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Patent applications and USPTO patent grants for Chiu; U-Ting.The latest application filed is for "conductive feature of a semiconductor device and method of forming same".
Patent | Date |
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Conductive Feature of a Semiconductor Device and Method of Forming Same App 20220285209 - Chiu; U-Ting ;   et al. | 2022-09-08 |
Semiconductor device and manufacturing method thereof Grant 11,424,185 - Chang , et al. August 23, 2 | 2022-08-23 |
Method Of Breaking Through Etch Stop Layer App 20220172945 - Wang; Yu-Shih ;   et al. | 2022-06-02 |
Method of breaking through etch stop layer Grant 11,276,571 - Wang , et al. March 15, 2 | 2022-03-15 |
Connecting Structure And Method For Forming The Same App 20220051982 - CHIU; U-TING ;   et al. | 2022-02-17 |
Method Of Breaking Through Etch Stop Layer App 20210202238 - Wang; Yu Shih ;   et al. | 2021-07-01 |
Semiconductor Device And Manufacturing Method Thereof App 20210202399 - CHANG; Cheng-Wei ;   et al. | 2021-07-01 |
Semiconductor Device and Method of Manufacture App 20210134660 - Wang; Yu Shih ;   et al. | 2021-05-06 |
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