Chiu; Wei-Lan - Kaohsiung City TW
  • CHIU; Wei Lan - Taoyuan TW
  • CHIU; Wei Lan - Taipei City TW
  • CHIU; Wei Lan - Taiwan ROC TW
  • Chiu; Wei-Lan - Kaohsiung TW
  • CHIU; Wei-Lan - Hsinchu City TW
  • Chiu; Wei-Lan - Hsinchu TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Through Substrate Via Structure And Manufacturing Method Thereof, Redistribution Layer Structure And Manufacturing Method Thereof
App 20220301980 - Chiu; Wei-Lan ;   et al.
2022-09-22
Compositions For Tungsten Etching Inhibition
App 20220267643 - LAUTER; Michael ;   et al.
2022-08-25
Chemical Mechanical Polishing Of Substrates Containing Copper And Ruthenium
App 20220064485 - GUEVENC; Haci Osman ;   et al.
2022-03-03
Chemical Mechanical Polishing Of Substrates Containing Copper And Ruthenium
App 20220056307 - GUEVENC; Haci Osman ;   et al.
2022-02-24
Chemical Mechanical Polishing Of Substrates Containing Copper And Ruthenium
App 20220049125 - GUEVENC; Haci Osman ;   et al.
2022-02-17
Optical micro-particles detector
Grant 10,520,422 - Chiu , et al. Dec
2019-12-31
Optical Micro-particles Detector
App 20190072476 - Chiu; Wei-Lan ;   et al.
2019-03-07
Preferably oriented nanotwinned Au film, method of preparing the same, and bonding structure comprising the same
Grant 10,161,054 - Chen , et al. Dec
2018-12-25
Preferably Oriented Nanotwinned Au Film, Method Of Preparing The Same, And Bonding Structure Comprising The Same
App 20170321339 - CHEN; Chih ;   et al.
2017-11-09
Preferably oriented nanotwinned Au film, method of preparing the same, and bonding structure comprising the same
Grant 9,758,886 - Chen , et al. September 12, 2
2017-09-12
Preferably Oriented Nanotwinned Au Film, Method Of Preparing The Same, And Bonding Structure Comprising The Same
App 20160046099 - CHEN; Chih ;   et al.
2016-02-18
Preferred Oriented Au Film, Method For Preparing The Same And Bonding Structure Comprising The Same
App 20160024678 - CHEN; Chih ;   et al.
2016-01-28
Electrical connecting element having nano-twinned copper, method of fabricating the same, and electrical connecting structure comprising the same
Grant 8,957,323 - Chen , et al. February 17, 2
2015-02-17
Electrical Connecting Element Having Nano-twinned Copper, Method Of Fabricating The Same, And Electrical Connecting Structure Comprising The Same
App 20140090880 - CHEN; Chih ;   et al.
2014-04-03
Chemical Mechanical Polishing (cmp) Composition Comprising A Non-ionic Surfactant And A Carbonate Salt
App 20140011361 - REICHARDT; Robert ;   et al.
2014-01-09

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