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Patent applications and USPTO patent grants for Chiu; Tsung-Te.The latest application filed is for "backside metallized compound semiconductor device and method for manufacturing the same".
Patent | Date |
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Method for manufacturing backside metalized compound semiconductor wafer Grant 11,264,231 - Chiu , et al. March 1, 2 | 2022-03-01 |
Backside Metallized Compound Semiconductor Device And Method For Manufacturing The Same App 20210134584 - CHIU; Tsung-Te ;   et al. | 2021-05-06 |
Method For Manufacturing Backside Metalized Compound Semiconductor Wafer App 20200152445 - CHIU; Tsung-Te ;   et al. | 2020-05-14 |
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